摘要:
The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin. At least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I) structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the formula (I) and structural units represented by the formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin, wherein W means a single bond, an alkylene group, —O—, —SO2— or —CO—, Ar1 denotes a divalent aromatic group such as a diphenylmethane group, and Ar2 represents a divalent aromatic group having OH group(s) or COOH groups.
摘要:
The invention provides an adhesive for electronic parts, which satisfies both points of heat resistance and the ability to form an adhesive layer, and of low-temperature adhesive property, and an adhesive tape for electronic parts making use of such an adhesive. The adhesive comprises, as a resin component, two polyimide resins different in glass transition temperature by at least 20° C. from each other, and an epoxy resin. At least one of the two polyimide resins is a reactive polyimide having structural units represented by the following formula (I), structural units represented by the following formula (II) and structural units represented by the following formula (III), the other is a polyimide having structural units represented by the formula (I) and structural units represented by the formula (II), and the reactive polyimide and the epoxy resin are contained in ranges of at least 25 parts by weight and 10 to 100 parts by weight, respectively, per 100 parts by weight of the whole polyimide resin, wherein W means a single bond, an alkylene group, —O—, —SO2— or —CO—, Ar1 denotes a divalent aromatic group such as a diphenylmethane group, and Ar2 represents a divalent aromatic group having OH group(s) or COOH groups.
摘要:
The invention provides an ammonia elimination reagent in solution, comprising a thermo-resistant isocitrate dehydrogenase with prominent stability under conditions at high alkaline pHs. For example, the isocitrate dehydrogenase is preferably derived from the genus Thermus. For an assay system of biological substances generating a reaction product ammonia, an ammonia elimination reagent can be prepared by selecting and using the enzyme; the resulting ammonia elimination reagent can be stored in solution; additionally, the assay system can be designed in combination with both the coenzymes NAD+ and NADP+. The ammonia elimination reagent is novel and can eliminate ammonia in an extremely short time.
摘要:
An adhesive tape for electronic parts of the present invention is characterized by comprising a heat resisting film and an adhesive layer provided on at least a side of said heat resisting film, said adhesive layer contains at least a polyimide comprising 100-30% by mol of at least one of the repeating units represented by the following formulas (1a) and (1b) and 0-70% by mol of at least one of the repeating unit represented by the following formulas (2a) and (2b) and 0.1-15 parts by weight of a silane coupling agent based on 100 parts by weight of said polyimide: wherein Ar represents a specified divalent aromatic group wherein R is an alkylene group having 1 to 10 carbon atoms or —CH2OC6H4—, the methylene group of which attaches to Si, and n means an integer of 1 to 20.
摘要:
The present invention provide a novel polyimide which is soluble in organic solvents and excels in heat resistance, and to a process for producing the polyimide. The polyimide of the present invention comprises a repeating unit represented by the formula (1) and having a number average molecular weight of from 4,000 to 200,000. wherein X is —SO2— or —C(═O)—OCH2CH2O—C(═O)—, and R1, R2, R3 and R4 are independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms.
摘要:
This invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability. The adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas (1) and (2), provided on surface of a heat resistance film or a release film: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, and n means an integer of 1 to 20.
摘要:
A novel polyimide is soluble in organic solvents and excels in heat resistance. The polyimide comprises 95-40 mol % of the repeating unit represented by the formulas (1) and 60-5 mol % of the repeating unit represented by the formula (2) and has a number average molecular weight of 4,000-200,000: ##STR1## wherein X is --SO.sub.2 -- and/or --C(.dbd.O)--OCH.sub.2 CH.sub.2 O--C(.dbd.O)--, Ar is a divalent group containing aromatic rings, and R is an alkylene group having 1-10 carbon atoms or a group: --CH.sub.2 OC.sub.6 H.sub.4 --, and n is an integer of 1-20.
摘要:
An adhesive composition for semiconductor devices contains as essential components (A) epoxy resin, (B) phonolic resin, (C) epoxidized styrene-butadiene-styrene block copolymer and (D) diaminosiloxane compound. The adhesive composition is excellent in heat resistance, thermal cycle test and humidity resistance. An adhesive sheet employing the above adhesive composition is also provided.
摘要:
An adhesive tape for electronic parts which comprises a metal substrate and an adhesive layer A and an adhesive layer B laminated in order on at least one side of said metal substrate, wherein said adhesive A comprises a polyimide consisting of 100 -20% by mol of the repeating unit represented by the following formula (1a) and 0-80% by mol of the repeating unit represented by the following formula (1b), said adhesive B comprises a polyimide consisting of 100-40% by mol of the repeating unit represented by the following formula (1a) and 0-60% by mol of the repeating unit represented by the following formula (2), and the adhesive layer A and the adhesive layer B have each a different glass transition temperature: ##STR1## wherein Ar represents a divalent group selected from the specified structures containing aromatic rings, R is an alkylene group having 1 to 10 carbon atoms or --CH.sub.2 OC.sub.6 H.sub.4 --, the methylene group of which attaches to Si, and n means an integer of 1 to 20.
摘要:
A composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, is disclosed. A process for producing a composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, which comprises subjecting a conjugated compound to electropolymerization or oxidation polymerization in the presence of a paper, is also disclosed. A process for producing a functional composite, which comprises impregnating a paper with a solution of a precursor polymer of a conjugated electroconducting polymer and heat treating the paper to form a conjugated electroconducting polymer between or on surface of fibers of the paper, is further disclosed.