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公开(公告)号:US11996142B2
公开(公告)日:2024-05-28
申请号:US18318417
申请日:2023-05-16
申请人: Kioxia Corporation
发明人: Kosuke Yanagidaira
IPC分类号: G11C11/34 , G11C11/56 , G11C16/04 , G11C16/10 , G11C16/34 , H01L25/065 , H10B41/27 , H10B43/27
CPC分类号: G11C11/5628 , G11C11/5671 , G11C16/0483 , G11C16/10 , G11C16/3459 , H01L25/0657 , H01L2225/06506 , H01L2225/06562 , H10B41/27 , H10B43/27
摘要: A semiconductor storage device includes a memory transistor and a word line connected to a gate electrode of the memory transistor. When a write sequence is interrupted before a k+1th verification operation is ended after a kth verification operation is ended in the nth write loop of the write sequence, a voltage equal to or higher than a verification voltage corresponding to a first verification operation in the nth write loop is supplied to the word line before start of the k+1th verification operation after resumption of the write sequence. A time from the resumption of the write sequence to the start of the k+1th verification operation is shorter than a time from start of the first verification operation to end of the kth verification operation in the nth write loop.
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公开(公告)号:US11876647B2
公开(公告)日:2024-01-16
申请号:US17857022
申请日:2022-07-03
申请人: KIOXIA CORPORATION
IPC分类号: H04L25/02 , G11C29/02 , G11C11/4093 , G11C7/10 , G11C11/16 , G11C11/409 , H03K19/00 , H03K19/17764
CPC分类号: H04L25/0278 , G11C7/1057 , G11C11/1673 , G11C11/409 , G11C11/4093 , G11C29/022 , G11C29/028 , H03K19/0005 , H03K19/17764 , G11C2207/105 , G11C2207/2254
摘要: A semiconductor device includes a first chip and a second chip. The first chip includes a first circuit having a first output terminal. The second chip includes a second circuit having a second output terminal, which is electrically connected to the first output terminal via a first signal line. When the first chip and the second chip receive a first command, the second circuit calibrates an output impedance at the second output terminal through a first calibration operation based on an output impedance at the first output terminal.
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公开(公告)号:US11756632B2
公开(公告)日:2023-09-12
申请号:US18084363
申请日:2022-12-19
申请人: Kioxia Corporation
摘要: A semiconductor memory device includes a memory cell connected between a bit line and a source line, a sense amplifier having a first transistor provided between at least two transistors of the sense amplifier and the bit line, and a controller which executes a read operation to read data stored by the memory cell. In the read operation, the controller applies a first voltage to the first transistor and a second voltage to the source line during a first time period, applies a third voltage to the first transistor and a fourth voltage to the source line during a second time period after the first time period, and applies the first voltage to the first transistor and a fifth voltage to the source line during a third time period after the second time period.
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公开(公告)号:US11948646B2
公开(公告)日:2024-04-02
申请号:US18305654
申请日:2023-04-24
申请人: Kioxia Corporation
发明人: Kosuke Yanagidaira , Mario Sako
CPC分类号: G11C16/26 , G11C11/5642 , G11C11/5671 , G11C16/0483 , G11C16/08 , G11C16/24 , G11C16/30
摘要: A semiconductor memory includes memory cells, a word line and bit lines of the memory cells, sense amplifiers connected to the bit lines, respectively, and a controller. Each sense amplifier includes first, second, and third transistors. The third transistor has one end connected to each of the first and second transistors, and the other end connected to a corresponding bit line. During a read operation, at a first time of a first period during which the controller applies a first read voltage to the word line, the controller applies a first voltage higher than ground voltage to the first transistor, and a second voltage to the second transistor. Also, at the first time, a first sense amplifier applies a voltage to a first bit line through its first and third transistors, and a second sense amplifier applies a voltage to a second bit line through tis second and third transistors.
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公开(公告)号:US11756628B2
公开(公告)日:2023-09-12
申请号:US17326954
申请日:2021-05-21
申请人: KIOXIA CORPORATION
发明人: Kosuke Yanagidaira
IPC分类号: G11C16/26 , G11C16/04 , G11C11/56 , G11C16/08 , G11C16/32 , G11C16/24 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/35 , G11C16/10 , H10B43/10 , H10B43/27
CPC分类号: G11C16/26 , G11C11/5642 , G11C16/0483 , G11C16/08 , G11C16/24 , G11C16/32 , H10B41/10 , H10B41/27 , H10B41/35 , H10B43/35 , G11C11/5671 , G11C16/10 , H10B43/10 , H10B43/27
摘要: A semiconductor memory device includes a first conductor extending in a first direction, bit lines, sense amplifiers, and a second conductor extending in the first direction. A plurality of first memory cells being connected to the first conductor. The bit lines respectively connected to the first memory cells. The first sense amplifiers are respectively connected to a plurality of first bit lines included in the bit lines, each of the first sense amplifiers including a first sense node, and a first transistor connected between the first sense node and a corresponding one of the first bit lines. The second conductor function as gate electrodes of the first transistors included in the first sense amplifiers.
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公开(公告)号:US11500770B2
公开(公告)日:2022-11-15
申请号:US16922612
申请日:2020-07-07
申请人: Kioxia Corporation
发明人: Kosuke Yanagidaira , Shouichi Ozaki
摘要: According one embodiment, a memory device controlling method includes: receiving, by a first semiconductor memory, a read command transmitted from a controller; receiving, by a second semiconductor memory, a write command transmitted from the controller; reading, by the first semiconductor, data from the first semiconductor memory based on the read command, and transmitting, from the first semiconductor memory to the second semiconductor memory, the data and a control signal indicating that the data is output; and receiving, by the second semiconductor memory, the data at a timing based on the control signal transmitted from the first semiconductor memory without intermediation of the controller based on the write command and writing the received data into the second semiconductor memory.
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公开(公告)号:US11081188B2
公开(公告)日:2021-08-03
申请号:US16774630
申请日:2020-01-28
申请人: KIOXIA CORPORATION
IPC分类号: G11C16/26 , G11C16/04 , G11C16/08 , G11C16/32 , H01L27/11582 , H01L27/11565
摘要: According to one embodiment, a semiconductor memory device includes a controller configured to execute a read operation. In the read operation, the controller is configured to: apply first and second read voltages to a word line, read data at each of first and second times, apply the first voltage to the source line at each of the first and second times, apply a second voltage to the source line during the application of the first read voltage to the word line and before the first time, and apply a third voltage to the source line during the application of the second read voltage to the word line and before the second time.
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公开(公告)号:US11990406B2
公开(公告)日:2024-05-21
申请号:US17860345
申请日:2022-07-08
申请人: KIOXIA CORPORATION
IPC分类号: H01L23/528 , H01L21/311 , H01L21/768 , H01L23/48 , H01L23/522 , H01L27/02 , H10B41/10 , H10B41/40 , H10B41/41
CPC分类号: H01L23/528 , H01L21/31144 , H01L21/76802 , H01L21/76816 , H01L21/76877 , H01L23/48 , H01L23/522 , H01L27/0207 , H10B41/10 , H10B41/40 , H10B41/41 , H01L2924/0002 , H01L2924/0002 , H01L2924/00
摘要: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.
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公开(公告)号:US11670383B2
公开(公告)日:2023-06-06
申请号:US17575554
申请日:2022-01-13
申请人: KIOXIA CORPORATION
发明人: Kosuke Yanagidaira , Mario Sako
CPC分类号: G11C16/26 , G11C11/5642 , G11C11/5671 , G11C16/0483 , G11C16/08 , G11C16/24 , G11C16/30
摘要: A semiconductor memory includes memory cells, a word line and bit lines of the memory cells, sense amplifiers connected to the bit lines, respectively, and a controller. Each sense amplifier includes first, second, and third transistors. The third transistor has one end connected to each of the first and second transistors, and the other end connected to a corresponding bit line. During a read operation, at a first time of a first period during which the controller applies a first read voltage to the word line, the controller applies a first voltage higher than ground voltage to the first transistor, and a second voltage to the second transistor. Also, at the first time, a first sense amplifier applies a voltage to a first bit line through its first and third transistors, and a second sense amplifier applies a voltage to a second bit line through the second and third transistors.
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公开(公告)号:US11417600B2
公开(公告)日:2022-08-16
申请号:US17079952
申请日:2020-10-26
申请人: KIOXIA CORPORATION
IPC分类号: H01L23/528 , H01L21/311 , H01L21/768 , H01L23/522 , H01L27/11519 , H01L27/11526 , H01L27/11529 , H01L27/02 , H01L23/48
摘要: A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a substrate; forming a first sacrificial layer in a first area over the substrate, the first sacrificial layer being patterned to form in the first area a functioning wiring connected to an element; forming a second sacrificial layer in a second area over the substrate, the second sacrificial layer being patterned to form in the second area a dummy wiring; forming a third sacrificial layer at a side wall of the first sacrificial layer and forming a fourth sacrificial layer at a side wall of the second sacrificial layer, the third sacrificial layer and the fourth sacrificial layer being separated; forming a concavity by etching the insulation layer to be processed using the third sacrificial layer and the fourth sacrificial layer as a mask; and filling a conductive material in the concavity.
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