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24 条记录 (耗时 0.021 秒)

    Self-aligned coaxial via capacitors
    1.
    发明授权
    Self-aligned coaxial via capacitors 有权

    公开(公告)号：US06565730B2

    公开(公告)日：2003-05-20

    申请号：US09474186

    申请日：1999-12-29

    申请人： Kishore K. Chakravorty ,  Thomas S. Dory ,  C. Michael Garner

    发明人： Kishore K. Chakravorty ,  Thomas S. Dory ,  C. Michael Garner

    IPC分类号： C25D502

    CPC分类号： H05K1/162 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2203/0315 ,  Y10T29/43

    摘要： The various embodiments of coaxial capacitors are self-aligned and formed in a via, including blind vias, buried vias and plated through holes. The coaxial capacitors are adapted to utilize the plating of a plated via as a first electrode. The dielectric layer is formed to overlie the first electrode while leaving a portion of the via unfilled. A second electrode is formed in the portion of the via left unfilled by the dielectric layer. Such coaxial capacitors are suited for use in decoupling and power dampening applications to reduce signal and power noise and/or reduce power overshoot and droop in electronic devices. For such applications, it is generally expected that a plurality of coaxial capacitors, often numbering in the thousands, will be coupled in parallel in order to achieve the desired level of capacitance.

    Self-aligned coaxial via capacitors
    2.
    发明授权
    Self-aligned coaxial via capacitors 失效
    自对准同轴电容器

    公开(公告)号：US06963483B2

    公开(公告)日：2005-11-08

    申请号：US10386981

    申请日：2003-03-12

    申请人： Kishore K. Chakravorty ,  Thomas S. Dory ,  C. Michael Garner

    发明人： Kishore K. Chakravorty ,  Thomas S. Dory ,  C. Michael Garner

    IPC分类号： H01G2/06 ,  H05K1/11 ,  H05K1/16 ,  H05K3/40 ,  H05K3/46 ,  H01G4/228

    CPC分类号： H05K1/162 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09809 ,  H05K2203/0315 ,  Y10T29/43

    摘要： The various embodiments of coaxial capacitors are self-aligned and formed in a via, including blind vias, buried vias and plated through holes. The coaxial capacitors are adapted to utilize the plating of a plated via as a first electrode. The dielectric layer is formed to overlie the first electrode while leaving a portion of the via unfilled. A second electrode is formed in the portion of the via left unfilled by the dielectric layer. Such coaxial capacitors are suited for use in decoupling and power dampening applications to reduce signal and power noise and/or reduce power overshoot and droop in electronic devices. For such applications, it is generally expected that a plurality of coaxial capacitors, often numbering in the thousands, will be coupled in parallel in order to achieve the desired level of capacitance.

    摘要翻译： 同轴电容器的各种实施例是自对准的，并且形成在通孔中，包括盲孔，埋入通孔和电镀通孔。 同轴电容器适于利用电镀通孔的电镀作为第一电极。 形成电介质层以覆盖第一电极，同时留下通孔的一部分未填充。 第二电极形成在未被电介质层填充的通孔左侧的部分中。 这种同轴电容器适用于去耦和功率衰减应用，以减少信号和功率噪声和/或减少电子设备中的功率过冲和下降。 对于这样的应用，通常期望通常以千位数字编号的多个同轴电容器将并联耦合，以便实现期望的电容水平。

    Conductive interconnects along the edge of a microelectronic device
    4.
    发明授权
    Conductive interconnects along the edge of a microelectronic device 有权
    沿着微电子器件边缘的导电互连

    公开(公告)号：US07750441B2

    公开(公告)日：2010-07-06

    申请号：US11479611

    申请日：2006-06-29

    申请人： Rockwell M. Hsu ,  Thomas S. Dory

    发明人： Rockwell M. Hsu ,  Thomas S. Dory

    IPC分类号： H01L29/40

    CPC分类号： H01L21/76898

    摘要： Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.

    摘要翻译： 本发明的实施例包括与沿着微电子器件的边缘的导电互连相关的装置和方法。 在一个实施例中，导电互连具有半圆柱体的形状。

    Conductive interconnects along the edge of a microelectronic device
    5.
    发明申请
    Conductive interconnects along the edge of a microelectronic device 有权
    沿着微电子器件边缘的导电互连

    公开(公告)号：US20080001269A1

    公开(公告)日：2008-01-03

    申请号：US11479611

    申请日：2006-06-29

    申请人： Rockwell M. Hsu ,  Thomas S. Dory

    发明人： Rockwell M. Hsu ,  Thomas S. Dory

    IPC分类号： H01L23/02

    CPC分类号： H01L21/76898

    摘要： Embodiments of the invention include apparatuses and methods relating to conductive interconnects along the edges of a microelectronic device. In one embodiment, the conductive interconnect has the shape of a half cylinder.

    摘要翻译： 本发明的实施例包括与沿着微电子器件的边缘的导电互连相关的装置和方法。 在一个实施例中，导电互连具有半圆柱体的形状。

    Use of selected beta-nitroalkenes as cetane number boosters for diesel fuel
    8.
    发明授权
    Use of selected beta-nitroalkenes as cetane number boosters for diesel fuel 失效
    选择的β-硝基烯烃用作柴油机十六烷值助剂

    公开(公告)号：US4561862A

    公开(公告)日：1985-12-31

    申请号：US721099

    申请日：1985-04-08

    申请人： Thomas S. Dory

    发明人： Thomas S. Dory

    IPC分类号： C07C205/03 ,  C10L1/23 ,  C10L1/22

    CPC分类号： C10L1/231 ,  C07C205/03

    摘要： Disclosed is a diesel fuel comprising a base fuel selected from the group consisting of liquid hydrocarbons of the diesel boiling range, alcohols, and mixtures thereof, and an effective cetane number-increasing amount of at least one beta-nitroalkene of the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are individually selected from the group consisting of hydrogen and alkyl groups having from 1 to about 13 carbon atoms, with the proviso that the sum of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 contains from 2 to about 13 carbon atoms.

    摘要翻译： 公开了一种柴油燃料，其包含选自柴油沸程的液体烃，醇及其混合物的基础燃料和有效十六烷值增加量的至少一种下式的β-硝基烯烃：