公开(公告)号：US06453536B1

公开(公告)日：2002-09-24

申请号：US09530661

申请日：2000-04-28

Applicant: Klaus Müller ,  Hans Nusskern

Inventor： Klaus Müller ,  Hans Nusskern

IPC: B23P1700

CPC classification number: B21C37/06 ,  B21C23/085 ,  B21C23/22 ,  B21C33/004 ,  Y10T29/4981

Abstract: The invention relates to a method for producing hollow nickel titanium profiles with a small external diameter and/or small wall thickness by means of deformation, especially extrusion. According to the inventive method, a composite block is formed, comprising a solid core and one or several hollow blocks surrounding said core. The core and the hollow blocks are made of nickel titanium. The parts of the composite block are separated after deformation to obtain a wire (3a), a tube (1a) with a small diameter and a tube (5a) with a larger diameter.

Abstract translation: 本发明涉及通过变形，特别是挤压生产具有小外径和/或小壁厚的中空镍钛型材的方法。 根据本发明的方法，形成复合块，其包括实心芯和围绕所述芯的一个或多个中空块。 芯和中空块由镍钛制成。 复合块的部分在变形后分离，得到线（3a），直径较小的管（1a）和直径较大的管（5a）。

公开(公告)号：US10376994B2

公开(公告)日：2019-08-13

申请号：US10554274

申请日：2004-04-21

Applicant: Hans-Jürgen Albrecht ,  Klaus Heinrich Georg Bartl ,  Werner Kruppa ,  Klaus Müller ,  Mathias Nowottnick ,  Gunnar Petzold ,  Hector Andrew Hamilton Steen ,  Klaus Wilke ,  Klaus Wittke

Inventor： Hans-Jürgen Albrecht ,  Klaus Heinrich Georg Bartl ,  Werner Kruppa ,  Klaus Müller ,  Mathias Nowottnick ,  Gunnar Petzold ,  Hector Andrew Hamilton Steen ,  Klaus Wilke ,  Klaus Wittke

IPC: C22C13/02 ,  B23K35/26

Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.

公开(公告)号：US09841028B2

公开(公告)日：2017-12-12

申请号：US13522799

申请日：2011-01-17

Applicant: Jan Knedler ,  Klaus Müller ,  Karsten Antonius ,  Matthias Ulmer ,  Mohammad Mehdi Ayatollahzadeh

Inventor： Jan Knedler ,  Klaus Müller ,  Karsten Antonius ,  Matthias Ulmer ,  Mohammad Mehdi Ayatollahzadeh

IPC: F04D15/00 ,  F04D13/06 ,  F04D25/06 ,  F04D29/40 ,  F04B49/06 ,  F04B39/14 ,  F04B39/12 ,  F04B53/16

CPC classification number: F04D15/0088 ,  F04B39/121 ,  F04B39/14 ,  F04B49/06 ,  F04B53/16 ,  F04D13/06 ,  F04D25/06 ,  F04D29/40

Abstract: A pump unit includes a drive motor (14) and a first housing (2), in which a control electronics unit (18) is arranged for operating the drive motor (14). An operating unit (20) having at least one display or operating element (26, 28, 30) can be detachably connected to the first housing in at least two different positions.

公开(公告)号：US09618107B2

公开(公告)日：2017-04-11

申请号：US13579699

申请日：2011-02-16

Applicant: Klaus Müller ,  Sergei Gerz ,  Ralf Haas

Inventor： Klaus Müller ,  Sergei Gerz ,  Ralf Haas

IPC: F16H55/18 ,  F04B9/02 ,  F04B43/02

CPC classification number: F16H55/18 ,  F04B9/02 ,  F04B43/021

Abstract: A toothed wheel (16) is provided with teeth, in which a cross section of a respective first section (24) of the tooth (23) has an outer contour that projects in at least one partial area of the outer contour relative to an outer contour of the adjoining second section (26) of the tooth (23), and is elastically designed and/or mounted, as well as a pump unit, in particular as a metering pump unit, with a drive having a toothed gearing with the toothed wheel.

公开(公告)号：US09388800B2

公开(公告)日：2016-07-12

申请号：US13808762

申请日：2011-07-06

Applicant: Sergei Gerz ,  Klaus Müller ,  Bernd Rosner

Inventor： Sergei Gerz ,  Klaus Müller ,  Bernd Rosner

IPC: F04B19/00 ,  F04B1/00 ,  F04B1/04 ,  F04B13/00 ,  F04B9/02

CPC classification number: F04B1/00 ,  F04B1/0404 ,  F04B1/0426 ,  F04B9/02 ,  F04B13/00

Abstract: A metering pump assembly includes a metering space (6) and a displacement body (8) which is linearly movable via a conrod (10). A helical spring (20) designed as a compression spring (20) impinges the conrod (10) with a force in a movement direction. The helical spring (20) at at least one axial end (24) is designed such that in a relaxed condition an end (26) of a spring wire projects axially with respect to a connecting winding (28).

Abstract translation: 计量泵组件包括一个通过一个连杆（10）可线性移动的计量空间（6）和排量体（8）。 被设计成压缩弹簧（20）的螺旋弹簧（20）以一个沿着移动方向的力撞击该连杆（10）。 在至少一个轴向端（24）处的螺旋弹簧（20）被设计成使得在松弛状态下弹簧丝线的端部（26）相对于连接绕组（28）轴向突出。

公开(公告)号：US08853732B2

公开(公告)日：2014-10-07

申请号：US13499622

申请日：2010-08-31

Applicant: Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

Inventor： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

IPC: H01L33/62 ,  H01L31/0224

CPC classification number: H01L31/0224 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).

Abstract translation: 本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料 材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到 光电半导体芯片（2）。

公开(公告)号：US07726179B2

公开(公告)日：2010-06-01

申请号：US11911377

申请日：2006-04-11

Applicant: Klaus Müller ,  Sergei Gerz

Inventor： Klaus Müller ,  Sergei Gerz

IPC: G01M3/02

CPC classification number: F04B43/0072 ,  F04B51/00 ,  F04B2205/03

Abstract: The invention relates to a method and a device for monitoring a fluid flow delivered by means of a pump. In the method the pressure distribution of the fluid is continuously or quasi-continuously measured as actual values in partial areas of the pump stroke and compared with desired values. In the device at least one pressure sensor is provided for the continuous or quasi-continuous measurement of the pressure of a fluid at least in partial areas of the pump stroke and a comparator is provided for comparing the measured actual values of the pressure with desired values.

Abstract translation: 本发明涉及一种用于监测通过泵输送的流体流的方法和装置。 在该方法中，将流体的压力分布连续或准连续地测量为泵冲程的部分区域中的实际值并与期望值进行比较。 在该装置中，提供至少一个压力传感器用于至少在泵冲程的部分区域中连续或准连续地测量流体的压力，并且提供比较器用于将所测量的实际值与期望值进行比较 。

公开(公告)号：US06972153B2

公开(公告)日：2005-12-06

申请号：US10380052

申请日：2001-09-18

Applicant: Klaus Müller ,  Klaus Klemm

Inventor： Klaus Müller ,  Klaus Klemm

IPC: B32B27/00 ,  B29C45/14 ,  B32B7/02 ,  B32B37/16 ,  B44C5/04 ,  B32B27/30 ,  B32B27/42

CPC classification number: B44C5/04 ,  B29C45/14778 ,  B29K2105/0818 ,  B32B7/02 ,  B32B2038/0076 ,  B32B2305/74 ,  Y10T428/24942 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31786 ,  Y10T428/31928 ,  Y10T428/31935

Abstract: In a laminated composite comprising a support made of a thermoplastic polymer, an intermediate layer located thereon which is likewise made of a thermoplastic polymer and a heat-cured layer applied to the intermediate layer, a resin layer (a) having a degree of curing of at least 20% is additionally inserted between the support and the intermediate layer and a resin layer (c) having a degree of curing of at least 60% is inserted between the intermediate layer and the heat-cured layer.

Abstract translation: 在包含由热塑性聚合物制成的载体的层压复合体中，同样由热塑性聚合物制成的中间层和施加到中间层的热固化层，具有固化度的树脂层（a） 在载体和中间层之间另外插入至少20％，并且在中间层和热固化层之间插入具有至少60％的固化度的树脂层（c）。

公开(公告)号：US06526509B1

公开(公告)日：2003-02-25

申请号：US08952155

申请日：1997-11-10

Applicant: Günther Horn ,  Klaus Müller ,  Volker Kessler

Inventor： Günther Horn ,  Klaus Müller ,  Volker Kessler

IPC: H04L900

CPC classification number: H04L9/0844 ,  G06F7/725 ,  H04L9/3263 ,  H04L2209/80

Abstract: The method provides that a session code (K) can be agreed between a first computer unit (U) and a second computer unit (N), without it being possible for any unauthorized third party to gain access to useful information relating to the codes or the identity of the first computer unit (U). This is achieved by embedding the principle of the El-Gamal code interchange in the method, with additional formation of a digital signature via a hash value of the session code (K) which is formed by the first computer unit (U).

Abstract translation: 该方法规定，可以在第一计算机单元（U）和第二计算机单元（N）之间约定会话代码（K），而没有任何未授权的第三方可以访问有关代码的有用信息或 第一个计算机单元（U）的身份。 这通过在该方法中嵌入El-Gamal代码交换的原理来实现，并且经由由第一计算机单元（U）形成的会话代码（K）的哈希值附加地形成数字签名来实现。

公开(公告)号：US09162420B2

公开(公告)日：2015-10-20

申请号：US12312881

申请日：2007-11-29

Applicant: Klaus Müller ,  Ines Schwarz

Inventor： Klaus Müller ,  Ines Schwarz

IPC: B32B27/34 ,  B32B5/14 ,  B32B5/02 ,  B32B7/12 ,  B32B15/085 ,  B32B21/08 ,  B32B21/10 ,  B32B27/18 ,  B32B27/30 ,  B32B27/32 ,  B32B27/28 ,  B32B27/36 ,  B32B27/40 ,  B29C45/14 ,  B32B27/06 ,  B32B27/12 ,  B29K105/08 ,  B29K705/00 ,  B29K711/14

CPC classification number: B32B5/14 ,  B29C45/14467 ,  B29C45/14778 ,  B29C45/14811 ,  B29C2045/14532 ,  B29K2105/0818 ,  B29K2705/00 ,  B29K2711/14 ,  B29K2715/006 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B15/085 ,  B32B21/08 ,  B32B21/10 ,  B32B27/06 ,  B32B27/12 ,  B32B27/18 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B2262/065 ,  B32B2262/067 ,  B32B2262/101 ,  B32B2307/702 ,  B32B2307/704 ,  Y10T428/258 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/27 ,  Y10T428/31507 ,  Y10T428/31551 ,  Y10T428/31678 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31935 ,  Y10T428/31938 ,  Y10T428/31942 ,  Y10T428/31989 ,  Y10T442/339 ,  Y10T442/3854

Abstract: A solvent-free multilayer laminated material comprises a lower substrate layer comprising a thermoplastic polymer or a mixture of thermoplastic polymers, an intermediate layer arranged thereon and comprising a flexible material, a further fibrous intermediate layer comprising plastic, which is provided with an adhesive material and an upper layer comprising metal, comprising plastic or comprising wood or wood-like materials. It does surprisingly not show any deformation even under exposure to temperatures of about 80° C. over a period of up to 40 days and can be used for the production of articles of furniture, floor coverings, wall panels or shaped articles for the electrical, construction or automotive industry.

Abstract translation: 无溶剂的多层层压材料包括下基材层，其包含热塑性聚合物或热塑性聚合物的混合物，布置在其上并包含柔性材料的中间层，包含塑料的另外的纤维中间层，其设置有粘合剂材料和 包括金属的上层，包括塑料或包含木材或木材状材料。 即使在高达40天的时间内暴露在约80℃的温度下也不会出现任何变形，并且可以用于生产家具，地板覆盖物，墙板或成形制品用于电气， 建筑业或汽车工业。