公开(公告)号：US5183631A

公开(公告)日：1993-02-02

申请号：US535080

申请日：1990-06-08

申请人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Mitsuo Satomi ,  Ken Hirota

发明人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Mitsuo Satomi ,  Ken Hirota

IPC分类号： C22C32/00 ,  B22F1/02 ,  B22F3/00 ,  B22F3/14 ,  C04B35/74 ,  C22C1/04 ,  C22C1/10 ,  C22C33/02 ,  C22C38/00 ,  H01F1/24

CPC分类号： H01F1/24 ,  B22F1/02 ,  C04B35/74 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2991

摘要： A composite material is provided which includes a discrete phase including grains made of a first substance; and a continuous phase including a thin coating film made of a second substance and formed on the surface of each of the grains. The thin coating film has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film. The porosity of the composite material is 5% or less.

公开(公告)号：US5352522A

公开(公告)日：1994-10-04

申请号：US945763

申请日：1992-09-16

申请人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Mitsuo Satomi ,  Ken Hirota

发明人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Mitsuo Satomi ,  Ken Hirota

IPC分类号： C22C32/00 ,  B22F1/02 ,  B22F3/00 ,  B22F3/14 ,  C04B35/74 ,  C22C1/04 ,  C22C1/10 ,  C22C33/02 ,  C22C38/00 ,  H01F1/24 ,  B32B5/16

CPC分类号： H01F1/24 ,  B22F1/02 ,  C04B35/74 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2991

摘要： A composite material is provided which includes a discrete phase including grains made of a first substance; and a continuous phase including a thin coating film made of a second substance and formed on the surface of each of the grains. The thin coating film has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film. The porosity of the composite material is 5% or less.

摘要翻译： 提供一种复合材料，其包括离散相，包括由第一物质制成的颗粒; 以及连续相，包括由第二物质制成的薄涂层，并形成在每个晶粒的表面上。 薄涂膜的平均厚度小于颗粒的平均粒度。 颗粒通过薄涂膜基本上彼此分离。 复合材料的孔隙率为5％以下。

公开(公告)号：US5350628A

公开(公告)日：1994-09-27

申请号：US978564

申请日：1992-11-19

申请人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Ken Hirota ,  Mitsuo Satomi

发明人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Ken Hirota ,  Mitsuo Satomi

IPC分类号： G11B5/133 ,  G11B5/193 ,  H01F1/08 ,  H01F1/24 ,  G11B5/00 ,  H01F1/00

CPC分类号： G11B5/133 ,  G11B5/193 ,  H01F1/083 ,  H01F1/24 ,  Y10S428/90 ,  Y10T428/115 ,  Y10T428/249956 ,  Y10T428/2991

摘要： A magnetic material is provided which includes a discrete phase including grains made of a first substance which comprises a magnetic metal; and a continuous phase including a thin coating film made of a second substance which comprises a dielectric or insulating substance. The thin coating film is formed on the surface of the grains and has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film.

摘要翻译： 提供磁性材料，其包括离散相，包括由包含磁性金属的第一物质制成的颗粒; 以及包括由包含电介质或绝缘物质的第二物质制成的薄涂膜的连续相。 该薄涂层形成在晶粒的表面上，其平均厚度小于晶粒的平均粒径。 颗粒通过薄涂膜基本上彼此分离。

公开(公告)号：US5238507A

公开(公告)日：1993-08-24

申请号：US535082

申请日：1990-06-08

申请人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Ken Hirota ,  Mitsuo Satomi

发明人： Koichi Kugimiya ,  Yasuhiro Sugaya ,  Osamu Inoue ,  Ken Hirota ,  Mitsuo Satomi

IPC分类号： G11B5/133 ,  G11B5/193 ,  H01F1/08 ,  H01F1/24

CPC分类号： G11B5/133 ,  G11B5/193 ,  H01F1/083 ,  H01F1/24 ,  Y10S428/90 ,  Y10T428/115 ,  Y10T428/249956 ,  Y10T428/2991

摘要： A magnetic material is provided which includes a discrete phase including grains made of a first substance which comprises a magnetic metal; and a continuous phase including a thin coating film made of a second substance which comprises a dielectric or insulating substance. The thin coating film is formed on the surface of the grains and has a mean thickness smaller than the mean particle size of the grains. The grains are separated substantially from each other by the thin coating film.

公开(公告)号：US06696139B2

公开(公告)日：2004-02-24

申请号：US10330159

申请日：2002-12-30

申请人： Yasuhiro Sugaya ,  Osamu Inoue ,  Junichi Kato

发明人： Yasuhiro Sugaya ,  Osamu Inoue ,  Junichi Kato

IPC分类号： B32B300

CPC分类号： H05K3/4611 ,  H01L21/481 ,  H01L21/4846 ,  H01L21/4857 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/4629 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a conductor layer having virtually no voids is placed on the green sheet and a mask is also placed on the conductor layer. Then, the conductor layer is patterned by wet-etching so that wiring is formed thereon. A plurality of the green sheets thus formed are laminated, and a binding sheet, which contains an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the multi-layered body as a main component, is formed on either both surfaces or one surface of the laminated body, and this is then fired, and thereafter, the binding sheet is removed.

摘要翻译： 制备包含含有不含极性基团的丙烯酸树脂和粉末状陶瓷材料的粘合剂的生片，并且在生片中形成连接通孔。 此外，实际上没有空隙的导体层被放置在生片上，并且掩模也被放置在导体层上。 然后，通过湿式蚀刻对导体层进行构图，从而在其上形成布线。 将如此形成的多个生片叠层起来，在两面或一面上形成包含在多层体的烧成温度下实质上不具有烧结收缩率的无机组合物的粘结片作为主要成分 层叠体的表面，然后烧成，然后除去粘合片。

公开(公告)号：US06521069B1

公开(公告)日：2003-02-18

申请号：US09492781

申请日：2000-01-27

申请人： Yasuhiro Sugaya ,  Osamu Inoue ,  Junichi Kato

发明人： Yasuhiro Sugaya ,  Osamu Inoue ,  Junichi Kato

IPC分类号： B32B3126

CPC分类号： H05K3/4611 ,  H01L21/481 ,  H01L21/4846 ,  H01L21/4857 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/4629 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00

摘要： A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a conductor layer having virtually no voids is placed on the green sheet and a mask is also placed on the conductor layer. Then, the conductor layer is patterned by wet-etching so that wiring is formed thereon. A plurality of the green sheets thus formed are laminated, and a binding sheet, which contains an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the multi-layered body as a main component, is formed on either both surfaces or one surface of the laminated body, and this is then fired, and thereafter, the binding sheet is removed.

摘要翻译： 制备包含含有不含极性基团的丙烯酸树脂和粉末状陶瓷材料的粘合剂的生片，并且在生片中形成连接通孔。 此外，实际上没有空隙的导体层被放置在生片上，并且掩模也被放置在导体层上。 然后，通过湿式蚀刻对导体层进行构图，从而在其上形成布线。 将如此形成的多个生片叠层起来，在两面或一面上形成包含在多层体的烧成温度下实质上不具有烧结收缩率的无机组合物的粘结片作为主要成分 层叠体的表面，然后烧成，然后除去粘合片。

公开(公告)号：US20070242440A1

公开(公告)日：2007-10-18

申请号：US11578039

申请日：2006-02-01

申请人： Yasuhiro Sugaya ,  Yoshiyuki Yamamoto ,  Toshiyuki Asahi ,  Katsumasa Miki ,  Yoshiyuki Saitou ,  Takeshi Nakayama

发明人： Yasuhiro Sugaya ,  Yoshiyuki Yamamoto ,  Toshiyuki Asahi ,  Katsumasa Miki ,  Yoshiyuki Saitou ,  Takeshi Nakayama

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/186 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/10015 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.

摘要翻译： 多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层 箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。 固体电解电容器设置成保持在多个电路板之间。 导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。

公开(公告)号：US07134198B2

公开(公告)日：2006-11-14

申请号：US10654343

申请日：2003-09-03

申请人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

发明人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

IPC分类号： H05K3/30

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin composition, and grinding or abrading the thermosetting resin composition and electric element from a side of the electric element opposite that of the wiring pattern. The method provides upper surfaces of the electric element and the thermosetting resin composition that are substantially flush with each other. The method provides an electric element built-in module suitable for high-density packaging with a reduced thickness without damaging the electric element and while maintaining mechanical strength.

摘要翻译： 一种电气元件内置模块的制造方法，其包括在布线图案上安装诸如半导体芯片或表面声波装置的至少一个电气元件的倒装芯片，用热固性树脂组合物密封电气元件，以及研磨或 从电气元件的与布线图案相反的一侧研磨热固性树脂组合物和电气元件。 该方法提供电气元件和热固性树脂组合物的彼此基本齐平的上表面。 该方法提供一种电子元件内置模块，适用于厚度较小的高密度封装，而不会损坏电气元件，同时保持机械强度。

公开(公告)号：US07018866B2

公开(公告)日：2006-03-28

申请号：US10753933

申请日：2004-01-07

申请人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

发明人： Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Shingo Komatsu ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Kazuo Ohtani

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K1/187 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A circuit component built-in module includes: a first electrical insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed at least on a principal surface of the first electrical insulating substrate; a semiconductor chip incorporated in the first electrical insulating substrate and connected electrically with the wiring patterns; and inner vias electrically connecting the plurality of wiring patterns with one another, the inner vias passing through the first electrical insulating substrate. In the circuit component built-in module, the semiconductor chip has a thickness of not less than 30 μm and not more than 100 μm, and has a non-wired surface ground, and the circuit component built-in module has a thickness in a range of not less than 80 μm and not more than 200 μm. With this configuration, the high-performance and compact-size circuit component built-in module in which circuit components are mounted at a high density is provided so as to be used suitably in various types of electronic information devices.

摘要翻译： 电路部件内置模块包括：由含有无机填料和热固性树脂的混合物制成的第一电绝缘基板; 至少形成在所述第一电绝缘基板的主表面上的多个布线图案; 结合在第一电绝缘基板中并与布线图形电连接的半导体芯片; 以及将所述多个布线图案彼此电连接的内部通孔，所述内部通孔穿过所述第一电绝缘基板。 在电路部件内置模块中，半导体芯片的厚度为30μm以上且100μm以下，具有非接线表面接地，电路部件内置模块的厚度为 范围不小于80μm，不大于200μm。 利用这种配置，提供了以高密度安装电路部件的高性能和紧凑型电路部件内置模块，以便适用于各种类型的电子信息装置。

公开(公告)号：US06871396B2

公开(公告)日：2005-03-29

申请号：US09778709

申请日：2001-02-07

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H01R43/02

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。