公开(公告)号：US5569886A

公开(公告)日：1996-10-29

申请号：US423907

申请日：1995-04-18

申请人： Kouji Tanabe ,  Noahiro Nishioka

发明人： Kouji Tanabe ,  Noahiro Nishioka

IPC分类号： H05K3/28 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  H05K1/14

CPC分类号： H05K3/321 ,  H05K1/114 ,  H05K3/245 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/181 ,  H05K2201/09436 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/065 ,  H05K2203/1311 ,  H05K2203/1453 ,  H05K3/4069 ,  H05K3/4644 ,  H05K3/4664 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A flexible printed circuit board is constituted with a first insulation film covering a first insulating resist layer, a second insulation film covering a second insulating resist layer and a printed circuit formed between the first insulating resist layer and the second insulating resist layer, and a terminal of an electronic component is disposed on the printed circuit, and the second insulation film is pressed and heated.

摘要翻译： 柔性印刷电路板由覆盖第一绝缘抗蚀剂层的第一绝缘膜，覆盖第二绝缘抗蚀剂层的第二绝缘膜和形成在第一绝缘抗蚀剂层和第二绝缘抗蚀剂层之间的印刷电路构成，端子 的电子部件设置在印刷电路上，第二绝缘膜被按压和加热。

公开(公告)号：US20070201183A1

公开(公告)日：2007-08-30

申请号：US11709688

申请日：2007-02-23

申请人： Takashi Komatsu ,  Kouji Tanabe

发明人： Takashi Komatsu ,  Kouji Tanabe

IPC分类号： H04R17/00

CPC分类号： H01G4/30 ,  H01G4/2325 ,  Y10T29/42

摘要： The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion to a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly 10. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 20 has such constitution that a first electrode layer connected with the internal electrode, a second electrode layer (electroconductive resin layer) including a hardened product of thermohardening resin containing a polyphenol compound having a side chain composed of an aliphatic group, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

摘要翻译： 本发明的目的在于提供一种能够减少接合部到板等的裂纹的电子部件。作为电子部件的一个例子的电容器1（层叠陶瓷电容器）设置有元件组件10（陶瓷） 以及形成在元件组件10的两个侧表面上的一对外部电极20。 在元件组件10中，交替层叠电介质层12和内部电极14。 外部电极20具有与内部电极连接的第一电极层，包含含有具有由脂肪族组成的侧链的多酚化合物的热硬化性树脂的硬化物的第二电极层（导电性树脂层），第三 从元件组装侧依次形成由Ni构成的电极层和由Sn构成的第四电极层。

公开(公告)号：US5943156A

公开(公告)日：1999-08-24

申请号：US28116

申请日：1998-02-23

申请人： Eiju Komuro ,  Tohru Kineri ,  Kouji Tanabe

发明人： Eiju Komuro ,  Tohru Kineri ,  Kouji Tanabe

IPC分类号： G02B5/30 ,  G02B1/08 ,  G02B1/10

CPC分类号： G02B5/3033

摘要： A polarizing plate includes a polarizing layer for controlling a light and producing a polarized light, the polarizing layer having a particle dispersing medium with a property of light transmission and bar-like polarizing particles which are dispersed in the particle dispersing medium and arranged in a constant direction with a magnetic field, where each of the bar-like polarizing particles is provided with a bar-like ferromagnetic particle of chromium dioxide, whose surface is coated with a conductive film.

摘要翻译： 偏光板包括用于控制光并产生偏振光的偏振层，偏振层具有分散在颗粒分散介质中并且以恒定的方式布置的具有透光性的棒状偏振粒子和棒状偏振粒子的粒子分散介质 方向与磁场，其中每个棒状偏振粒子设置有二氧化铬的棒状铁磁性颗粒，其表面涂覆有导电膜。

公开(公告)号：US07847371B2

公开(公告)日：2010-12-07

申请号：US11709773

申请日：2007-02-23

申请人： Takashi Komatsu ,  Kouji Tanabe

发明人： Takashi Komatsu ,  Kouji Tanabe

IPC分类号： H01L21/02 ,  H01G4/12 ,  H01G4/30

CPC分类号： H01G4/2325 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/0478

摘要： The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion with a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component of the present invention is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 14 has such constitution that a first electrode layer connected with the internal electrode 14, a second electrode layer (electroconductive resin layer) including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as the base compound, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

摘要翻译： 本发明的目的在于提供一种能够减少与基板等的接合部分发生裂纹的电子部件。作为本发明的电子部件的一个例子的电容器1（层叠陶瓷电容器）设置有元件组件 10（陶瓷）和形成在元件组件的两个侧表面上的一对外部电极20。 在元件组件10中，交替层叠电介质层12和内部电极14。 外部电极14具有与内部电极14连接的第一电极层，包含含有分子量为2000以上的环氧化合物的环氧树脂的硬化物的多个环氧树脂的第二电极层（导电性树脂层） 作为基础化合物的组合物，由Ni构成的第三电极层和由Sn构成的第四电极层从元件组装侧依次形成。

公开(公告)号：US20100247367A1

公开(公告)日：2010-09-30

申请号：US12749165

申请日：2010-03-29

申请人： Hideki Nakamura ,  Noaki Mori ,  Hirofumi Nakano ,  Kouji Tanabe

发明人： Hideki Nakamura ,  Noaki Mori ,  Hirofumi Nakano ,  Kouji Tanabe

IPC分类号： B22F3/26 ,  B22F3/12

CPC分类号： B22F3/087 ,  B22F2998/10 ,  H01F1/0553 ,  H01F1/0556 ,  H01F1/0558 ,  H01F1/0573 ,  H01F1/0576 ,  H01F1/0578 ,  H01F1/08 ,  H01F1/083 ,  H01F1/09 ,  H01F41/0266 ,  H01F41/0273 ,  H01F41/0293 ,  B22F9/023 ,  B22F1/0003 ,  B22F3/02 ,  B22F2003/145 ,  B22F9/04 ,  B22F1/0059 ,  B22F3/26 ,  B22F2003/248

摘要： A method of producing a rare-earth magnet containing a rare-earth compound having a first rare-earth element and a second rare-earth element different from the first rare-earth element includes: a mixing step of mixing rare-earth compound powder including the first rare-earth element and subjected to a process based on hydrogenation disproportionation desorption recombination with a diffusion material including the second rare-earth element; a molding step of molding the mixed powder into a compact in a magnetic field; and a heating step of heating the compact to diffuse the second rare-earth element into the rare-earth compound powder.

摘要翻译： 含有具有与第一稀土元素不同的第一稀土元素和第二稀土元素的稀土类化合物的稀土类磁铁的稀土类磁铁的制造方法包括：混合稀土类化合物粉末 第一稀土元素，并且进行与包括第二稀土元素的扩散材料的氢化歧化解吸复合的工艺; 将混合粉末在磁场中成型成型的成型工序; 以及加热所述压块以使所述第二稀土元素扩散到所述稀土类化合物粉末中的加热工序。

公开(公告)号：US5461202A

公开(公告)日：1995-10-24

申请号：US132036

申请日：1993-10-05

申请人： Naoki Sera ,  Toshiharu Fukui ,  Kouji Tanabe ,  Futoshi Matsui

发明人： Naoki Sera ,  Toshiharu Fukui ,  Kouji Tanabe ,  Futoshi Matsui

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/363 ,  H05K1/189 ,  H05K3/0064 ,  H05K3/245 ,  H05K3/28 ,  H05K1/0218 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K1/181 ,  H05K2201/035 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/10636 ,  H05K2201/2009 ,  H05K2203/166 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/386 ,  H05K3/428 ,  H05K3/4685 ,  Y02P70/611

摘要： A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on thed printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.

摘要翻译： 柔性布线板包括形成在绝缘膜上的印刷导电电路层，形成在印刷导电电路层上的金属层和形成在金属层上的绝缘层。 制造柔性布线板的方法包括以下步骤：通过使用导电浆丝网印刷布线图案来形成导电电路层，烘烤印刷布线图案，以及通过电镀方法在印刷导电电路层上形成金属层。

公开(公告)号：US5871088A

公开(公告)日：1999-02-16

申请号：US913821

申请日：1998-01-16

申请人： Kouji Tanabe

发明人： Kouji Tanabe

IPC分类号： H01J29/04 ,  C09K11/02 ,  H01H13/702 ,  H01H13/785 ,  H01J1/142 ,  H01J9/04 ,  H05B33/00 ,  H05B33/10 ,  H05B33/12 ,  H05B33/20 ,  H05B33/22 ,  H05B33/26 ,  H05B33/28 ,  H01N9/00 ,  H01H13/70

CPC分类号： H01H13/785 ,  C09K11/02 ,  H01H13/702 ,  H01J1/142 ,  H01J9/042 ,  H05B33/00 ,  H05B33/10 ,  H05B33/12 ,  H05B33/20 ,  H05B33/22 ,  H05B33/26 ,  H05B33/28 ,  H01H2201/032 ,  H01H2209/002 ,  H01H2219/018

摘要： An EL sheet diaphragm including a diffusion type EL sheet having a diaphragm portion exhibiting a dome shape and a flange supporting portion disposed about the outer circumference of the diffusion type EL sheet. The diffusion type EL sheet including a transparent film having an upper surface and a lower surface, a transparent electrode layer formed on the lower surface of the transparent film, a light emitting layer formed on the transparent electrode, a dielectric layer formed on the light emitting layer, a rear electrode layer formed on the dielectric layer, and an insulating layer formed on the rear electrode layer. The diffusion type EL sheet emits light from the diaphragm portion of the upper surface of the transparent film. The diffusion type EL sheet bows outwardly in an at-rest state such that the upper surface of the transparent film exhibits a convex shape, and bows inwardly when depressed for operation such that the upper surface of the transparent film exhibits a concave shape.

摘要翻译： PCT No.PCT / JP96 / 00831 Sec。 371日期1998年1月16日 102（e）日期1998年1月16日PCT提交1996年3月28日PCT公布。 第WO96 / 30919号公报 日期：1996年10月3日包括具有圆顶形状的隔膜部分的扩散型EL片和围绕扩散型EL片的外周设置的凸缘支撑部的EL片。 扩散型EL片，包括具有上表面和下表面的透明膜，形成在透明膜的下表面上的透明电极层，形成在透明电极上的发光层，形成在发光 层，形成在电介质层上的后电极层和形成在后电极层上的绝缘层。 扩散型EL片从透明膜的上表面的隔膜部发射光。 扩散型EL片在静止状态下向外弯曲，使得透明膜的上表面呈凸形，并且在按压操作时向内弯曲，使得透明膜的上表面呈凹形。

公开(公告)号：US5354392A

公开(公告)日：1994-10-11

申请号：US3913

申请日：1993-01-13

申请人： Kouichi Santo ,  Naohiro Nishioka ,  Kenji Otomo ,  Kouji Tanabe ,  Futoshi Matsui

发明人： Kouichi Santo ,  Naohiro Nishioka ,  Kenji Otomo ,  Kouji Tanabe ,  Futoshi Matsui

IPC分类号： B23K20/10 ,  B29C65/08 ,  H01R43/02 ,  H05K1/09 ,  H05K3/32 ,  H05K3/36 ,  B32B31/16

CPC分类号： B29C66/81433 ,  B23K20/10 ,  B29C65/08 ,  B29C65/78 ,  B29C66/1122 ,  B29C66/21 ,  B29C66/43 ,  B29C66/723 ,  B29C66/73921 ,  B29C66/81427 ,  B29C66/81435 ,  B29C66/8322 ,  B29C66/9672 ,  H01R43/0207 ,  H05K3/328 ,  H05K3/361 ,  B29C66/71 ,  B29C66/81417 ,  B29L2009/00 ,  B29L2031/3425 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/065 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913

摘要： A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.

摘要翻译： 电连接上布线与下布线的方法包括以下步骤：将上部布线与热软化材料混合在上绝缘片上，将下部布线与热软化材料混合在下绝缘片上，放入 上绝缘片在下绝缘片上，使上布线与下布线接触，并且向上下绝缘片和上绝缘片提供超声波振动，同时将上绝缘片向下绝缘片推动。 在这些步骤中，由于超声波振动产生摩擦热，上下布线和上绝缘片被加热熔化。 此后，将上绝缘片推入上下配线，同时将这些布线推向一边，并与下绝缘片接合。 此外，上布线与下布线接合，使得这些布线电连接。

公开(公告)号：US07505249B2

公开(公告)日：2009-03-17

申请号：US11709688

申请日：2007-02-23

申请人： Takashi Komatsu ,  Kouji Tanabe

发明人： Takashi Komatsu ,  Kouji Tanabe

IPC分类号： H01G4/06

CPC分类号： H01G4/30 ,  H01G4/2325 ,  Y10T29/42

摘要： The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion to a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly 10. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 20 has such constitution that a first electrode layer connected with the internal electrode, a second electrode layer (electroconductive resin layer) including a hardened product of thermohardening resin containing a polyphenol compound having a side chain composed of an aliphatic group, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

摘要翻译： 本发明的目的在于提供一种能够减少接合部到板等的裂纹的电子部件。作为电子部件的一个例子的电容器1（层叠陶瓷电容器）设置有元件组件10（陶瓷） 以及形成在元件组件10的两个侧表面上的一对外部电极20.在元件组件10中，电介质层12和内部电极14交替层叠。 外部电极20具有与内部电极连接的第一电极层，包含含有具有由脂肪族组成的侧链的多酚化合物的热硬化树脂的硬化物的第二电极层（导电性树脂层），第三电极层 从元件组装侧依次形成由Ni构成的电极层和由Sn构成的第四电极层。

公开(公告)号：US20070215379A1

公开(公告)日：2007-09-20

申请号：US11709773

申请日：2007-02-23

申请人： Takashi Komatsu ,  Kouji Tanabe

发明人： Takashi Komatsu ,  Kouji Tanabe

IPC分类号： H05K1/00

CPC分类号： H01G4/2325 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/0478

摘要： The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion with a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component of the present invention is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 14 has such constitution that a first electrode layer connected with the internal electrode 14, a second electrode layer (electroconductive resin layer) including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as the base compound, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.

摘要翻译： 本发明的目的在于提供一种能够减少与基板等的接合部分发生裂纹的电子部件。作为本发明的电子部件的一个例子的电容器1（层叠陶瓷电容器）设置有元件组件 10（陶瓷）和形成在元件组件的两个侧表面上的一对外部电极20。 在元件组件10中，交替层叠电介质层12和内部电极14。 外部电极14具有与内部电极14连接的第一电极层，包含含有分子量为2000以上的环氧化合物的环氧树脂的硬化物的多个环氧树脂的第二电极层（导电性树脂层） 作为基础化合物的组合物，由Ni构成的第三电极层和由Sn构成的第四电极层从元件组装侧依次形成。