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    LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME
    1.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME 审中-公开

    公开(公告)号：US20170104142A1

    公开(公告)日：2017-04-13

    申请号：US15382553

    申请日：2016-12-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sung Min KONG ,  Choong Youl KIM ,  Hee Seok CHOI

    IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/60 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A light emitting device package including a package body including a recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face, the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame including a first portion disposed on the bottom face of the package body and at least one second portion extending from the first portion, the first portion including a planar upper surface exposed at the bottom face and a planar lowermost surface positioned opposite to the planar upper surface; a light emitting element provided on the planar upper surface of the first portion; and a transparent material provided in the recess of the package body to cover the light emitting element. The at least one second portion includes an upper surface exposed at the first inner walls and a lower surface opposite to the upper surface; the lower surface of the at least one second portion includes a lower curved surface; the planar lowermost surface of the first portion is positioned lower than the lower curved surface of the at least one second portion; a stepped portion is positioned between the lower curved surface of the at least one second portion and the lowermost surface of the first portion; and the stepped portion contacts the package body.

    LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS
    2.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS 审中-公开
    发光装置和发光装置

    公开(公告)号：US20160049546A1

    公开(公告)日：2016-02-18

    申请号：US14925251

    申请日：2015-10-28

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Deok Ki HWANG ,  Young Ju HAN ,  Hee Seok CHOI ,  Ju Won LEE ,  Pil Geun KANG ,  Seok Beom CHOI

    IPC: H01L33/06 ,  H01L33/48 ,  H01L33/64 ,  H01L33/40 ,  H01L33/62 ,  H01L33/32 ,  H01L33/38 ,  H01L33/50 ,  H01L33/46

    CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/32 ,  H01L33/385 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/483 ,  H01L33/505 ,  H01L33/507 ,  H01L33/641 ,  H01L2224/16

    Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.

    Abstract translation: 可以提供一种发光器件，其包括衬底，发光结构，第一半导体层的一部分上的第一电极，第二导电半导体层上的电极层，电极层上的绝缘层，第二电极 在所述电极层上，所述绝缘层上的支撑构件，与所述第一电极连接的第一连接电极和与所述第二电极连接的第二连接电极。 绝缘层设置在发光结构的侧表面和第一半导体层的一部分上。 绝缘层包括具有与第一层不同的材料的第一层和第二层。 绝缘层的第一层具有与绝缘层的第二层不同的折射率。

    LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME
    3.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME 有权
    具有发光装置的灯具和灯具

    公开(公告)号：US20130049057A1

    公开(公告)日：2013-02-28

    申请号：US13662508

    申请日：2012-10-28

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sung Min KONG ,  Choong Youl KIM ,  Hee Seok CHOI

    IPC: H01L33/60

    CPC classification number: H01L33/60 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.

    Abstract translation: 公开了一种LED封装。 LED封装包括封装主体，封装主体上的第一框架和第二框架以及第一框架上的发光器件芯片。 第一框架与第二框架分离，并且第一框架包括封装主体上的底部框架和从底部框架延伸并相对于底部框架倾斜的至少两个侧壁框架。

    LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME
    4.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME 审中-公开
    具有发光装置的灯具和灯具

    公开(公告)号：US20160149102A1

    公开(公告)日：2016-05-26

    申请号：US14983294

    申请日：2015-12-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sung Min KONG ,  Choong Youl KIM ,  Hee Seok CHOI

    IPC: H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62

    CPC classification number: H01L33/60 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: Disclosed is a light emitting device package. The light emitting device is a package body including a first recess which is provided with a bottom face and a plurality of inner walls surrounding the bottom face the plurality of inner walls including a first inner wall and a second inner wall, which are opposing walls; a lead frame exposed at the bottom face of the package body, the lead frame including a bottom frame and a reflector exposed along one of the first inner wall and the second inner wall; a light emitting element provided on the lead frame; and a transparent material provided in the package body to cover the light emitting element. A material of the reflector is a same as a material of the bottom frame of the lead frame.

    Abstract translation: 公开了一种发光器件封装。 发光装置是包括第一凹部的封装主体，第一凹部设置有底面和围绕底面的多个内壁，所述多个内壁包括作为相对壁的第一内壁和第二内壁; 所述引线框架在所述封装主体的底面处露出，所述引线框架包括底框架和反射器，所述反射器沿着所述第一内壁和所述第二内壁中的一个露出; 设置在引线框架上的发光元件; 以及设置在封装主体中以覆盖发光元件的透明材料。 反射器的材料与引线框架的底部框架的材料相同。

    LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THE SAME
    8.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHT EMITTING APPARATUS HAVING THE SAME 审中-公开
    发光装置和具有该发光装置的发光装置

    公开(公告)号：US20150179884A1

    公开(公告)日：2015-06-25

    申请号：US14618599

    申请日：2015-02-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Pil Geun KANG ,  Hee Seok CHOI ,  Seok Beom CHOI ,  Ju Won LEE ,  Deok Ki HWANG ,  Young Ju HAN

    IPC: H01L33/22 ,  H01L33/50 ,  H01L33/40

    CPC classification number: H01L33/22 ,  H01L33/20 ,  H01L33/40 ,  H01L33/405 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/644 ,  H01L2224/16245 ,  H01L2924/01322 ,  H01L2924/00

    Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer, under the transmissive substrate; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode. A transmissive resin layer is on the transmissive substrate and an insulating layer is between the insulating support member and the reflective electrode layer.

    Abstract translation: 发光装置设置有透射基板; 包括突起的第一图案部分; 第二图案部分，其包括宽度小于每个突起的宽度的凹部; 包括第一导电半导体层，第二导电半导体层和有源层的发光结构; 在第一导电半导体层下方的第一电极; 第二导电半导体层下方的反射电极层; 反射电极层下方的第二电极; 第一电极下方的第一连接电极; 在第二电极下方的第二连接电极; 以及围绕所述第一电极和所述第一连接电极并且围绕所述第二电极和所述第二连接电极的绝缘支撑构件。 透射性树脂层位于透射性基板上，绝缘层位于绝缘支撑体与反射电极层之间。

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