公开(公告)号：US06392298B1

公开(公告)日：2002-05-21

申请号：US09514565

申请日：2000-02-28

申请人： Larry Leighton ,  Bengt Ahl ,  Thomas Moller ,  Henrik I. Hoyer

发明人： Larry Leighton ,  Bengt Ahl ,  Thomas Moller ,  Henrik I. Hoyer

IPC分类号： H01L2334

CPC分类号： H01L24/49 ,  H01L23/04 ,  H01L23/10 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01058 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A packaged integrated circuit device includes a substrate including a first circuit component mounted thereon, a first conductor extending from the first circuit component, and a dielectric lid. The dielectric lid includes a component mounting surface, a second circuit component mounted on the component mounting surface, and a second conductor extending from the second circuit component. The dielectric lid is adapted to engage with the substrate such that the first circuit component is in electrical communication with the second circuit component. The second circuit component may comprises an impedance matching circuit. The circuit device may also include fastening means for securing the lid to the substrate. The fastening means may comprise an adhesive, solder, or a spring biased member.

摘要翻译： 封装的集成电路器件包括：衬底，其包括安装在其上的第一电路部件，从第一电路部件延伸的第一导体和电介质盖。 电介质盖包括元件安装表面，安装在元件安装表面上的第二电路元件和从第二电路元件延伸的第二导体。 电介质盖适于与基板接合，使得第一电路部件与第二电路部件电连通。 第二电路部件可以包括阻抗匹配电路。 电路装置还可以包括用于将盖固定到基板的紧固装置。 紧固装置可以包括粘合剂，焊料或弹簧偏压构件。

公开(公告)号：US06777791B2

公开(公告)日：2004-08-17

申请号：US10119559

申请日：2002-04-10

申请人： Larry Leighton ,  Tom Moller ,  Bengt Ahl ,  Henrik Hoyer

发明人： Larry Leighton ,  Tom Moller ,  Bengt Ahl ,  Henrik Hoyer

IPC分类号： H01L2302

CPC分类号： H01L23/49861 ,  H01L23/49827 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A laterally diffused metal oxide semiconductor (LDMOS) power package includes a conductive mounting flange mounted on a heat sink and electrically connected to a dielectric substrate of a printed circuit board. A plurality of transistors are mounted on the top surface of the mounting flange. Each of the transistors has an input terminal, an output terminal, and a ground terminal, with the ground terminal of each transistor being electrically coupled to the top surface of the mounting flange. A plurality of parallel ground signal return paths are provided to electrically couple the top surface of the mounting flange to the dielectric substrate, thereby reducing resistance and inductance in the ground signal path and increasing the efficiency of the power package.

摘要翻译： 横向扩散的金属氧化物半导体（LDMOS）功率封装包括安装在散热器上并电连接到印刷电路板的电介质基板的导电安装凸缘。 多个晶体管安装在安装凸缘的顶表面上。 每个晶体管具有输入端子，输出端子和接地端子，每个晶体管的接地端子电耦合到安装凸缘的顶表面。 提供多个并联接地信号返回路径以将安装凸缘的顶表面电耦合到电介质基板，从而降低接地信号路径中的电阻和电感并提高功率封装的效率。

公开(公告)号：US06583673B2

公开(公告)日：2003-06-24

申请号：US09794803

申请日：2001-02-26

申请人： Bengt Ahl ,  Prasanth Perugupalli ,  Larry Leighton

发明人： Bengt Ahl ,  Prasanth Perugupalli ,  Larry Leighton

IPC分类号： H03F304

CPC分类号： H03F3/193 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/13055 ,  H01L2924/13091 ,  H03F2200/273 ,  H03F2200/411 ,  H03F2200/451 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multistage power amplifier circuit with superior isolation between gain stages provides alternative common lead currents paths from the individual gain stage elements to obtain improved stability and operational performance.

公开(公告)号：US06501159B2

公开(公告)日：2002-12-31

申请号：US09735533

申请日：2000-12-14

申请人： Lars-Anders Olofsson ,  Bengt Ahl

发明人： Lars-Anders Olofsson ,  Bengt Ahl

IPC分类号： H01L23495

CPC分类号： H01L23/66 ,  H01L23/4824 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or in a ground transmitter for TV or radio, wherein said power transistor module comprises a support plate, a power transistor chip arranged thereon, outer electrical connections projecting from the module for external connection and inner electrical connections connected between said transistor chip and said outer connections, at least one of said inner electrical connections comprising a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said module, a method in the fabrication of said module, a method in the fabrication of a power amplifier, where said module is electrically connected to a circuit board mounted at a heat sink and to be mounted at said heat sink, and finally to a power amplifier manufactured according to the method.

摘要翻译： 本发明涉及用于射频应用的功率晶体管模块，特别是用于无线电基站中的放大器级或用于电视或无线电的地面发射机中，其中所述功率晶体管模块包括支撑板，功率晶体管芯片 布置在其上，用于外部连接的模块突出的外部电连接和连接在所述晶体管芯片和所述外部连接之间的内部电连接，所述内部电连接中的至少一个包括布置在柔性箔上的第一导体图案。 本发明还包括功率放大器，包括所述模块，制造所述模块的方法，制造功率放大器的方法，其中所述模块电连接到安装在散热器上的电路板，并且安装在 所述散热器，最后是根据该方法制造的功率放大器。

公开(公告)号：US06580316B2

公开(公告)日：2003-06-17

申请号：US09735491

申请日：2000-12-14

申请人： Lars-Anders Olofsson ,  Bengt Ahl

发明人： Lars-Anders Olofsson ,  Bengt Ahl

IPC分类号： H03F100

CPC分类号： H01L23/66 ,  H01L23/36 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L25/165 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/363 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or a ground transmitter for TV or radio, wherein said power transistor module comprises a support, a power transistor chip arranged thereon, outer electrical connections projecting from the module, and inner electrical connections connected between said transistor chip and said outer connections, where at least one of said outer electrical connections is comprised of a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said power transistor module, a method for fabrication of a power amplifier, wherein said module is electrically connected to a circuit board mounted at a heat sink and is mounted at said heat sink, and finally a power amplifier manufactured according to the method.

摘要翻译： 本发明涉及一种用于射频应用的功率晶体管模块，特别是用于无线电基站中的放大器级或用于TV或无线电的地面发射机中的功率晶体管模块，其中所述功率晶体管模块包括支撑件，布置在其上的功率晶体管芯片 ，从模块突出的外部电连接以及连接在所述晶体管芯片和所述外部连接之间的内部电连接，其中所述外部电连接中的至少一个包括布置在柔性箔上的第一导体图案。 本发明还包括功率放大器，包括所述功率晶体管模块，制造功率放大器的方法，其中所述模块电连接到安装在散热器上的电路板，并且安装在所述散热器上，最后是功率放大器 根据该方法制造。

公开(公告)号：US06181006B2

公开(公告)日：2001-01-30

申请号：US09086667

申请日：1998-05-28

申请人： Bengt Ahl ,  Larry C. Leighton ,  Thomas W. Moller

发明人： Bengt Ahl ,  Larry C. Leighton ,  Thomas W. Moller

IPC分类号： H01L2334

CPC分类号： H01L23/433 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficient force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.

摘要翻译： 电气组件包括具有与散热器接触的导热安装凸缘的IC封装。 导热壳体固定到散热器，壳体至少部分地封装IC封装。 弹性保持构件设置在壳体和IC封装之间，保持构件在IC封装上施加足够的力，以保持安装法兰和散热器之间良好的热接触。

公开(公告)号：US5933327A

公开(公告)日：1999-08-03

申请号：US54973

申请日：1998-04-03

申请人： Larry C. Leighton ,  Thomas W. Moller ,  Bengt Ahl

发明人： Larry C. Leighton ,  Thomas W. Moller ,  Bengt Ahl

IPC分类号： H05K1/02 ,  H01L23/367 ,  H01L23/40 ,  H05K3/32 ,  H05K7/20

CPC分类号： H05K3/328 ,  H01L23/3677 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/351

摘要： A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The respective package leads are each connected to the corresponding PC board areas by one or more flexible bond wires. In addition to electrically connecting the package leads to the respective PC board sections, the bond wires collectively secure the package to the heat sink in a manner allowing for relative lateral movement between the respective flange and heat sink surfaces in response to thermal stresses.

摘要翻译： IC封装的导热安装凸缘直接放置在连接到散热器的单层PC板的相应部分之间的散热器表面上，使得从封装的相对侧延伸的电引线定位在形成于 相邻PC板部分的表面。 相应的封装引线通过一个或多个柔性接合线连接到相应的PC板区域。 除了将封装引线电连接到相应的PC板部分之外，接合线以一定的方式将封装固定到散热器，以允许响应于热应力在相应的凸缘和散热器表面之间的相对横向移动。

公开(公告)号：US06160710A

公开(公告)日：2000-12-12

申请号：US054972

申请日：1998-04-03

申请人： Bengt Ahl ,  Larry C. Leighton ,  Thomas W. Moller

发明人： Bengt Ahl ,  Larry C. Leighton ,  Thomas W. Moller

IPC分类号： H01L23/40 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/325 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10416 ,  H01L2924/00

摘要： A thermally conductive mounting flange of an IC package is placed directly on a heat sink surface between respective sections of single layer PC board attached to the heat sink, such that electrical leads extending from opposing sides of the package are positioned over corresponding conductive areas formed on the surface of the respective adjacent PC board section. The leads are electrically coupled with the conductive areas by respective tie-down screws fastened through dielectric isolating washers. The screws are tightened sufficiently against the isolating washers so as to press the respective package leads into solid electrical contact with the conductive areas. Portions of the respective leads and conductive areas surrounding the tie-down screws are cut-away to prevent electrical contact, in order to avoid shorting the leads and/or conductive areas to the heat sink via the tie-down screws. Alternately, respective ends of a retaining spring used to secure the IC package to the heat sink mounting flange are also secured by the package lead tie-down screws, such that the screws both secure the package against the heat sink and press the package leads into solid electrical contact with the respective conductive areas.

摘要翻译： IC封装的导热安装凸缘直接放置在连接到散热器的单层PC板的相应部分之间的散热器表面上，使得从封装的相对侧延伸的电引线定位在形成于 相邻PC板部分的表面。 引线通过通过介电隔离垫圈固定的相应的固定螺丝与导电区域电耦合。 螺钉被紧固到隔离垫圈上，以将相应的包装引线按压到与导电区域的固体电接触。 相应的引线和围绕固定螺钉的导电区域的部分被切除以防止电接触，以避免通过固定螺钉将引线和/或导电区域短路到散热器。 或者，用于将IC封装固定到散热器安装凸缘的固定弹簧的相应端部也通过封装引线固定螺钉固定，使得螺钉将封装固定在散热器上并将封装引线压入 与相应的导电区域固体电接触。

公开(公告)号：US5869897A

公开(公告)日：1999-02-09

申请号：US956193

申请日：1997-10-22

申请人： Larry C. Leighton ,  Thomas W. Moller ,  Bengt Ahl

发明人： Larry C. Leighton ,  Thomas W. Moller ,  Bengt Ahl

IPC分类号： H01L23/40 ,  H05K7/00 ,  H01L23/00 ,  H05K7/20

CPC分类号： H01L23/40 ,  H01L2924/0002

摘要： A top surface of a protective cover of an IC component package is provided with a centered-protrusion, e.g., such as a cylindrical peg, that extends above the cover. A retaining-spring is formed by twisting a resilient (e.g., metal) metal strip into a ribbon-like shape having opposing ends that extend from a curvelinear bottom surface. The bottom surface of the retaining-spring is provided with an opening configured to mate with the centered protrusion on the package cover, such that the opposing ends of the retaining-spring extend away from the package cover at substantially the same, albeit reverse angles. In order to mount the IC package to a heat sink, the bottom surface of the retaining-spring may be compressively mated onto the package cover at the same time the package is inserted between two substantially parallel walls protruding from the heat sink surface, wherein the walls are distanced from each other. just so as to cause moderate compression of the opposing ends of the spring toward each other as the package is inserted against the heat sink surface. The opposing surfaces of the two walls are provided with a plurality of notches formed substantially parallel to the heat sink surface in a "ratchet-type" relief pattern, such that the opposing ends of the retaining-spring are held into place by respective notches, once the IC package is secured against the heat sink.

摘要翻译： IC组件封装的保护盖的顶表面设置有在盖上延伸的中心突起，例如圆柱形钉。 通过将弹性（例如，金属）金属条扭转成具有相对端部的带状形状来形成保持弹簧，所述相对端部从光栅底表面延伸。 保持弹簧的底表面设置有开口，该开口构造成与包装盖上的中心突出部配合，使得保持弹簧的相对端部基本上以相反的角度延伸离开包装盖。 为了将IC封装安装到散热器，保持弹簧的底表面可以压缩地配合到封装盖上，同时将封装插入从散热器表面突出的两个基本平行的壁之间，其中 墙壁彼此远离。 只是当包装被插入散热器表面时，使弹簧的相对端部彼此相应地适度地压缩。 两个壁的相对表面设置有以“棘轮型”浮雕图案基本上平行于散热器表面形成的多个凹口，使得保持弹簧的相对端部通过相应的凹口保持就位， 一旦IC封装固定在散热片上。