SEMICONDUCTOR PACKAGE ASSEMBLY
    2.
    发明申请

    公开(公告)号:US20160260659A1

    公开(公告)日:2016-09-08

    申请号:US15048807

    申请日:2016-02-19

    Applicant: MediaTek Inc.

    Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer is disposed on the die-attach surface. The first solder mask layer surrounds the semiconductor die. An additional circuit structure is disposed on a portion of the first solder mask, surrounding the semiconductor die. The additional circuit structure includes a pad portion having a first width and a via portion has a second width that is less than the first width. The via portion passes through the first solder mask layer to be coupled the redistribution layer (RDL) structure.

    Abstract translation: 本发明提供一种半导体封装组件。 半导体封装组件包括再分配层(RDL)结构裸片附着表面和与裸片附着表面相对的凸起附着表面。 半导体管芯安装在再分配层(RDL)结构的管芯附接表面上。 第一焊料掩模层设置在裸片附着表面上。 第一焊料掩模层围绕半导体管芯。 附加电路结构设置在第一焊料掩模的围绕半导体管芯的部分上。 附加电路结构包括具有第一宽度的焊盘部分和通孔部分具有小于第一宽度的第二宽度。 通孔部分穿过第一焊料掩模层以耦合再分布层(RDL)结构。

    PROBE CARD ASSEMBLY
    5.
    发明申请

    公开(公告)号:US20220196706A1

    公开(公告)日:2022-06-23

    申请号:US17509347

    申请日:2021-10-25

    Applicant: MEDIATEK INC.

    Inventor: Tung-Hsien HSIEH

    Abstract: A probe card assembly includes a circuit board, a substrate, and at least one passive component. The substrate is disposed opposite and connected to the circuit board. The circuit board has a first opening facing the substrate and/or the substrate has a second opening facing the circuit board. The at least one passive component is disposed between the circuit board and the substrate and is at least partially accommodated in at least one of the first opening and the second opening.

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