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12 条记录 (耗时 0.04 秒)

    LASER PROCESSING APPARATUS
    4.
    发明申请
    LASER PROCESSING APPARATUS 审中-公开
    激光加工设备

    公开(公告)号：US20130182727A1

    公开(公告)日：2013-07-18

    申请号：US13823469

    申请日：2011-07-25

    申请人： Akihisa Matsumoto ,  Naoya Yamazaki ,  Akihiro Tahara

    发明人： Akihisa Matsumoto ,  Naoya Yamazaki ,  Akihiro Tahara

    IPC分类号： H01S3/067

    CPC分类号： B23K26/702 ,  B23K26/082 ,  B23K26/352

    摘要： A laser marking apparatus is provided with a laser emission unit that emits laser beam and a laser radiation unit that is detachably connected to the laser emission unit. The laser radiation unit radiates the laser beam emitted from the laser emission unit toward an object to be processed. A projection, which projects rearward, is formed on a part of the laser radiation unit that is connected with the laser emission unit. A recess is provided in a part of the laser emission unit that is connected with the laser radiation unit. The projection can fit into the recess. The recess is opened forward, backward, to lateral sides, and downward.

    摘要翻译： 激光打标装置设置有发射激光束的激光发射单元和可拆卸地连接到激光发射单元的激光辐射单元。 激光辐射单元将从激光发射单元发射的激光束朝向被处理物体辐射。 在与激光发射单元连接的激光辐射单元的一部分上形成有向后突出的突起。 在与激光辐射单元连接的激光发射单元的一部分中设置有凹部。 突起可以嵌入凹槽中。 凹槽向前，向后，向外侧向下打开。

    Light emitting module and method for manufacturing the same
    5.
    发明授权
    Light emitting module and method for manufacturing the same 失效
    发光模块及其制造方法

    公开(公告)号：US07999190B2

    公开(公告)日：2011-08-16

    申请号：US12238251

    申请日：2008-09-25

    申请人： Sadamichi Takakusaki ,  Koichiro Ono ,  Akihisa Matsumoto

    发明人： Sadamichi Takakusaki ,  Koichiro Ono ,  Akihisa Matsumoto

    IPC分类号： H05K1/16

    CPC分类号： H05K1/056 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48465 ,  H01L2224/73265 ,  H05K3/002 ,  H05K3/0032 ,  H05K2201/0989 ,  H05K2201/10106 ,  Y10T29/49169 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, in the light emitting module, an insulating layer is removed in a region where the conductive pattern is not formed, but is left unremoved in a region right below (or covered with) the conductive pattern. In other words, in the region where the conductive pattern is not formed, the upper surface of the metal substrate is not covered with the conductive pattern, and a metal material constituting the metal substrate is exposed.

    摘要翻译： 提供：具有改善的散热特性并防止其反射率降低的发光模块。 发光模块主要包括：金属基板; 形成在所述金属基板的上表面上的导电图案; 以及设置在金属基板的上表面并电连接到导电图案的发光元件。 此外，在发光模块中，在未形成导电图案的区域中去除绝缘层，但在导电图案的正下方（或被覆盖）的区域中不会去除绝缘层。 换句话说，在未形成导电图案的区域中，金属基板的上表面不被导电图案覆盖，并且构成金属基板的金属材料露出。

    LIGHT EMITTING MODULE AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    LIGHT EMITTING MODULE AND MANUFACTURING METHOD THEREOF 审中-公开
    发光模块及其制造方法

    公开(公告)号：US20110121335A1

    公开(公告)日：2011-05-26

    申请号：US12674564

    申请日：2008-08-28

    申请人： Sadamichi Takakusaki ,  Tatsuya Motoike ,  Akihisa Matsumoto

    发明人： Sadamichi Takakusaki ,  Tatsuya Motoike ,  Akihisa Matsumoto

    IPC分类号： H01L33/60 ,  H01L33/48

    CPC分类号： H01L24/97 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2933/0058 ,  H05K1/021 ,  H05K1/056 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Provided are a light emitting module and a manufacturing method thereof, the light emitting module having improved heat radiation properties and improved adhesion between a sealing resin for sealing a light emitting element and other members. A light emitting module 10 includes: a metal substrate 12; a concave part 18 provided by partially denting an upper surface of the metal substrate 12; a light emitting element 20 accommodated in the concave part 18; and a sealing resin 32 covering the light emitting element 20. A convex part 11 is further provided on the upper surface of the metal substrate 40 in a region thereof surrounding the concave part 18. The sealing resin 32 is allowed to adhere to the convex part 11, thereby improving adhesion strength between the sealing resin 32 and the metal substrate 12.

    摘要翻译： 提供了一种发光模块及其制造方法，该发光模块具有改善的散热性能和用于密封发光元件的密封树脂与其它构件之间的改善的粘合性。 发光模块10包括：金属基板12; 通过部分地凹入金属基板12的上表面而设置的凹部18; 容纳在凹部18中的发光元件20; 以及覆盖发光元件20的密封树脂32.在围绕凹部18的区域中，在金属基板40的上表面上还设置有凸部11。密封树脂32被粘附到凸部 从而提高密封树脂32和金属基板12之间的粘合强度。

    Light emitting element
    10.
    发明授权
    Light emitting element 失效
    发光元件

    公开(公告)号：US07531844B2

    公开(公告)日：2009-05-12

    申请号：US10529725

    申请日：2003-09-29

    申请人： Akihisa Matsumoto ,  Tatsuya Motoike ,  Toshinori Nakahara

    发明人： Akihisa Matsumoto ,  Tatsuya Motoike ,  Toshinori Nakahara

    IPC分类号： H01L29/22 ,  H01L29/227

    CPC分类号： H01L33/60 ,  H01L23/49861 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01S5/02244 ,  H01S5/024 ,  H01L2924/00014

    摘要： A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.

    摘要翻译： 发光元件包括：由绝缘材料形成且在其内部具有空间的盒状壳体; 由导电材料形成并固定到壳体上的引线框架; 以及固定到引线框架的发光芯片。 在引线框架上，在壳体的侧壁或侧壁的内表面上形成上升部分。 引线框架具有固定发光芯片的第一引线框架和通过引线接合连接到发光芯片的第二引线框架。 至少在第一引线框架上形成上升部分。