公开(公告)号：US5287272A

公开(公告)日：1994-02-15

申请号：US420105

申请日：1989-10-11

申请人： Mark R. Rutenberg ,  Thomas L. Hall ,  Robert Domes ,  Richard Chaban ,  Thomas Dulak ,  James M. Herriman ,  John Porzio ,  Randall L. Luck ,  James Knapp

发明人： Mark R. Rutenberg ,  Thomas L. Hall ,  Robert Domes ,  Richard Chaban ,  Thomas Dulak ,  James M. Herriman ,  John Porzio ,  Randall L. Luck ,  James Knapp

IPC分类号： G01N33/49 ,  G01N15/14 ,  G06F15/18 ,  G06F19/00 ,  G06K9/00 ,  G06N3/04 ,  G06N99/00 ,  G06Q50/00 ,  G06T1/00 ,  G06F15/42 ,  G06K9/62

CPC分类号： G06K9/00134 ,  G01N15/1468 ,  G06K9/00147 ,  G06N3/04 ,  G01N15/1475 ,  G01N2015/1488 ,  Y10S128/925 ,  Y10S706/924

摘要： An automated screening system and method for cytological specimen classification in which a neural network is utilized in performance of the classification function. Also included is an automated microscope and associated image processing circuitry.

摘要翻译： 一种用于细胞学标本分类的自动筛选系统和方法，其中使用神经网络来执行分类功能。 还包括自动显微镜和相关的图像处理电路。

公开(公告)号：US20120171469A1

公开(公告)日：2012-07-05

申请号：US11942212

申请日：2007-11-19

申请人： Tetyana P. Shmyreva ,  James Knapp ,  Ardy Simon Kleyman

发明人： Tetyana P. Shmyreva ,  James Knapp ,  Ardy Simon Kleyman

IPC分类号： B32B3/00 ,  C23C4/04 ,  C23C4/08 ,  C09D1/00 ,  C22C45/00 ,  C23C4/10 ,  B82Y40/00 ,  B82Y30/00

CPC分类号： C23C4/06 ,  C23C4/04 ,  C23C4/08 ,  C23C4/10 ,  C23C4/11 ,  C23C4/123 ,  C23C4/126 ,  Y10T428/26

摘要： This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).

摘要翻译： 本发明涉及具有非晶纳米晶体 - 微晶组合物结构的热喷镀涂层，所述热喷镀涂层包括约1-约95体积％的无定形相，约1-约80体积％的纳米晶相和 约1至约90体积％的微晶相，并且其中所述非晶相，纳米晶相和微晶相包含约100体积％的所述热喷涂涂层。 本发明还涉及用于生产涂层的方法，用于生产涂层的热喷涂方法和涂覆有涂层的制品。 本发明的喷涂涂层对恶劣环境（例如起落架，机架，球阀，闸阀（门和座），罐式辊和用于纸张处理的工作辊）中使用的制品提供增强的耐磨性和耐腐蚀性。

公开(公告)号：US20050285262A1

公开(公告)日：2005-12-29

申请号：US10524894

申请日：2002-09-10

申请人： James Knapp ,  Francis Carney ,  Harold Anderson ,  Yenting Wen ,  Cang Ngo

发明人： James Knapp ,  Francis Carney ,  Harold Anderson ,  Yenting Wen ,  Cang Ngo

IPC分类号： H01L21/44 ,  H01L23/34 ,  H01L23/495 ,  H01L23/522

CPC分类号： H01L24/85 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/5227 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85047 ,  H01L2224/8517 ,  H01L2224/85181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.

摘要翻译： 半导体器件（10）包括半导体管芯（20）和形成有连接到半导体管芯的顶表面（21）的接合线（80）的电感器（30,50）。 接合线横向延伸大于其高度（H 30，H 50）的距离（L 30，L 150）以限定绝缘芯（31,57）。 在一个实施例中，电感器延伸超过半导体管芯的边缘（35,39）以减少负载。

公开(公告)号：US08465602B2

公开(公告)日：2013-06-18

申请号：US11942212

申请日：2007-11-19

申请人： Tetyana P. Shmyreva ,  James Knapp ,  Ardy Simon Kleyman

发明人： Tetyana P. Shmyreva ,  James Knapp ,  Ardy Simon Kleyman

IPC分类号： C22C45/00 ,  C22C29/12

CPC分类号： C23C4/06 ,  C23C4/04 ,  C23C4/08 ,  C23C4/10 ,  C23C4/11 ,  C23C4/123 ,  C23C4/126 ,  Y10T428/26

摘要： This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).

摘要翻译： 本发明涉及具有非晶纳米晶体 - 微晶组合物结构的热喷镀涂层，所述热喷镀涂层包括约1-约95体积％的无定形相，约1-约80体积％的纳米晶相和 约1至约90体积％的微晶相，并且其中所述非晶相，纳米晶相和微晶相包含约100体积％的所述热喷涂涂层。 本发明还涉及用于生产涂层的方法，用于生产涂层的热喷涂方法和涂覆有涂层的制品。 本发明的喷涂涂层对恶劣环境（例如起落架，机架，球阀，闸阀（门和座），罐式辊和用于纸张处理的工作辊）中使用的制品提供增强的耐磨性和耐腐蚀性。

公开(公告)号：US20050127482A1

公开(公告)日：2005-06-16

申请号：US10729892

申请日：2003-12-08

申请人： Joseph Fauty ,  James Knapp ,  James Letterman

发明人： Joseph Fauty ,  James Knapp ,  James Letterman

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/495 ,  H05K3/00

CPC分类号： H01L21/565 ,  H01L23/49541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a leadframe and a semiconductor package using the leadframe facilitates selectively forming leads for the package. The leadframe is formed with a first portion of the leads extending from a panel of the leadframe into a molding cavity section of the leadframe. After encapsultaion, a portion of the leadframe panel is used to form a second portion of the leads that is external to the package body.

摘要翻译： 使用引线框形成引线框和半导体封装的方法有助于选择性地形成用于封装的引线。 引线框形成有引线的第一部分从引线框架的面板延伸到引线框架的模制腔部分中。 在封装之后，引线框板的一部分用于形成在封装主体外部的引线的第二部分。

公开(公告)号：US06713317B2

公开(公告)日：2004-03-30

申请号：US10215279

申请日：2002-08-12

申请人： James Knapp ,  Stephen St. Germain

发明人： James Knapp ,  Stephen St. Germain

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/552 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A method of making a semiconductor device (100) by attaching a top surface of a first laminate (630) to a bottom surface of a second laminate (650) to form a leadframe (620) and mounting a semiconductor die (102) to the leadframe to form the semiconductor device. The first semiconductor die is encapsulated with a molding compound (108) and material is removed from the first laminate to form a mold lock (120) with the molding compound.

摘要翻译： 一种通过将第一层压体（630）的顶表面附接到第二层压体（650）的底表面以形成引线框架（620）并将半导体管芯（102）安装到第二层压体（620）上来制造半导体器件（100）的方法， 引线框架形成半导体器件。 第一半导体管芯用模制化合物（108）封装，并且从第一层压体移除材料以与模塑料形成模具锁（120）。

公开(公告)号：US20110193963A1

公开(公告)日：2011-08-11

申请号：US13021239

申请日：2011-02-04

申请人： Jamie Hess ,  James Knapp ,  Ron M. Bean ,  David R. Forbes

发明人： Jamie Hess ,  James Knapp ,  Ron M. Bean ,  David R. Forbes

IPC分类号： H04N5/225 ,  H04N5/76 ,  H04N7/18

CPC分类号： H04N5/77 ,  H04N5/2252 ,  H04N5/23203 ,  H04N21/4147 ,  H04N21/4223 ,  H04N21/43637

摘要： An article of eyewear includes an eyeglass frame having an integrally formed camera enclosure, and an imaging sensor disposed within the camera enclosure. The eyeglass frame may have a camouflage pattern. A system for recording video includes an eyeglass frame having an integrally formed camera enclosure, an imaging sensor disposed within the camera enclosure, and a wireless transceiver disposed within the eyeglass frame. A method of documenting a hunt using an article of eyewear is provided. The method includes providing the article of eyewear, the article of eyewear comprising (a) an eyeglass frame having an integrally formed camera enclosure, (b) an imaging sensor disposed within the camera enclosure, and (c) wherein the eyeglass frame having a camouflage pattern. The method further includes activating a video recording functionality of the article of eyewear during the hunt and video recording the hunt using the article of eyewear.

摘要翻译： 眼镜物品包括具有整体形成的相机外壳的眼镜架和设置在相机外壳内的成像传感器。 眼镜架可以具有伪装图案。 用于记录视频的系统包括具有整体形成的相机外壳的眼镜框架，设置在相机外壳内的成像传感器和设置在眼镜框内的无线收发器。 提供了使用眼镜制品记录狩猎的方法。 该方法包括提供眼镜制品，眼镜制品包括（a）具有整体形成的相机外壳的眼镜架，（b）设置在照相机外壳内的成像传感器，以及（c）其中眼镜架具有伪装 模式。 该方法还包括在使用眼镜物品的寻线和视频记录寻找期间激活眼镜物品的视频记录功能。

公开(公告)号：US20060134836A1

公开(公告)日：2006-06-22

申请号：US10548563

申请日：2003-04-29

申请人： James Knapp ,  Jay Yoder ,  Harold Anderson

发明人： James Knapp ,  Jay Yoder ,  Harold Anderson

IPC分类号： H01L21/50 ,  H01L21/44

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.

摘要翻译： 半导体器件（10）通过将半导体管芯（14）的底表面（31,44,54）和引线（15,17）安装在带（12）上并在其中的孔（19）上方形成 胶带。 当引线的顶表面（43）引线接合到半导体管芯的顶表面（32）时，通过孔抽出真空以将管芯固定就位。 形成模塑材料（49）以封装半导体管芯的顶表面并露出其底表面。

公开(公告)号：US06835580B1

公开(公告)日：2004-12-28

申请号：US10603258

申请日：2003-06-26

申请人： James Knapp ,  Kok Yang Lau ,  Beng Lian Lim ,  Guan Keng Quah

发明人： James Knapp ,  Kok Yang Lau ,  Beng Lian Lim ,  Guan Keng Quah

IPC分类号： H01L2166

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/492 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05124

摘要： A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).

摘要翻译： 一种用于形成直接芯片连接（DCA）装置（1）的方法包括将芯片（3）附接到引线框架（2）。 导电螺柱（22）附接到芯片（3）上的接合焊盘（13）和引线框架（2）上的标志（18）。 芯片（3）和标记（18）用封装层（4）封闭，并且在上表面（7）中形成开口（6）以露出导电柱钉（22）。 在一个实施例中，将掩模层（51）施加到引线框架（2），然后将该结构放置在化学镀设备（61）中。 在电镀装置（61）中，注射装置（66）朝向上表面（7）注入电镀液（71）和开口（6），以增强导电柱（22）上的阻挡层（24）的形成， 。 焊接凸起（9）然后通过开口（6）附接到阻挡层（24）。

公开(公告)号：US09487854B2

公开(公告)日：2016-11-08

申请号：US13895936

申请日：2013-05-16

申请人： Tetyana P. Shmyreva ,  James Knapp ,  Ardy Simon Kleyman

发明人： Tetyana P. Shmyreva ,  James Knapp ,  Ardy Simon Kleyman

IPC分类号： C23C4/06 ,  C23C4/04 ,  C23C4/08 ,  C23C4/10

CPC分类号： C23C4/06 ,  C23C4/04 ,  C23C4/08 ,  C23C4/10 ,  C23C4/11 ,  C23C4/123 ,  C23C4/126 ,  Y10T428/26

摘要： This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).