公开(公告)号：US06284640B1

公开(公告)日：2001-09-04

申请号：US09427807

申请日：1999-10-27

申请人： Masahiro Ono ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Kazuo Eda

发明人： Masahiro Ono ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Kazuo Eda

IPC分类号： H01L2144

CPC分类号： H01L24/85 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/81191 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method for a semiconductor device using a wire bonding method using a metal wire. In the wire bonding method, an impact load applied when a metal ball formed at the tip of the metal wire by electric discharge is brought into contact with a terminal electrode of a semiconductor device is smaller than a static load applied after the metal ball is brought into contact with the terminal electrode. The method makes it possible to prevent an element or wiring from being damaged while securing the pressure necessary for bonding the metal ball to the terminal electrode even when the terminal electrode is placed on the element or the wiring.

摘要翻译： 一种使用金属线的引线接合方法的半导体器件的制造方法。 在引线接合方法中，当通过放电在金属线的前端形成的金属球与半导体器件的端子电极接触时施加的冲击载荷小于在金属球被带入之后施加的静态载荷 与端子电极接触。 该方法使得即使当将端子电极放置在元件或布线上时，也可以确保将金属球接合到端子电极所需的压力，从而防止元件或布线损坏。

公开(公告)号：US20050163982A1

公开(公告)日：2005-07-28

申请号：US11039778

申请日：2005-01-24

申请人： Masahiro Ono ,  Tsukasa Shiraishi

发明人： Masahiro Ono ,  Tsukasa Shiraishi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  B32B3/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

摘要翻译： 本发明旨在提供一种当将半导体器件封装在电路基板上时，防止半导体器件的特性劣化以及互连断裂的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构中，半导体器件的突起电极被放置在电路基板的输入/输出端子电极上，并通过与导电粘合剂结合而电连接和机械连接，半导体器件 通过预先形成在电路基板的主体的表面上的树脂膜粘结固定在电路基板上。 与使用常规的各向异性导电膜等的结构相比，该结构不会损坏半导体功能部件和互连，并且允许以较低的负载进行安装。

公开(公告)号：US06909180B2

公开(公告)日：2005-06-21

申请号：US10030739

申请日：2001-05-11

申请人： Masahiro Ono ,  Tsukasa Shiraishi

发明人： Masahiro Ono ,  Tsukasa Shiraishi

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H01L23/495

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.

摘要翻译： 本发明旨在提供一种当将半导体器件封装在电路基板上时，防止半导体器件的特性劣化以及互连断裂的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构中，半导体器件的突起电极被放置在电路基板的输入/输出端子电极上，并通过与导电粘合剂结合而电连接和机械连接，半导体器件 通过预先形成在电路基板的主体的表面上的树脂膜粘结固定在电路基板上。 与使用常规的各向异性导电膜等的结构相比，该结构不会损坏半导体功能部件和互连，并且允许以较低的负载进行安装。

公开(公告)号：US5844320A

公开(公告)日：1998-12-01

申请号：US812754

申请日：1997-03-06

申请人： Masahiro Ono ,  Yoshihiro Bessho

发明人： Masahiro Ono ,  Yoshihiro Bessho

IPC分类号： C09J163/00 ,  H01L21/56 ,  H01L21/60 ,  H05K3/32 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/11 ,  H01L24/16 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321

摘要： A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.

摘要翻译： 一种半导体单元，其中具有突出电极的半导体器件通过由至少两种导电粘合剂制成的接合层面向下安装到电路板的端子电极上，以及制造半导体单元的方法。

公开(公告)号：US6103551A

公开(公告)日：2000-08-15

申请号：US943758

申请日：1997-10-03

申请人： Masahiro Ono ,  Yoshihiro Bessho

发明人： Masahiro Ono ,  Yoshihiro Bessho

IPC分类号： C09J163/00 ,  H01L21/56 ,  H01L21/60 ,  H05K3/32 ,  H01L21/44

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/11 ,  H01L24/16 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321

摘要： A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.

摘要翻译： 一种半导体单元，其中具有突出电极的半导体器件通过由至少两种导电粘合剂制成的接合层面向下安装到电路板的端子电极上，以及制造半导体单元的方法。

公开(公告)号：US09072204B2

公开(公告)日：2015-06-30

申请号：US13384502

申请日：2010-07-15

申请人： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Masahiro Ono ,  Hidenori Miyakawa

发明人： Ryo Kuwabara ,  Atsushi Yamaguchi ,  Masahiro Ono ,  Hidenori Miyakawa

IPC分类号： H05K3/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L25/16 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0218 ,  H05K1/0313 ,  H05K2203/1316

摘要： An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.

摘要翻译： 电子模块10包括：具有第一表面和与第一表面相对的第二表面的电路板12; 以及安装在其上的多个电子部件14。 电子部件14被密封在电路板12的第一表面，模具体16由树脂组合物构成。 屏蔽层28形成在模体16的表面上。包括在模体16中的树脂的玻璃化转变温度分别高于包括在电路板12和屏蔽层28中的树脂的玻璃化转变温度 。 模具体在25℃下的弹性模量为10〜18GPa，电路基板的厚度为0.3〜1.0mm。

公开(公告)号：US09044520B2

公开(公告)日：2015-06-02

申请号：US13434722

申请日：2012-03-29

申请人： Hideo Saji ,  Hiroyuki Kimura ,  Masahiro Ono ,  Ikuya Seki

发明人： Hideo Saji ,  Hiroyuki Kimura ,  Masahiro Ono ,  Ikuya Seki

IPC分类号： A61K51/00 ,  A61M36/14 ,  A61K51/08

CPC分类号： A61K51/088 ,  G01N2800/042

摘要： Embodiments of the invention provide a compound accumulating in an inflammatory site, a diagnostic agent containing the compound in labeled state and its precursor compound for labeling. Such a compound accumulating in inflammatory site may be represented by the following formula (1): Z—Y-Leu-Phe-(X)n-DLys(-(DLys)m-HalB)-(DLys)k-NH2  (1) wherein in the formula (1), Z represents a protective group for an amino group; Y represents Met or Nle; X represents a spacer consisting of one or more of amino acid and/or synthetic organic compounds; n represents 1 or 0; m represents 1 or 0; k represents 1 or 0; and HalB represents a substituted benzoic acid having a radioactive halogen in an aromatic ring.

摘要翻译： 本发明的实施方案提供了一种在炎症部位中积聚的化合物，含有标记状态的化合物的诊断剂及其用于标记的前体化合物。 Z-Y-Leu-Phe-（X）n-DLys（ - （DLys）m-HalB） - （DLys）k-NH 2（1）的化合物可以由下述式（1）表示： ）其中在式（1）中，Z表示氨基的保护基; Y表示Met或Nle; X表示由一种或多种氨基酸和/或合成有机化合物组成的间隔物; n表示1或0; m表示1或0; k表示1或0; HalB表示在芳香环中具有放射性卤素的取代苯甲酸。

公开(公告)号：US20130149252A1

公开(公告)日：2013-06-13

申请号：US13818392

申请日：2011-08-08

申请人： Isao Hara ,  Eiichi Ozeki ,  Hideo Saji ,  Shunsaku Kimura ,  Masahiro Ono ,  Takashi Temma

发明人： Isao Hara ,  Eiichi Ozeki ,  Hideo Saji ,  Shunsaku Kimura ,  Masahiro Ono ,  Takashi Temma

IPC分类号： A61K49/00

CPC分类号： A61K49/0089 ,  A61K49/0032 ,  A61K49/0093 ,  Y10S977/773 ,  Y10S977/927

摘要： The present invention provides a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye during nanoparticle preparation, and emit fluorescence during imaging). A switching fluorescent nanoparticle probe comprising: a molecular assembly composed of an amphiphilic block polymer having a hydrophilic block chain and a hydrophobic block chain; and a fluorescent dye encapsulated in the molecular assembly, wherein (a) the hydrophilic block chain comprises, as an essential hydrophilic structural unit, a unit selected from a sarcosine unit and an alkylene oxide unit, (b) the hydrophobic block chain comprises, as an essential hydrophobic structural unit, a unit selected from the group consisting of an amino acid unit and a hydroxylic acid unit, and (c) the fluorescent dye is a cyanine compound represented by the formula (I): and two or more molecules of the fluorescent dye are encapsulated in the single molecular assembly.

摘要翻译： 本发明提供了具有开关功能（在纳米颗粒制备期间淬灭荧光染料并在成像期间发射荧光的功能）的新型荧光纳米颗粒成像探针。 一种开关荧光纳米颗粒探针，包括：由具有亲水嵌段链和疏水性嵌段链的两亲嵌段聚合物组成的分子组合; 以及包封在分子组合中的荧光染料，其中（a）所述亲水性嵌段链包含作为必需亲水性结构单元的选自肌氨酸单元和烯化氧单元的单元，（b）所述疏水性嵌段链包含： 必需的疏水结构单元，选自氨基酸单元和羟基酸单元的单元，和（c）荧光染料是由式（I）表示的花青化合物：和 荧光染料被封装在单分子组装中。

公开(公告)号：US20120330024A1

公开(公告)日：2012-12-27

申请号：US13582047

申请日：2011-02-24

申请人： Hideo Saji ,  Masahiro Ono ,  Ikuya Seki

发明人： Hideo Saji ,  Masahiro Ono ,  Ikuya Seki

IPC分类号： C07D405/06 ,  C07F7/22 ,  C07D405/14 ,  C07D417/06 ,  C07D417/14

CPC分类号： C07D417/06 ,  A61K51/0453 ,  C07D405/06 ,  C07D405/14

摘要： The present invention is a compound represented by the following formula (1) or a salt thereof. Furthermore, the present invention is an imaging agent used for imaging a tau protein, the imaging agent containing a compound represented by the formula (1) below or a salt thereof. In the formula (1), R3 is a radioactive iodine.

摘要翻译： 本发明是由下式（1）表示的化合物或其盐。 此外，本发明是用于成像tau蛋白的成像剂，该成像剂含有下述式（1）表示的化合物或其盐。 在式（1）中，R 3是放射性碘。

公开(公告)号：US20120253010A1

公开(公告)日：2012-10-04

申请号：US13434722

申请日：2012-03-29

申请人： Hideo Saji ,  Hiroyuki Kimura ,  Masahiro Ono ,  Ikuya Seki

发明人： Hideo Saji ,  Hiroyuki Kimura ,  Masahiro Ono ,  Ikuya Seki

IPC分类号： C07K7/06

CPC分类号： A61K51/088 ,  G01N2800/042

摘要： Embodiments of the invention provide a compound accumulating in an inflammatory site, a diagnostic agent containing the compound in labeled state and its precursor compound for labeling. Such a compound accumulating in inflammatory site may be represented by the following formula (1): Z—Y-Leu-Phe-(X)n-DLys(-(DLys)m-HalB)-(DLys)k-NH2  (1) wherein in the formula (1), Z represents a protective group for an amino group; Y represents Met or Nle; X represents a spacer consisting of one or more of amino acid and/or synthetic organic compounds; n represents 1 or 0; m represents 1 or 0; k represents 1 or 0; and HalB represents a substituted benzoic acid having a radioactive halogen in an aromatic ring.

摘要翻译： 本发明的实施方案提供了一种在炎症部位中积聚的化合物，含有标记状态的化合物的诊断剂及其用于标记的前体化合物。 Z-Y-Leu-Phe-（X）n-DLys（ - （DLys）m-HalB） - （DLys）k-NH 2（1）的化合物可以由下述式（1）表示： ）其中在式（1）中，Z表示氨基的保护基; Y表示Met或Nle; X表示由一种或多种氨基酸和/或合成有机化合物组成的间隔物; n表示1或0; m表示1或0; k表示1或0; HalB表示在芳香环中具有放射性卤素的取代苯甲酸。