摘要:
A control system for an internal combustion engine having at least one fuel injection valve for injecting fuel to an intake pipe or a combustion chamber of the engine. Intake gas state parameters indicative of a state of the intake gases supplied to the engine are detected. Demand values of the intake gas state parameters are calculated according to operating condition parameters indicative of an operating condition of the engine. The intake gas state is controlled so that the intake gas state parameters coincide with the demand values. A control value is then calculated according to the operating condition parameters and deviations of the intake gas state parameters from the demand values. Accordingly, an amount of fuel injected by the at least one fuel injection valve is controlled according to the control value.
摘要:
A control system for an internal combustion engine having at least one fuel injection valve for injecting fuel to an intake pipe or a combustion chamber of the engine. Intake gas state parameters indicative of a state of the intake gases supplied to the engine are detected. Demand values of the intake gas state parameters are calculated according to operating condition parameters indicative of an operating condition of the engine. The intake gas state is controlled so that the intake gas state parameters coincide with the demand values. A control value is then calculated according to the operating condition parameters and deviations of the intake gas state parameters from the demand values. Accordingly, an amount of fuel injected by the at least one fuel injection valve is controlled according to the control value.
摘要:
[Problem] A method for manufacturing a bent hollow pipe is provided, in which even when a three-dimensionally bent pipe is formed, a gap, an uneven thickness, and the like would not occur at contact portions at the ends of both of the flange portions when press work is finished, and thus a pipe having the high quality contact portions can be formed.[Solution] In a method for manufacturing a bent hollow pipe, a material W, which is to be processed and which is a flat plate extending a first plane formed by a first direction and a second direction perpendicular to the first direction, is pressed in a stepwise manner using a plurality of forming dies from a third direction perpendicular to the first plane, so that two sides of a second plane formed by the second direction and the third direction of the material W are brought into contact with each other, and the bent hollow pipe is made to be bent and extend in a three dimensional manner that is bent in the first plane and in the second plane. The method includes a step in which a push out portion 13 is formed that is pushed out onto the material W in the third direction and that is bent and extends within a third plane formed by the first direction and the third direction in a press work, and extension portions 15 are formed to extend away from each other at both sides which sandwich the push out portion 13 of the material W, and flange portions 16 are formed that are bent, in a direction opposite to a push out direction of the push out portion 13, at ends of the extension portions 15, a step in which while bending is maintained between the extension portions 15 and the flange portions 16, a bent portions 17 between the push out portion 13 and the extension portions 15 are bent in the opposite directions, so that the both of the flange portions 16 are formed in a direction in which the both of the flange portions 16 face each other, a step in which the both of the flange portions 16 of a three-dimensionally bent portion P that is bent in the first plane and in the second plane are bent and brought closer to each other as compared with both of the flange portions 16 in a portion other than the three-dimensionally bent portion P, and a step of bringing ends of the flange portions 16 into contact with each other.
摘要:
A group III nitride semiconductor optical device 11a has a group III nitride semiconductor substrate 13 having a main surface 13a forming a finite angle with a reference plane Sc orthogonal to a reference axis Cx extending in a c-axis direction of the group III nitride semiconductor and an active layer 17 of a quantum-well structure, disposed on the main surface 13a of the group III nitride semiconductor substrate 13, including a well layer 28 made of a group III nitride semiconductor and a plurality of barrier layers 29 made of a group III nitride semiconductor. The main surface 13a exhibits semipolarity. The active layer 17 has an oxygen content of at least 1×1017 cm−3 but not exceeding 8×1017 cm−3. The plurality of barrier layers 29 contain an n-type impurity other than oxygen by at least 1×1017 cm−3 but not exceeding 1×1019 cm−3 in an upper near-interface area 29u in contact with a lower interface 28Sd of the well layer 28 on the group III nitride semiconductor substrate side.
摘要:
The semiconductor device is formed in the form of a GaN-based stacked layer including an n-type drift layer 4, a p-type layer 6, and an n-type top layer 8. The semiconductor device includes a regrown layer 27 formed so as to cover a portion of the GaN-based stacked layer that is exposed to an opening 28, the regrown layer 27 including a channel. The channel is two-dimensional electron gas formed at an interface between the electron drift layer and the electron supply layer. When the electron drift layer 22 is assumed to have a thickness of d, the p-type layer 6 has a thickness in the range of d to 10d, and a graded p-type impurity layer 7 whose concentration decreases from a p-type impurity concentration in the p-type layer is formed so as to extend from a (p-type layer/n-type top layer) interface to the inside of the n-type top layer.
摘要:
Disclosed herein is a suspension arm component for vehicles with sufficient strength or rigidity to withstand repetitive compressive and tensile forces, and a method for manufacturing such a component by pressing or hemming process alone, without recourse to any welding process, forming quickly and simply, a process with advantages in terms of material yield and cost. The suspension arm component for vehicles includes first flange pieces as well as second flange pieces, and a pair of half members, each having a hat-like shaped cross-section perpendicular to its axis, are joined together to protrude the first flange part and the second flange part from an expanded part, where both the first flange part and the second flange part extend linearly along the axis of the main body part. The main body part presents a rectangular shape in its side view.
摘要:
A vertical semiconductor device in which pinch-off characteristics and breakdown voltage characteristics can be stably improved by fixing the electric potential of a p-type GaN barrier layer with certainty is provided. The semiconductor device includes a GaN-based stacked layer having an opening, a regrown layer including a channel located so as to cover a wall surface of the opening, an n+-type source layer that is in ohmic contact with the source electrode, a p-type GaN barrier layer, and a p+-type GaN-based supplementary layer located between the p-type GaN barrier layer and the n+-type source layer. The p+-type GaN-based supplementary layer and the n+-type source layer form a tunnel junction to fix the electric potential of the p-type GaN barrier layer at a source potential.
摘要翻译:提供了通过确定地固定p型GaN势垒层的电位可以稳定地提高夹断特性和击穿电压特性的垂直半导体器件。 半导体器件包括具有开口的GaN基层叠层,包含覆盖开口壁面的沟道的再生长层,与源电极欧姆接触的n +型源极,p 位于p型GaN势垒层和n +型源极层之间的p +型GaN基辅助层。 p +型GaN基辅助层和n +型源极层形成隧道结,以将p型GaN阻挡层的电位固定在源极电位。
摘要:
A method of fabricating a III-nitride semiconductor laser device includes: preparing a substrate product, where the substrate product has a laser structure, the laser structure includes a semiconductor region and a substrate of a hexagonal III-nitride semiconductor, the substrate has a semipolar primary surface, and the semiconductor region is formed on the semipolar primary surface; scribing a first surface of the substrate product to form a scribed mark, the scribed mark extending in a direction of an a-axis of the hexagonal III-nitride semiconductor; and after forming the scribed mark, carrying out breakup of the substrate product by press against a second region of the substrate product while supporting a first region of the substrate product but not supporting the second region thereof, to form another substrate product and a laser bar.
摘要:
A gallium nitride-based semiconductor laser device with reduced threshold current. The gallium nitride-based semiconductor laser device is provided with an n-type cladding layer, an n-side light guide layer, an active layer, a p-side light guide layer, and a p-type cladding layer. The n-side light guide layer and the p-side light guide layer both contain indium. Each of indium compositions of the n-side light guide layer and the p-side light guide layer is not less than 2% and not more than 6%. A film thickness of the n-type cladding layer is in the range of not less than 65% and not more than 85% of a total of the film thickness of the n-type cladding layer and a film thickness of the p-type cladding layer 23.
摘要:
A III-nitride semiconductor device has a support base comprised of a III-nitride semiconductor and having a primary surface extending along a first reference plane perpendicular to a reference axis inclined at a predetermined angle with respect to a c-axis of the III-nitride semiconductor, and an epitaxial semiconductor region provided on the primary surface of the support base. The epitaxial semiconductor region includes GaN-based semiconductor layers. The reference axis is inclined at a first angle from the c-axis of the III-nitride semiconductor toward a first crystal axis, either the m-axis or a-axis. The reference axis is inclined at a second angle from the c-axis of the III-nitride semiconductor toward a second crystal axis, the other of the m-axis and a-axis. Morphology of an outermost surface of the epitaxial semiconductor region includes a plurality of pits. A pit density of the pits is not more than 5×104 cm−2.