公开(公告)号：US20140000948A1

公开(公告)日：2014-01-02

申请号：US13980393

申请日：2012-01-17

申请人： Shunsuke Nagai ,  Masato Miyatake ,  Tomohiko Kotake ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

发明人： Shunsuke Nagai ,  Masato Miyatake ,  Tomohiko Kotake ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC分类号： C08G77/14 ,  H05K1/03 ,  C08L83/06

CPC分类号： C08G77/14 ,  C08G73/0655 ,  C08G77/26 ,  C08G77/388 ,  C08J5/24 ,  C08J2379/08 ,  C08K5/13 ,  C08K5/18 ,  C08K5/3415 ,  C08K5/3445 ,  C08L79/085 ,  C08L83/06 ,  H05K1/0313 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0162 ,  C08L83/08 ,  C08L63/00 ,  C08L79/04

摘要： There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

摘要翻译： 提供了一种树脂组合物，其包括：（a）每个分子结构具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; 和（b）每分子结构具有至少一个氨基的硅氧烷化合物，并且还提供通过使用该树脂组合物形成的预浸料，层压板和印刷线路板。 通过使用由本发明的树脂组合物得到的预浸料的层压成型而制造的层压板，制成的多层印刷布线板具有优异的玻璃化转变温度，热膨胀系数，焊料耐热性和翘曲特性。 多层印刷线路板可用作电子设备的高度集成印刷线路板。

公开(公告)号：US20130330563A1

公开(公告)日：2013-12-12

申请号：US13980385

申请日：2012-01-17

申请人： Tomohiko Kotake ,  Masato Miyatake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

发明人： Tomohiko Kotake ,  Masato Miyatake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC分类号： C08K5/544 ,  C09D163/00

CPC分类号： C08K5/544 ,  C08G73/0273 ,  C08G73/125 ,  C08G77/388 ,  C08J5/24 ,  C08J2379/08 ,  C08L63/00 ,  C08L79/085 ,  C08L83/08 ,  C09D163/00 ,  C09D183/08 ,  H05K1/0346 ,  H05K3/389 ,  H05K2201/0162 ,  Y10T428/31663

摘要： There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device.

摘要翻译： 提供了通过使（A）由通式（1）表示的硅氧烷二胺反应制备的改性硅氧烷化合物。 （B）分子结构中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; 和（C）具有酸性取代基的胺化合物; 并且还提供通过使用该化合物形成的热固性树脂组合物，预浸料，层压板和印刷线路板。 通过使用通过使用由改性硅酮化合物获得的预浸料和通过层压成型的本发明的热固性树脂组合物形成的层压板制造的多层印刷线路板具有优异的玻璃化转变温度，热膨胀系数，铜箔 粘附性，吸湿性，吸湿性焊料耐热性和铜焊接耐热性。 因此，多层印刷布线板可用作高度集成的半导体封装和用于电子器件的印刷线路板。

公开(公告)号：US09133308B2

公开(公告)日：2015-09-15

申请号：US13980393

申请日：2012-01-17

申请人： Shunsuke Nagai ,  Masato Miyatake ,  Tomohiko Kotake ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

发明人： Shunsuke Nagai ,  Masato Miyatake ,  Tomohiko Kotake ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC分类号： C08G77/26 ,  C08G77/14 ,  C08J5/24 ,  C08L79/08 ,  H05K1/03 ,  C08L83/06 ,  C08K5/13 ,  C08K5/18 ,  C08K5/3415 ,  C08K5/3445 ,  C08G73/06 ,  C08G77/388

CPC分类号： C08G77/14 ,  C08G73/0655 ,  C08G77/26 ,  C08G77/388 ,  C08J5/24 ,  C08J2379/08 ,  C08K5/13 ,  C08K5/18 ,  C08K5/3415 ,  C08K5/3445 ,  C08L79/085 ,  C08L83/06 ,  H05K1/0313 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0162 ,  C08L83/08 ,  C08L63/00 ,  C08L79/04

摘要： There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.

摘要翻译： 提供了一种树脂组合物，其包括：（a）每个分子结构具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物; 和（b）每分子结构具有至少一个氨基的硅氧烷化合物，并且还提供通过使用该树脂组合物形成的预浸料，层压板和印刷线路板。 通过使用由本发明的树脂组合物得到的预浸料的层压成型而制造的层压板，制成的多层印刷布线板具有优异的玻璃化转变温度，热膨胀系数，焊料耐热性和翘曲特性。 多层印刷线路板可用作电子设备的高度集成印刷线路板。

公开(公告)号：US08735733B2

公开(公告)日：2014-05-27

申请号：US13352819

申请日：2012-01-18

申请人： Masato Miyatake ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

发明人： Masato Miyatake ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC分类号： E04B1/78 ,  B32B27/04 ,  B32B27/34 ,  H05K1/00

CPC分类号： H05K1/0353 ,  C08G77/14 ,  C08G77/26 ,  C08G77/28 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/18 ,  C08K5/3415 ,  C08L83/06 ,  C08L83/08 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T442/2721

摘要： Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board.A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

摘要翻译： 公开了一种树脂组合物，其含有（a）在分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物和（b）在其分子结构中具有至少一个反应性有机基团的硅氧烷化合物; 和使用其的预浸料，层压体和印刷线路板。 具有优异的耐热性和低热膨胀性的树脂组合物; 并且可以提供预浸料，层压板和使用其的印刷线路板。

公开(公告)号：US20120247820A1

公开(公告)日：2012-10-04

申请号：US13352819

申请日：2012-01-18

申请人： Masato MIYATAKE ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

发明人： Masato MIYATAKE ,  Tomohiko Kotake ,  Shunsuke Nagai ,  Shintaro Hashimoto ,  Yasuo Inoue ,  Shin Takanezawa ,  Hikari Murai

IPC分类号： E04B1/78 ,  B32B27/04 ,  B32B27/34 ,  H05K1/00

CPC分类号： H05K1/0353 ,  C08G77/14 ,  C08G77/26 ,  C08G77/28 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/18 ,  C08K5/3415 ,  C08L83/06 ,  C08L83/08 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T442/2721

摘要： Disclosed are a resin composition containing (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure thereof; and a prepreg using the same, a laminate, and a printed wiring board.A resin composition having excellent heat resistance and low thermal expansion properties; and a prepreg, a laminate, and a printed wiring board using the same can be provided.

摘要翻译： 公开了一种树脂组合物，其含有（a）在分子结构中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物和（b）在其分子结构中具有至少一个反应性有机基团的硅氧烷化合物; 和使用其的预浸料，层压体和印刷线路板。 具有优异的耐热性和低热膨胀性的树脂组合物; 并且可以提供预浸料，层压板和使用其的印刷线路板。

公开(公告)号：US09079376B2

公开(公告)日：2015-07-14

申请号：US13352783

申请日：2012-01-18

申请人： Tomohiko Kotake ,  Masato Miyatake ,  Shunsuke Nagai ,  Hiroyuki Izumi ,  Shinji Tsuchikawa ,  Shin Takanezawa ,  Hikari Murai

发明人： Tomohiko Kotake ,  Masato Miyatake ,  Shunsuke Nagai ,  Hiroyuki Izumi ,  Shinji Tsuchikawa ,  Shin Takanezawa ,  Hikari Murai

IPC分类号： B32B17/00 ,  B32B17/02 ,  B32B25/20 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/20 ,  C08J5/24

CPC分类号： B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/04 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/734 ,  B32B2457/08 ,  C08J5/24 ,  C08J2300/24 ,  Y10T428/249921 ,  Y10T428/31525 ,  Y10T428/31612

摘要： Disclosed is a prepreg including a fiber substrate and a layer made of a thermosetting resin composition, wherein the layer made of a thermosetting resin composition contains a modified silicone oil or a compound having a skeleton derived from a modified silicone oil, and the layer made of a thermosetting resin composition has a phase separation structure.A prepreg having excellent low thermal expansion properties and warpage characteristics which are difficult to be realized by using only a conventional resin which is effective for highly filling an inorganic filler or has a low coefficient of thermal expansion, and a laminate using the same, and a printed wiring board can be provided.

摘要翻译： 公开了一种预浸料，其包括纤维基材和由热固性树脂组合物制成的层，其中由热固性树脂组合物制成的层包含改性硅油或具有衍生自改性硅油的骨架的化合物，并且由 热固性树脂组合物具有相分离结构。 具有优异的低热膨胀特性和翘曲特性的预浸料，其难以通过仅使用有效用于高填充无机填料或具有低热膨胀系数的常规树脂和使用其的层压体而实现， 可以提供印刷电路板。

公开(公告)号：US20120077401A1

公开(公告)日：2012-03-29

申请号：US13258763

申请日：2010-03-26

申请人： Tomohiko Kotake ,  Shinji Tsuchikawa ,  Hiroyuki Izumi ,  Masato Miyatake ,  Shin Takanezawa ,  Hikari Murai ,  Tetsurou Irino

发明人： Tomohiko Kotake ,  Shinji Tsuchikawa ,  Hiroyuki Izumi ,  Masato Miyatake ,  Shin Takanezawa ,  Hikari Murai ,  Tetsurou Irino

IPC分类号： B32B27/42 ,  C08K5/3492 ,  B32B5/02 ,  C08L63/00 ,  C08L61/14 ,  B32B27/38 ,  C08K5/3445 ,  C08K13/02

CPC分类号： C09D179/085 ,  B32B5/02 ,  B32B5/24 ,  B32B15/14 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/283 ,  B32B27/325 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/536 ,  B32B2307/714 ,  B32B2307/7265 ,  B32B2457/08 ,  C08G59/5073 ,  C08J5/24 ,  C08L63/00 ,  C08L79/085 ,  C09D163/00 ,  H05K1/0353 ,  Y10T428/24802 ,  Y10T428/249921 ,  Y10T428/31721 ,  Y10T442/2721 ,  C08L79/08

摘要： A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

摘要翻译： 一种热固性树脂组合物，其含有：（A）具有不饱和马来酰亚胺基团的树脂组合物，其通过（a）每分子具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物与（b）具有至少两个 每个分子中的伯氨基，在有机溶剂中; （B）热固性树脂; 和（C）改性的咪唑化合物，例如异氰酸酯掩蔽的咪唑和环氧屏蔽的咪唑，以及预浸料，具有载体的绝缘膜，层压板和印刷线路板，各自含有它们。

公开(公告)号：US20120276392A1

公开(公告)日：2012-11-01

申请号：US13518578

申请日：2010-12-24

申请人： Yoshihiro Takahashi ,  Yasuo Kamigata ,  Hikari Murai ,  Masahiro Aoshima ,  Shinji Tsuchikawa ,  Masato Miyatake ,  Tomohiko Kotake ,  Hiroyuki Izumi

发明人： Yoshihiro Takahashi ,  Yasuo Kamigata ,  Hikari Murai ,  Masahiro Aoshima ,  Shinji Tsuchikawa ,  Masato Miyatake ,  Tomohiko Kotake ,  Hiroyuki Izumi

IPC分类号： C08K5/3415 ,  C09D163/00 ,  B32B15/092 ,  B05D5/00 ,  B32B15/08 ,  C08L63/00 ,  B32B37/14

CPC分类号： C09D163/04 ,  B32B15/08 ,  B32B27/04 ,  B32B27/18 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08K3/013 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K5/3415 ,  C08K13/02 ,  C08K2003/2206 ,  C08K2003/2227 ,  C08K2003/2255 ,  C08K2003/2296 ,  C08L63/00 ,  C09D7/61 ,  C09D7/63 ,  C09D163/00 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0047 ,  H05K2201/0129 ,  H05K2201/0209 ,  Y10T156/10 ,  Y10T428/31529 ,  Y10T428/31678

摘要： Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

摘要翻译： 公开了含有包含具有特定化学结构的不饱和马来酰亚胺化合物，热固性树脂，无机填料和钼化合物的马来酰亚胺化合物的热固性树脂组合物; 通过用含有热固性树脂，二氧化硅和特定的钼化合物的热固性树脂组合物涂覆基底材料然后进行半固化以形成预浸料而获得的布线板层叠板，并且对预浸料进行层压和模塑; 以及包括特定步骤的树脂组合物清漆的制造方法。 根据本发明，可以提供具有低热膨胀性能和优异的钻孔加工性和耐热性的电子部件，例如预浸料，层压板，插入件等。

公开(公告)号：US20100279129A1

公开(公告)日：2010-11-04

申请号：US12810387

申请日：2008-06-19

申请人： Shinji Tsuchikawa ,  Masanori Akiyama ,  Tomohiko Kotake

发明人： Shinji Tsuchikawa ,  Masanori Akiyama ,  Tomohiko Kotake

IPC分类号： B32B15/08 ,  C08K5/3492

CPC分类号： C08K5/5333 ,  B32B5/02 ,  B32B15/092 ,  B32B15/20 ,  B32B2457/08 ,  C08G59/56 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/04 ,  C08K3/22 ,  C08K3/32 ,  C08K3/36 ,  C08K2003/2227 ,  C08L63/00 ,  C08L63/04 ,  C08L2201/02 ,  C09J163/00 ,  C09J163/04 ,  C09J2205/102 ,  H05K1/0353 ,  Y10T428/31678

摘要： The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

摘要翻译： 本发明提供一种热固性树脂组合物，其包含（A）二取代次膦酸的金属盐，（B）分子中具有N-取代的马来酰亚胺基的马来酰亚胺化合物，（C）6-取代的胍胺化合物或双氰胺和（ D）在分子中具有至少两个环氧基的环氧树脂和通过使用它们制备的预浸料和层压板。 通过用本发明的热固性树脂组合物浸渍或涂覆基材获得的预浸料和通过层压和模塑上述预浸料制成的层压板均具有铜箔粘合性，玻璃化转变温度，焊料热 电阻，吸湿性，阻燃性，相对介电常数和介电损耗角正切，并且它们可用作电子仪器的印刷线路板。

公开(公告)号：US09603244B2

公开(公告)日：2017-03-21

申请号：US12443260

申请日：2007-09-10

申请人： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

发明人： Shinji Tsuchikawa ,  Tomohiko Kotake ,  Masanori Akiyama

IPC分类号： B32B15/08 ,  C08G59/40 ,  H05K1/03 ,  C08G59/50 ,  C08G73/12 ,  C08L63/00 ,  C08L79/08 ,  B32B15/092 ,  B32B15/14 ,  C08L25/08

CPC分类号： H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4021 ,  C08G59/4042 ,  C08G59/506 ,  C08G59/5086 ,  C08G73/12 ,  C08G73/124 ,  C08J5/24 ,  C08J2363/04 ,  C08J2363/08 ,  C08J2423/22 ,  C08J2425/08 ,  C08L25/08 ,  C08L63/00 ,  C08L63/04 ,  C08L63/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/31678 ,  C08L2666/04

摘要： The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition.