公开(公告)号：US5276132A

公开(公告)日：1994-01-04

申请号：US847758

申请日：1992-03-04

申请人： Michinori Nishikawa ,  Tsuyoshi Miyamoto ,  Yasuaki Yokoyama ,  Yasuo Matsuki

发明人： Michinori Nishikawa ,  Tsuyoshi Miyamoto ,  Yasuaki Yokoyama ,  Yasuo Matsuki

IPC分类号： C08G73/10 ,  C09K19/56 ,  G02F1/1337 ,  C09K19/00 ,  G02F1/133

CPC分类号： G02F1/133723 ,  C08G73/1017 ,  C09K19/56 ,  Y10T428/1023

摘要： A liquid crystal aligning agent containing a polymer selected from the group consisting of a polyamic acid having a steroidal skeleton and an imidized product thereof; and a liquid crystal display device to which the liquid crystal aligning agent is applied.

摘要翻译： 一种含有选自具有甾族骨架的聚酰胺酸和其酰亚胺化产物的聚合物的液晶取向剂; 以及应用液晶取向剂的液晶显示装置。

公开(公告)号：US06875518B2

公开(公告)日：2005-04-05

申请号：US10168104

申请日：2001-10-16

申请人： Hiroshi Shiho ,  Hitoshi Kato ,  Yasuo Matsuki ,  Satoshi Ebata ,  Yoichiro Maruyama ,  Yasuaki Yokoyama

发明人： Hiroshi Shiho ,  Hitoshi Kato ,  Yasuo Matsuki ,  Satoshi Ebata ,  Yoichiro Maruyama ,  Yasuaki Yokoyama

IPC分类号： C07F15/00 ,  B32B15/04 ,  B32B9/00 ,  C07F17/02 ,  C23C16/00

CPC分类号： C07F15/0046 ,  Y10T428/31678

摘要： A composition capable of forming a metal ruthenium film and a ruthenium oxide film by a simple application/baking process, a process for forming a metal ruthenium film and a ruthenium oxide film from the composition, a metal ruthenium film and a ruthenium oxide film formed by the process, and electrodes formed of the films.A solution composition comprising a specific ruthenium complex. The coating film of this solution composition is heated in an atmosphere containing no oxygen or an atmosphere containing oxygen to form a metal ruthenium film or a ruthenium oxide film, respectively, and electrodes formed of the films.

摘要翻译： 通过简单的涂布/烘烤法，能够形成金属钌膜和氧化钌膜的组合物，从组合物形成金属钌膜和氧化钌膜的方法，金属钌膜和氧化钌膜由 该方法和由该膜形成的电极。一种包含特定钌络合物的溶液组合物。 该溶液组合物的涂膜在不含氧的气氛或含氧的气氛中分别加热，形成金属钌膜或氧化钌膜，由电极形成电极。

公开(公告)号：US06846513B2

公开(公告)日：2005-01-25

申请号：US10028712

申请日：2001-12-28

申请人： Masahiro Furusawa ,  Satoru Miyashita ,  Ichio Yudasaka ,  Tatsuya Shimoda ,  Yasuaki Yokoyama ,  Yasuo Matsuki ,  Yasumasa Takeuchi

发明人： Masahiro Furusawa ,  Satoru Miyashita ,  Ichio Yudasaka ,  Tatsuya Shimoda ,  Yasuaki Yokoyama ,  Yasuo Matsuki ,  Yasumasa Takeuchi

IPC分类号： C23C16/24 ,  B32B9/04 ,  C23C16/04 ,  C23C16/448 ,  H01L21/205

CPC分类号： C23C16/042 ,  B82Y30/00 ,  C23C16/24 ,  C23C16/4481 ,  H01L21/0237 ,  H01L21/02422 ,  H01L21/02439 ,  H01L21/02499 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02628 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02661

摘要： Provided is a method of forming a silicon thin-film which comprises a step of arranging in one or more parts of a liquid arranging surface liquid which contains a silicide comprising ring silane and/or a derivative thereof, such ring silane comprising silicon and hydrogen, and a step of forming a silicon thin-film by vaporizing silicide from liquid and supplying the silicide to a thin-film-forming surface.

摘要翻译： 提供一种形成硅薄膜的方法，其包括在一个或多个部分中布置包含硅烷和/或其衍生物的硅化物的液体排列表面液体的步骤，所述硅烷包括硅和氢， 以及通过从液体中蒸发硅化物并将硅化物供给到薄膜形成表面来形成硅薄膜的步骤。

公开(公告)号：US06953600B2

公开(公告)日：2005-10-11

申请号：US10410154

申请日：2003-04-10

申请人： Yasuaki Yokoyama ,  Yasuo Matsuki ,  Ikuo Sakono ,  Kazuki Kobayashi ,  Yasumasa Takeuchi

发明人： Yasuaki Yokoyama ,  Yasuo Matsuki ,  Ikuo Sakono ,  Kazuki Kobayashi ,  Yasumasa Takeuchi

IPC分类号： C23C18/08 ,  C23C18/10 ,  C23C18/14 ,  C23C18/16 ,  H01B5/14 ,  H01B13/00 ,  H01J9/02 ,  H01L21/288 ,  H01L21/768 ,  H01L23/498 ,  H05K3/10 ,  H05K3/24 ,  B05D5/12

CPC分类号： H01L21/76838 ,  C23C18/08 ,  H01L21/288 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/105 ,  Y10T428/24917 ,  H01L2924/00

摘要： There are provided a conductive film forming composition capable of forming wiring or an electrode which can be suitably used in a variety of electronic devices, easily and inexpensively, a method for forming a film using the composition, a conductive film formed by the method, and wiring or an electrode which comprises the film.A conductive film forming composition comprising a complex of an amine compound and aluminum hydride and an organic solvent is applied on a substrate and then subjected to a heat treatment and/or irradiation with light, whereby a conductive film such as an electrode or wiring is produced.

摘要翻译： 提供能够容易且廉价地形成布线或电极的导电膜形成组合物，其可以适用于各种电子器件，使用该组合物形成膜的方法，通过该方法形成的导电膜，以及 布线或包括该膜的电极。 将包含胺化合物和氢化铝的复合物和有机溶剂的导电膜形成组合物施加在基材上，然后进行热处理和/或光照射，由此产生诸如电极或布线的导电膜 。

公开(公告)号：US20060257667A1

公开(公告)日：2006-11-16

申请号：US10542358

申请日：2003-12-24

申请人： Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Yasuo Matsuki

发明人： Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Yasuo Matsuki

IPC分类号： C22C21/02 ,  B32B9/00

CPC分类号： C23C18/08

摘要： A composition for forming a silicon.aluminum film, containing a silicon compound and an aluminum compound. The silicon.aluminum film is obtained by forming a coating film of the above composition and treating it with heat and/or light. The silicon.aluminum film can easily be formed from the above composition by the above method at a low cost without requiring an expensive vacuum apparatus or high-frequency wave generator.

摘要翻译： 一种用于形成含硅化合物和铝化合物的硅铝膜的组合物。 硅铝膜通过形成上述组成的涂膜并用热和/或光进行处理而获得。 通过上述方法可以以低成本容易地由上述组成形成硅铝膜，而不需要昂贵的真空装置或高频波发生器。

公开(公告)号：US20070082965A1

公开(公告)日：2007-04-12

申请号：US10536909

申请日：2003-11-13

申请人： Kyouyu Yasuda ,  Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Nobuo Bessho

发明人： Kyouyu Yasuda ,  Yasuaki Yokoyama ,  Michiko Yokoyama ,  Naomi Shinoda ,  Risa Yokoyama ,  Nobuo Bessho

IPC分类号： C08G59/68

CPC分类号： G03F7/038

摘要： It is an object of the present invention to provide a novel photo-curing composition which can be cured by light of a wide wavelength region including ultraviolet light or visible light, has such high sensitivity that it can be sufficiently cured by exposure to a small amount of light, can favorably form a fine pattern when used as a resist and provides a cured product having excellent heat resistance and insulating properties, and a negative photoresist composition using the photo-curing composition. It is another object of the present invention to provide a process for highly accurately and easily producing a polyimide thin film used for a medical instrument, and a medical instrument having the polyimide thin film. The photo-curing composition of the present invention comprises (A) a carbon cluster and/or its derivative, having a photosensitizing function, (B) a compound having plural heterocyclic rings in a molecule, and if necessary, (C) a photo-insensitive resin.

摘要翻译： 本发明的目的是提供一种可通过包括紫外光或可见光在内的宽波长区域的光固化的新型光固化组合物，具有这样高的灵敏度，可以通过暴露于少量来充分固化 光可以有利地形成精细图案，并且提供具有优异的耐热性和绝缘性的固化产物，以及使用光固化组合物的负性光致抗蚀剂组合物。 本发明的另一个目的是提供一种用于高度准确且容易地制造用于医疗器械的聚酰亚胺薄膜和具有该聚酰亚胺薄膜的医疗器械的方法。 本发明的光固化性组合物包含（A）具有光敏作用的碳簇和/或其衍生物，（B）分子中具有多个杂环的化合物，根据需要，（C） 不敏感树脂。

公开(公告)号：US06423463B1

公开(公告)日：2002-07-23

申请号：US09516211

申请日：2000-02-29

申请人： Masaru Oota ,  Isamu Mochizuki ,  Kouichi Hirose ,  Yasuaki Yokoyama ,  Hozumi Sato

发明人： Masaru Oota ,  Isamu Mochizuki ,  Kouichi Hirose ,  Yasuaki Yokoyama ,  Hozumi Sato

IPC分类号： G03F7023

CPC分类号： G03F7/0236 ,  G03F7/0226 ,  G03F7/0233 ,  H05K3/0076 ,  H05K3/243

摘要： A positive-tone photosensitive resin composition for forming a thick film which is suitably used for photofabrication such as manufacture of circuit boards, a photosensitive resin film, and a method of forming a bump using the same. The photosensitive resin composition comprising (A) a novolac resin with a weight average molecular weight of 2,000-30,000, (B) a polyvinyl lower alkyl ether, (C) a polyphenol derivative compound with a molecular weight of 200-1,000, and (D) a compound containing a naphthoquinonediazido group.

摘要翻译： 用于形成适合用于光加工的厚膜的正性感光性树脂组合物，例如电路板的制造，感光性树脂膜以及使用其形成凸块的方法。 所述感光性树脂组合物含有（A）重均分子量为2,000〜30,000的酚醛清漆树脂，（B）聚乙烯基低级烷基醚，（C）分子量为200〜1,000的多酚衍生物化合物和（D ）含有萘醌二叠氮基的化合物。

公开(公告)号：US5530036A

公开(公告)日：1996-06-25

申请号：US356544

申请日：1994-12-15

申请人： Kimiyasu Sano ,  Masayuki Endo ,  Atsufumi Shimada ,  Yasuaki Yokoyama ,  Nobuo Bessho

发明人： Kimiyasu Sano ,  Masayuki Endo ,  Atsufumi Shimada ,  Yasuaki Yokoyama ,  Nobuo Bessho

IPC分类号： C08G81/00 ,  C08F2/50 ,  C08F220/04 ,  C08F220/32 ,  C08F222/04 ,  H05K3/28 ,  C08K5/04 ,  C08K5/06 ,  C08L33/14

CPC分类号： C08F220/32 ,  C08F220/04 ,  C08F222/04 ,  H05K3/287

摘要： An epoxy group-containing thermosetting resin composition comprising (A) a copolymer obtained From (a) at least one member selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, (b) an epoxy group-containing unsaturated compound, (c) a monoolefin unsaturated compound, and optionally (d) a conjugated diolefin unsaturated compound, and (B) an organic solvent for dissolving the above copolymer. There is also provided another epoxy-group containing thermosetting resin composition which contains the above component (A), (C) a polymerizable compound having at least one ethylenically unsaturated double bond, and (D) a photopolymerization initiator. These epoxy-group containing thermosetting resin compositions are excellent in storage stability.

摘要翻译： 含有环氧基的热固性树脂组合物，其包含（A）从（a）至少一种选自不饱和羧酸和不饱和羧酸酐的成分得到的共聚物，（b）含环氧基的不饱和化合物，（c） 单烯烃不饱和化合物和任选的（d）共轭二烯不饱和化合物，和（B）用于溶解上述共聚物的有机溶剂。 还提供另一种含环氧基的热固性树脂组合物，其含有上述组分（A），（C）具有至少一个烯属不饱和双键的可聚合化合物和（D）光聚合引发剂。 这些含环氧基的热固性树脂组合物的保存稳定性优异。

公开(公告)号：US20070135543A1

公开(公告)日：2007-06-14

申请号：US10580456

申请日：2004-11-25

申请人： Kyouyu Yasuda ,  Nobuyuki Itou ,  Yasuaki Yokoyama ,  Michiko Yokoyama

发明人： Kyouyu Yasuda ,  Nobuyuki Itou ,  Yasuaki Yokoyama ,  Michiko Yokoyama

IPC分类号： C09J7/02

CPC分类号： C09J11/06 ,  C08K5/05

摘要： [Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300° C., and has a melting temperature width of not more than 30° C. and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group.

摘要翻译： [问题]为了提供用于将半导体晶片等固定到基板上的粘合剂组合物，在晶片研磨阶段中显示出牢固的粘合性，并且通过加热熔化，从而能够在晶片完成之后容易地剥离 研磨阶段。 解决问题的手段本发明的热熔粘合剂组合物是以熔融温度为50〜300℃，熔融温度为30℃以下的结晶化合物为主要成分的组合物 C.熔体粘度不大于0.1Pa·s。 作为主要成分的结晶化合物优选仅由C，H和O元素构成，分子量不超过1000的有机化合物，优选脂族化合物或脂环族化合物，特别优选具有 类固醇骨架和/或羟基。

公开(公告)号：US07186448B2

公开(公告)日：2007-03-06

申请号：US10483178

申请日：2003-05-12

申请人： Yasuaki Yokoyama ,  Nobuo Bessho ,  Masaaki Hanamura

发明人： Yasuaki Yokoyama ,  Nobuo Bessho ,  Masaaki Hanamura

IPC分类号： C09K19/02 ,  C09J11/00 ,  C09J5/04 ,  C09J5/06 ,  H01L21/68

CPC分类号： B24B37/042 ,  B24B37/30 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/1059

摘要： The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.

摘要翻译： 本发明涉及一种暂时且牢固地将两种固体彼此固定的方法以及该方法中使用的组合物，该方法是暂时固定的方法，其包括用液晶化合物临时固定两种固体，或 包含液晶化合物的组合物。 该方法用于临时固定用于化学机械抛光的焊盘的方法，例如，当固体是用于晶片的化学机械抛光的焊盘时，抛光固定在基板表面上的半导体器件的晶片 用于半导体器件，另一个是用于固定焊盘的基板。