公开(公告)号：US5294576A

公开(公告)日：1994-03-15

申请号：US990375

申请日：1992-12-15

申请人： Kihou Mizushima ,  Michio Horiuchi

发明人： Kihou Mizushima ,  Michio Horiuchi

IPC分类号： C04B35/185 ,  C04B35/19

CPC分类号： C04B35/185

摘要： A mullite ceramic composition comprises mullite powder as a raw material; at least one of a rare earth element compound and an alkaline earth element compound; and at least one of a Group 6B vanadium compound, niobium compound and a tantalum compound, and the mixture is fired.

摘要翻译： 莫来石陶瓷组合物包含莫来石粉为原料; 至少一种稀土元素化合物和碱土金属元素化合物; 和6B族钒化合物，铌化合物和钽化合物中的至少一种，并将该混合物烧制。

公开(公告)号：US4935390A

公开(公告)日：1990-06-19

申请号：US199332

申请日：1988-05-26

申请人： Michio Horiuchi ,  Kihou Mizushima ,  Shoichi Iwai

发明人： Michio Horiuchi ,  Kihou Mizushima ,  Shoichi Iwai

IPC分类号： C04B35/18 ,  C04B35/185

CPC分类号： C04B35/185

摘要： A sintered mullite-based body having an excellent dielectric constant and thermal expansion coefficient, and an improved flexural strength and surface smoothness, is obtained by heat treating a composition of 99.1 to 80% by weight of a mullite powder and 0.1 to 20% by weight of yttrium oxide as a sintering agent, optionally together with a colorant of MoO.sub.3.

摘要翻译： 通过热处理99.1〜80重量％的莫来石粉末和0.1〜20重量％的组合物，获得具有优异的介电常数和热膨胀系数以及改善的弯曲强度和表面光滑度的烧结莫来石基体 的氧化钇作为烧结剂，任选与MoO 3的着色剂一起。

公开(公告)号：US4827082A

公开(公告)日：1989-05-02

申请号：US207218

申请日：1988-06-16

申请人： Michio Horiuchi ,  Kihou Mizushima

发明人： Michio Horiuchi ,  Kihou Mizushima

IPC分类号： H01L23/08 ,  H01L23/02 ,  H01L23/15

CPC分类号： H01L23/15 ,  H01L24/29 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195

摘要： A ceramic package includes a high thermal conductive ceramic substrate (AlN or SiC sintered substrate) on which a semiconductor element is mounted, and a mullite sintered frame having metal conductive paths therein and joined to the substrate.

摘要翻译： 陶瓷封装包括其上安装有半导体元件的高导热陶瓷衬底（AlN或SiC烧结衬底）和在其中具有金属导电路径并且连接到衬底的莫来石烧结框架。

公开(公告)号：US08729401B2

公开(公告)日：2014-05-20

申请号：US13032071

申请日：2011-02-22

申请人： Tomoo Yamasaki ,  Michio Horiuchi

发明人： Tomoo Yamasaki ,  Michio Horiuchi

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K1/11

CPC分类号： H05K3/4602 ,  H01L21/486 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15724 ,  H05K3/4644 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A wiring substrate includes a composite substrate including an oxidized aluminum substrate portion in which a large number of penetration conductors penetrating in a thickness direction are provided, and a frame-like aluminum substrate portion provided around the oxidized aluminum substrate portion, and a wiring layer of n layers (n is an integer of 1 or more) connected to the penetration conductors.

摘要翻译： 布线基板包括复合基板，该复合基板包括设置有大量贯穿厚度方向的贯通导体的氧化铝基板部分和设置在氧化铝基板部分周围的框状铝基板部分，以及布线层 连接到穿透导体的n层（n为1以上的整数）。

公开(公告)号：US20130048350A1

公开(公告)日：2013-02-28

申请号：US13588013

申请日：2012-08-17

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： H05K1/05

CPC分类号： H05K3/4608 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/002 ,  H05K3/4061 ,  H05K3/42 ,  H05K2201/09609

摘要： A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer.

摘要翻译： 基底构件包括：芯层，包括：由氧化铝制成的板状体; 以及在板状体的厚度方向上穿过板状体的多个线状导体; 形成在芯层的第一表面和第二表面中的至少一个上的结合层; 以及形成在所述接合层上的硅层或玻璃层。

公开(公告)号：US08362369B2

公开(公告)日：2013-01-29

申请号：US12792334

申请日：2010-06-02

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Masao Nakazawa

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Masao Nakazawa

IPC分类号： H05K1/11

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/0287 ,  H05K1/0306 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/09609 ,  H05K2201/09945 ,  H01L2924/00 ,  H01L2224/0401

摘要： A wiring board includes a core substrate having a structure including an insulating base material and a large number of filamentous conductors densely provided in the insulating base material and piercing the insulating base material in a thickness direction thereof. Pads made of portions of wiring layers are oppositely disposed on both surfaces of the core substrate and electrically connected to opposite ends of a plurality of filamentous conductors in such a manner that the pads share the filamentous conductors. A wiring connection between one surface side and the other surface side of the core substrate is made through the pads. The insulating base material is made of an inorganic dielectric. Pads made of portions of the wiring layers are disposed on both surfaces of the core substrate and electrically connected only to corresponding one end sides of different groups each formed of a plurality of filamentous conductors.

摘要翻译： 布线基板包括芯基板，该芯基板具有密封地设置在绝缘基材中的绝缘基材和大量丝状导体，并且在其厚度方向上刺穿绝缘基材。 由布线层部分构成的垫相对地设置在芯基板的两个表面上，并且以多个丝状导体的相对端电连接，使得焊盘共享丝状导体。 通过焊盘制造芯基板的一个表面侧和另一个表面侧之间的布线连接。 绝缘基材由无机电介质制成。 由布线层的一部分制成的垫片设置在芯基板的两个表面上，并且仅电连接到由多个丝状导体形成的不同组的相应一端侧。

公开(公告)号：US08134444B2

公开(公告)日：2012-03-13

申请号：US12895915

申请日：2010-10-01

申请人： Michio Horiuchi ,  Yukio Shimizu ,  Kazunari Sekigawa ,  Tsuyoshi Kobayashi

发明人： Michio Horiuchi ,  Yukio Shimizu ,  Kazunari Sekigawa ,  Tsuyoshi Kobayashi

IPC分类号： H01F17/04 ,  H01R4/58

CPC分类号： H01F17/0013 ,  H01F41/041 ,  H01F2017/002 ,  Y10T29/4902

摘要： An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.

摘要翻译： 电感器包括芯基板，其包括在芯基板的前表面和后表面之间延伸的微小列状电导体。 每个柱状电导体被绝缘材料包围，与相邻的柱状电导体绝缘。 绝缘层分别形成在芯基板的前表面和后表面上。 至少两个连接电导体延伸穿过每个绝缘层。 每个连接电导体电连接到多个柱状电导体。 在每个绝缘层上形成布线，以将所述连接电导体彼此电连接。 连线，连接电导体和列状电导体被连接以形成三维方式的线圈。

公开(公告)号：US08057950B2

公开(公告)日：2011-11-15

申请号：US11419376

申请日：2006-05-19

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Shigeaki Suganuma ,  Misa Watanabe

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Shigeaki Suganuma ,  Misa Watanabe

IPC分类号： H01M8/10

CPC分类号： H01M4/8885 ,  H01M4/8621 ,  H01M4/8626 ,  H01M4/9025 ,  H01M8/1213 ,  H01M8/1246 ,  Y02E60/525 ,  Y02P70/56

摘要： A solid oxide fuel cell includes: a solid electrolyte; and electrodes on both surfaces of the solid electrolyte, wherein at least one of joint surfaces where the solid electrolyte and the electrodes are in contact with each other is a roughened surface having at least two different types of surface roughness.

摘要翻译： 固体氧化物燃料电池包括：固体电解质; 以及所述固体电解质的两面的电极，其中所述固体电解质和所述电极彼此接触的接合表面中的至少一个是具有至少两种不同类型的表面粗糙度的粗糙表面。

公开(公告)号：US20110175235A1

公开(公告)日：2011-07-21

申请号：US13009987

申请日：2011-01-20

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC分类号： H01L23/48

CPC分类号： H01L23/552 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00

摘要： A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole.

摘要翻译： 布线基板包括：芯基板，包括具有第一表面和第二表面的无机介电绝缘基材，以及贯穿绝缘基体的线状导体; 第一表面上的第一布线层，电连接到一部分直线导体; 在所述第二表面上的与所述线状导体的所述部分电连接的第二布线层; 在所述第一表面上覆盖所述第一布线层并包括第一通孔的第一绝缘层; 所述第一绝缘层上的第三布线层经由所述第一通孔与所述第一布线层电连接; 覆盖所述第二布线层并且包括第二通孔的所述第二表面上的第二绝缘层; 以及通过第二通孔与第二布线层电连接的第二绝缘层上的第四布线层。

公开(公告)号：US20110018144A1

公开(公告)日：2011-01-27

申请号：US12813692

申请日：2010-06-11

申请人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

发明人： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC分类号： H01L23/48 ,  H05K1/00

CPC分类号： H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0227 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09609

摘要： A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.

摘要翻译： 布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线 线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线 线性导体。