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    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20090195999A1

    公开(公告)日：2009-08-06

    申请号：US12358671

    申请日：2009-01-23

    申请人： Mitsuru HONJO ,  Toshiki NAITOU ,  Katsutoshi KAMEI

    发明人： Mitsuru HONJO ,  Toshiki NAITOU ,  Katsutoshi KAMEI

    IPC分类号： H05K1/18 ,  H05K1/02

    CPC分类号： H05K1/0218 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0237 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/0723 ,  H05K2201/09236

    摘要： A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

    摘要翻译： 在悬架体上形成第一绝缘层，在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖布线迹线。 在第二绝缘层上形成接地层，以便位于布线迹线上方。 此外，在第二绝缘层上形成第三绝缘层以覆盖接地层。 在第三绝缘层上形成读取布线。 在第三绝缘层上形成第四绝缘层以覆盖布线迹线。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20100116537A1

    公开(公告)日：2010-05-13

    申请号：US12611985

    申请日：2009-11-04

    申请人： Jun ISHII ,  Toshiki NAITOU ,  Mitsuru HONJO

    发明人： Jun ISHII ,  Toshiki NAITOU ,  Mitsuru HONJO

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/4685 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0265 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09627 ,  H05K2201/0979 ,  Y10T29/49155

    摘要： An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

    摘要翻译： 第一写入布线图案的第一行的一端和第二行的末端布置在第二写入布线图案的第三行的两侧。 圆形连接部设置在第一线和第二线的端部。 分别在连接部分上方的覆盖绝缘层的部分形成通孔。 例如，由铜制成的第一连接层形成为填充覆盖绝缘层的通孔。 例如，由铜构成的大致矩形的第二连接层形成为一体地覆盖连接层的上端。 这使得第一和第二线通过第一和第二连接层彼此电连接。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20110259632A1

    公开(公告)日：2011-10-27

    申请号：US13086449

    申请日：2011-04-14

    申请人： Tetsuya OOSAWA ,  Mitsuru HONJO ,  Daisuke YAMAUCHI

    发明人： Tetsuya OOSAWA ,  Mitsuru HONJO ,  Daisuke YAMAUCHI

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K1/056 ,  H05K1/0245 ,  H05K1/0251 ,  Y10T29/49155

    摘要： A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

    摘要翻译： 基体绝缘层形成在悬架体上。 读取布线图案，写入布线图案和接地图案在基底绝缘层上平行地形成。 第一覆盖绝缘层形成在基底绝缘层上以覆盖读取的布线图案，写入布线图案和接地图案。 在写入布线图案上方的第一覆盖绝缘层的区域中形成接地层。 第二盖绝缘层形成在第一盖绝缘层上以覆盖接地层。

    Printed Circuit Board
    5.
    发明申请
    Printed Circuit Board 有权
    印刷电路板

    公开(公告)号：US20080073109A1

    公开(公告)日：2008-03-27

    申请号：US11854379

    申请日：2007-09-12

    申请人： Mitsuru HONJO ,  Natsuko YAMAZAKI

    发明人： Mitsuru HONJO ,  Natsuko YAMAZAKI

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0231 ,  H05K1/162 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09236

    摘要： A plurality of wiring patterns are formed on a first surface of a base insulating layer, and a ground layer is formed on a second surface opposite to the first surface. A cover insulating layer is then formed on the first surface of the base insulating layer so as to cover the plurality of wiring patterns. Further, a cover insulating layer is formed on the second surface of the base insulating layer so as to cover the ground layer. A high dielectric insulating layer having a dielectric constant of 10 to 30, for example, is then formed on the cover insulating layer.

    摘要翻译： 在基底绝缘层的第一表面上形成多个布线图案，并且在与第一表面相对的第二表面上形成接地层。 然后在基底绝缘层的第一表面上形成覆盖绝缘层，以覆盖多个布线图案。 此外，在基底绝缘层的第二表面上形成覆盖绝缘层以覆盖接地层。 然后，在覆盖绝缘层上形成例如介电常数为10〜30的高介电绝缘层。

    Printed Circuit Board
    6.
    发明申请
    Printed Circuit Board 有权
    印刷电路板

    公开(公告)号：US20080296049A1

    公开(公告)日：2008-12-04

    申请号：US12130165

    申请日：2008-05-30

    申请人： Mitsuru HONJO ,  Takeshi TANAKA

    发明人： Mitsuru HONJO ,  Takeshi TANAKA

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0228 ,  H05K1/0218 ,  H05K1/0393 ,  H05K3/281 ,  H05K2201/055 ,  H05K2201/09263

    摘要： A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in a convex shape toward one side of the base insulating layer in a first bend region, and a second bend portion extending along the axis line while being bent in a convex shape toward the other side of the base insulating layer in a second bend region. The conductor pattern is formed such that the first bend portion and the second bend portion do not overlap with each other in a vertical direction when the printed circuit board is folded along a boundary.

    摘要翻译： 印刷电路板包括基底绝缘层和设置在基底绝缘层上的导体图案。 导体图案包括沿着线区域中的虚拟轴线线性延伸的线部分，第一弯曲部分，沿着第一弯曲区域朝向基底绝缘层的一侧弯曲成凸形的方式沿着轴线延伸，以及 第二弯曲部，其沿着所述轴线延伸，同时在第二弯曲区域中朝向所述基底绝缘层的另一侧弯曲成凸形。 当印刷电路板沿着边界折叠时，导体图案被形成为使得第一弯曲部分和第二弯曲部分在垂直方向上彼此不重叠。

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20070272434A1

    公开(公告)日：2007-11-29

    申请号：US11751054

    申请日：2007-05-21

    申请人： Mitsuru HONJO ,  Hiroyuki HANAZONO

    发明人： Mitsuru HONJO ,  Hiroyuki HANAZONO

    IPC分类号： H05K1/00

    CPC分类号： H05K3/382 ,  H05K1/0242 ,  H05K1/028 ,  H05K3/108 ,  H05K3/28 ,  H05K3/281 ,  H05K3/383 ,  H05K3/385 ,  H05K2201/0397

    摘要： A printed circuit board has a bending portion and a non-bending portion. A base insulating layer is provided over the bending portion and the non-bending portion. A plurality of conductor patterns are formed on the insulating layer. A cover insulating layer is formed on the insulating layer to cover the plurality of conductor patterns. A surface region of the plurality of conductor patterns in the bending portion is roughened.

    摘要翻译： 印刷电路板具有弯曲部分和非弯曲部分。 在弯曲部和非弯曲部上设置有基底绝缘层。 在绝缘层上形成多个导体图形。 在绝缘层上形成覆盖绝缘层以覆盖多个导体图案。 弯曲部中的多个导体图案的表面区域被粗糙化。

    Printed Circuit Board and Manufacturing Method Thereof
    8.
    发明申请
    Printed Circuit Board and Manufacturing Method Thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US20070227764A1

    公开(公告)日：2007-10-04

    申请号：US11688899

    申请日：2007-03-21

    申请人： Mitsuru HONJO

    发明人： Mitsuru HONJO

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0224 ,  H05K1/0253 ,  H05K3/108 ,  H05K2201/0373 ,  H05K2201/09236 ,  H05K2201/09709 ,  H05K2201/09736 ,  Y10T428/24917 ,  Y10T428/24926

    摘要： A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.

    摘要翻译： 在基底绝缘层的一个表面上形成条纹形式的多个布线图案彼此平行。 布线图案各自具有包括导电层和布线层的层状结构。 在基底绝缘层的另一个表面上形成薄金属薄膜，并且在金属薄膜上形成条纹状的多个接地图形彼此平行。 布线图案和接地图案以交错方式设置，使得它们彼此不相对，其间插入有基底绝缘层。 换句话说，接地图案被设置为与布线图案之间的区域相对。