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    Semiconductor device and method of fabricating the same
    3.
    发明授权
    Semiconductor device and method of fabricating the same 失效
    半导体装置及其制造方法

    公开(公告)号：US5793117A

    公开(公告)日：1998-08-11

    申请号：US684617

    申请日：1996-07-22

    申请人： Yuzo Shimada ,  Naoji Senba ,  Nobuaki Takahashi

    发明人： Yuzo Shimada ,  Naoji Senba ,  Nobuaki Takahashi

    IPC分类号： G01R1/06 ,  G01R1/073 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L29/41 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： G01R1/07314 ,  G01R31/2886 ,  H01L24/19 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351

    摘要： The invention provides a semiconductor device including a semiconductor substrate formed thereon with at least one recessed portion, an electrically conductive layer covering at least a surface of the recessed portion therewith, and a ball-bump formed on the electrically conductive layer within the recessed portion. The semiconductor device can act as a probe card by additionally having a tester device formed in the semiconductor substrate and provided with a function of testing electrical performances of a semiconductor device. Since the recessed portion can be formed by lithography technique, it is possible to arrange the greater number of pins in a smaller pitch, and in addition, it is also possible to locate ball-bumps in place with higher accuracy than a conventional semiconductor device.

    摘要翻译： 本发明提供了一种半导体器件，其包括在其上形成有至少一个凹部的半导体衬底，至少覆盖其凹部的表面的导电层，以及形成在凹部内的导电层上的球凸点。 半导体器件可以通过另外具有形成在半导体衬底中的测试器器件并且具有测试半导体器件的电性能的功能而用作探针卡。 由于可以通过光刻技术形成凹部，因此可以以更小的间距布置更多数量的销，另外也可以比现有的半导体装置更高精度地定位球形凸块。

    Fabrication method of plastic-molded lead component
    7.
    发明授权
    Fabrication method of plastic-molded lead component 失效
    塑料成型铅成分的制造方法

    公开(公告)号：US6096259A

    公开(公告)日：2000-08-01

    申请号：US925724

    申请日：1997-09-09

    申请人： Nobuaki Takahashi ,  Koji Soejima ,  Naoji Senba ,  Yuzo Shimada

    发明人： Nobuaki Takahashi ,  Koji Soejima ,  Naoji Senba ,  Yuzo Shimada

    IPC分类号： B29C33/12 ,  B29L31/36 ,  H01L23/50 ,  H01R43/24 ,  B29C70/72

    CPC分类号： H01R43/24 ,  H01L2924/0002

    摘要： A fabrication method of a plastic-molded lead component is provided, in which leads are aligned at a fine pitch of approximately 100 .mu.m or less with a high accuracy, a simplified process sequence, and a low cost. First, a template having opened V-grooves is prepared. The V-grooves extend along a straight line and are aligned in parallel at a fixed pitch. Second, wire pieces are placed in the respective grooves of the template. Third, the placed pieces of the wire pieces are aligned in parallel on the template at a same pitch as that of the grooves. Fourth, a molding compound is supplied onto the template with or without the use of a mold to bury the aligned wire pieces placed in the grooves. Fifth, the molding compound supplied onto the template is cured to form an encapsulation plastic on the template. The wire pieces placed in the grooves are encapsulated by the encapsulation plastic in such a way that both ends of the wire pieces are exposed from opposite sides of the encapsulation plastic. The encapsulated wire pieces serve as leads. Finally, the template is removed from tie encapsulated wire pieces and the encapsulation plastic. The template is preferably formed by a semiconductor material such as silicon.

    摘要翻译： 提供了一种塑料成型引线部件的制造方法，其中以高精度，简化的工艺顺序和低成本，以大约100μm或更小的精细间距排列引线。 首先，制备具有开口V形槽的模板。 V形槽沿着直线延伸并且以固定间距平行对准。 第二，将线材放置在模板的相应凹槽中。 第三，放置的线片件在模板上以与凹槽相同的间距平行排列。 第四，使用或不使用模具将模塑料供应到模板上以埋置放置在凹槽中的对准的线材。 第五，提供给模板的模塑料被固化以在模板上形成封装塑料。 放置在凹槽中的线材由封装塑料封装，使得线片的两端从封装塑料的相对侧露出。 封装的线件用作引线。 最后，将模板从封装的线材和封装塑料中取出。 模板优选由硅等半导体材料形成。