公开(公告)号：US06576499B2

公开(公告)日：2003-06-10

申请号：US09995722

申请日：2001-11-29

申请人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

发明人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

IPC分类号： H01L2144

CPC分类号： H05K3/284 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

摘要翻译： 公开了一种用于密集安装电子设备的电子设备组件和连接电子设备的方法。 由金属凸块实现的导电部分和由粘合密封树脂实现的密封部分在两个电子器件之间同时通过热压连接。 这可以在三个或更多个电子设备之间重复。

公开(公告)号：US06798070B2

公开(公告)日：2004-09-28

申请号：US09730849

申请日：2000-12-07

申请人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

发明人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

IPC分类号： H01L2348

CPC分类号： H05K3/284 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

摘要翻译： 公开了一种用于密集安装电子设备的电子设备组件和连接电子设备的方法。 由金属凸块实现的导电部分和由粘合密封树脂实现的密封部分在两个电子器件之间同时通过热压连接。 这可以在三个或更多个电子设备之间重复。

公开(公告)号：US07816782B2

公开(公告)日：2010-10-19

申请号：US11174526

申请日：2005-07-06

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L23/14 ,  H01L23/12

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US08198140B2

公开(公告)日：2012-06-12

申请号：US12882277

申请日：2010-09-15

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US20060012048A1

公开(公告)日：2006-01-19

申请号：US11174526

申请日：2005-07-06

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L23/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US06313533B1

公开(公告)日：2001-11-06

申请号：US09346949

申请日：1999-07-01

申请人： Takuo Funaya ,  Kouji Matsui ,  Naoji Senba

发明人： Takuo Funaya ,  Kouji Matsui ,  Naoji Senba

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05571 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a function element including a resin layer formed on a surface thereof, the resin layer having adhesive property and sealing property, the resin layer having such a pattern that a resin layer does not exist in at least one of following areas: (a) a first area around an area where device performances are influenced by resin of which the resin layer was composed, (b) a second area around pads or bumps, (c) a third area around an area on which a wiring of a substrate will exist when the function element is coupled to the substrate, and (d) a fourth area around an area on which a passive element mounted on a substrate will exist when the function element is coupled to the substrate. The function element prevents extra resin from adhering to an area of the function element where device performances will be influenced by the resin, when the function element is coupled to a substrate with a resin layer being sandwiched therebetween.

摘要翻译： 提供了一种功能元件，其包括在其表面上形成的树脂层，具有粘合性和密封性的树脂层，树脂层具有在以下至少一个区域中不存在树脂层的图案：（a ）围绕着构成树脂层的树脂影响的区域周围的第一区域，（b）围绕焊盘或凸块的第二区域，（c）在基板的布线的区域周围的第三区域 当功能元件耦合到衬底时存在，以及（d）当功能元件耦合到衬底时，围绕安装在衬底上的无源元件将存在的区域周围的第四区域。 当功能元件与夹在其间的树脂层的基板耦合时，功能元件防止额外的树脂粘附到功能元件的其中器件性能将受树脂影响的区域。

公开(公告)号：US20080026240A1

公开(公告)日：2008-01-31

申请号：US11587008

申请日：2005-04-21

申请人： Takuo Funaya ,  Osamu Myohga ,  Koji Matsui

发明人： Takuo Funaya ,  Osamu Myohga ,  Koji Matsui

IPC分类号： B32B15/00 ,  B23K35/24 ,  C22C13/00 ,  H05K3/34

CPC分类号： C22C13/00 ,  B23K35/262 ,  H05K3/3463 ,  Y10T428/12 ,  Y10T428/12708

摘要： An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.

摘要翻译： 具有7〜10质量％的Zn，0.075〜1质量％的Ag和0.07〜0.5质量％的Al的Sn-Zn合金焊料， 进一步含有选自0.01〜6质量％的Bi和0.007〜0.1质量％的Cu中的1种或2种成分; 并且任选地包含0.007〜0.1质量％，余量为Sn和不可避免的杂质。 焊料与常规的Sn-37质量％Pb共晶焊料具有相同的加工性能，使用条件和连接可靠性，并且不含生物有害的铅。

公开(公告)号：US07829199B2

公开(公告)日：2010-11-09

申请号：US11587008

申请日：2005-04-21

申请人： Takuo Funaya ,  Osamu Myohga ,  Koji Matsui

发明人： Takuo Funaya ,  Osamu Myohga ,  Koji Matsui

IPC分类号： C22C13/00 ,  B23K35/26

CPC分类号： C22C13/00 ,  B23K35/262 ,  H05K3/3463 ,  Y10T428/12 ,  Y10T428/12708

摘要： An Sn—Zn alloy solder having a composition comprising 7 to 10 mass % of Zn, 0.075 to 1 mass % of Ag, and 0.07 to 0.5 mass % of Al; further comprising one or two components selected from 0.01 to 6 mass % of Bi and 0.007 to 0.1 mass % of Cu; and optionally comprising 0.007 to 0.1 mass %, with the balance being Sn and unavoidable impurities. The solder has the same processability, service conditions, and connection reliability as conventional Sn-37 mass % Pb eutectic solder, and does not contain the biologically harmful lead.

摘要翻译： 具有7〜10质量％的Zn，0.075〜1质量％的Ag和0.07〜0.5质量％的Al的Sn-Zn合金焊料， 进一步含有选自0.01〜6质量％的Bi和0.007〜0.1质量％的Cu中的1种或2种成分; 并且任选地包含0.007〜0.1质量％，余量为Sn和不可避免的杂质。 焊料与常规的Sn-37质量％Pb共晶焊料具有相同的加工性能，使用条件和连接可靠性，并且不含生物有害的铅。

公开(公告)号：US6042682A

公开(公告)日：2000-03-28

申请号：US083968

申请日：1998-05-26

申请人： Takuo Funaya ,  Koji Matsui

发明人： Takuo Funaya ,  Koji Matsui

IPC分类号： H01L21/60 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H05K3/30 ,  B32B31/20

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13022 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K3/3452 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectively formed on the surface of the supporting substrate, except over the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the above supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding method whereby the sealing between the supporting substrate and the semiconductor bare chip is simultaneously conducted.

摘要翻译： 用于在其上安装半导体裸芯片的支撑衬底具有在其上设置有电极焊盘的表面和电极焊盘上的凸块。 除了凸块之外，在支撑基板的表面上选择性地形成密封树脂膜，并且密封树脂膜至少具有热固性。 通过热压接方法将上述支撑基板的电极焊盘和半导体裸芯片的凸块接合，由此同时进行支撑基板和半导体裸芯片之间的密封。

公开(公告)号：US06515869B2

公开(公告)日：2003-02-04

申请号：US09519888

申请日：2000-03-06

申请人： Takuo Funaya ,  Koji Matsui

发明人： Takuo Funaya ,  Koji Matsui

IPC分类号： H01L2160

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13022 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K3/3452 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

摘要： A supporting substrate for mounting a semiconductor bare chip thereon has a surface provided with electrode pads thereon and bumps on the electrode pads. A sealing resin film is selectivley formed on the periphery of the surface of the supporting substrate, except over the bumps, and further the sealing resin film has at least a thermosetting property. The electrode pads of the supporting substrate and the bumps of the semiconductor bare chip are bonded by a thermo-compression bonding.

摘要翻译： 用于在其上安装半导体裸芯片的支撑衬底具有在其上设置有电极焊盘的表面和电极焊盘上的凸块。 除了凸块之外，在支撑基板的表面的周围形成有密封树脂膜，并且密封树脂膜至少具有热固性。 支撑衬底的电极焊盘和半导体裸芯片的凸块通过热压接而接合。