公开(公告)号：US07855451B2

公开(公告)日：2010-12-21

申请号：US11728900

申请日：2007-03-27

Applicant: Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

Inventor： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/12 ,  H01L23/14

CPC classification number: H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

Abstract: A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Abstract translation: 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20050032347A1

公开(公告)日：2005-02-10

申请号：US10491137

申请日：2001-09-25

Applicant: Kerstin Hase ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jorg Zapf ,  Matthias Rebhan

Inventor： Kerstin Hase ,  Laurence Amigues ,  Herbert Schwarzbauer ,  Norbert Seliger ,  Karl Weidner ,  Jorg Zapf ,  Matthias Rebhan

IPC: H01L23/051 ,  H01L23/373 ,  H01L23/482 ,  H01L25/07 ,  H01L25/18 ,  H05K1/03 ,  H05K3/10 ,  H05K3/32 ,  H05K3/46 ,  H01L21/44 ,  H01L21/4763

CPC classification number: H05K3/4605 ,  H01L23/051 ,  H01L23/3735 ,  H01L23/482 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1469 ,  H01L2924/00 ,  H01L2224/48

Abstract: A film, based on polyimide or epoxy, is laminated onto a surface of a substrate under a vacuum, so that the film closely covers the surface and adheres thereto. Contact surfaces to be formed on the surface are uncovered by opening windows in the film. A contact is established in a plane manner between each uncovered contact surface and a layer of metal. This establishes a large-surface contact providing high current density for power semiconductor chips.

Abstract translation: 将基于聚酰亚胺或环氧树脂的薄膜在真空下层压到基材的表面上，使得薄膜紧密地覆盖表面并附着在其上。 在表面上形成的接触表面通过打开薄膜中的窗口而被覆盖。 在每个未覆盖的接触表面和一层金属之间以平面方式建立接触。 这就形成了大面积接触，为功率半导体芯片提供高电流密度。

公开(公告)号：US08531231B2

公开(公告)日：2013-09-10

申请号：US12509933

申请日：2009-07-27

Applicant: Thomas Komma ,  Norbert Seliger

Inventor： Thomas Komma ,  Norbert Seliger

IPC: H03K17/04

CPC classification number: H03K17/785 ,  H03K17/10 ,  H03K17/102 ,  H03K17/795

Abstract: A switching device for switching a high operating voltage is described. The switching device-includes a first switching arrangement with a first self-conducting switching element), which has a control connector and a first and second main connector for forming a switching section. The switching device may include a second switching arrangement having a first and a second connector for forming a switching section, which is wired serially in respect to the switching section of the first switching arrangement. The second switching arrangement includes an optically triggerable switching element for switching the switching section of the second switching arrangement so it becomes conductive. The second connector of the second switching arrangement is connected with the control connector of the first self-conducting switching element.

Abstract translation: 描述用于切换高工作电压的开关装置。 开关装置 - 包括具有第一自导电开关元件的第一开关装置），其具有控制连接器和用于形成开关部分的第一和第二主连接器。 开关装置可以包括第二开关装置，其具有第一和第二连接器，用于形成相对于第一开关装置的开关部分串联连接的开关部分。 第二开关装置包括用于切换第二开关装置的开关部分使其变为导通的光学可触发开关元件。 第二开关装置的第二连接器与第一自导电开关元件的控制连接器连接。

公开(公告)号：US20100026371A1

公开(公告)日：2010-02-04

申请号：US12509933

申请日：2009-07-27

Applicant: Thomas Komma ,  Norbert Seliger

Inventor： Thomas Komma ,  Norbert Seliger

IPC: H03K17/687

CPC classification number: H03K17/785 ,  H03K17/10 ,  H03K17/102 ,  H03K17/795

Abstract: A switching device for switching a high operating voltage is described. The switching device-includes a first switching arrangement with a first self-conducting switching element), which has a control connector and a first and second main connector for forming a switching section. The switching device may include a second switching arrangement having a first and a second connector for forming a switching section, which is wired serially in respect to the switching section of the first switching arrangement. The second switching arrangement includes an optically triggerable switching element for switching the switching section of the second switching arrangement so it becomes conductive. The second connector of the second switching arrangement is connected with the control connector of the first self-conducting switching element.

Abstract translation: 描述用于切换高工作电压的开关装置。 开关装置 - 包括具有第一自导电开关元件的第一开关装置），其具有控制连接器和用于形成开关部分的第一和第二主连接器。 开关装置可以包括具有第一和第二连接器的第二开关装置，用于形成相对于第一开关装置的开关部分串联连接的开关部分。 第二开关装置包括用于切换第二开关装置的开关部分使其变为导通的光学可触发开关元件。 第二开关装置的第二连接器与第一自导电开关元件的控制连接器连接。

公开(公告)号：US06668667B2

公开(公告)日：2003-12-30

申请号：US10240246

申请日：2002-09-30

Applicant: Norbert Seliger

Inventor： Norbert Seliger

IPC: G01L504

CPC classification number: B23K20/10 ,  H01L2224/859

Abstract: An arrangement in which a first contact surface (2) for bonding one end (51) of the bonding wire (5) and a piezoelectric actuator (3) are fixed on a support body (1) and a second contact surface (4) for bonding another end (52) of the bonding wire (5) is fixed to the actuator by an unsupported support body (34). The second contact surface moves back and forth in relation to the support body by means of an actuator, at a frequency of between 0.1 Hz and a few KHz and in one or more directions (31, 31′, 31″). The arrangement is suitable for use in testing the endurance of bonding wire connections.

Abstract translation: 一种用于将接合线（5）的一端（51）和压电致动器（3）接合的第一接触表面（2）固定在支撑体（1）和第二接触表面（4）上的布置 接合线（5）的另一端（52）通过未支撑的支撑体（34）固定到致动器。 第二接触表面通过致动器相对于支撑体来回移动，频率为0.1Hz至几KHz，并且在一个或多个方向（31,31'，31“）上。 该布置适用于测试接合线连接的耐久性。

公开(公告)号：US20120075826A1

公开(公告)日：2012-03-29

申请号：US13262582

申请日：2010-03-30

Applicant: Michael Kaspar ,  Herbert Schwarzbauer ,  Norbert Seliger

Inventor： Michael Kaspar ,  Herbert Schwarzbauer ,  Norbert Seliger

IPC: H05K7/02

CPC classification number: H01L24/72 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/291 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/0715 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01004

Abstract: A circuit design includes an electrical circuit, which has at least one electronic component attached to a substrate and a flat conductor track electrically contacting the component. An elastic element is provided on the electrical circuit and a device applies a force to the elastic element so that the elastic element is pressed onto the electrical circuit. Thus, crack formation in a solder under the component is prevented.

Abstract translation: 电路设计包括电路，其具有附接到基板的至少一个电子部件和与部件电接触的扁平导体轨迹。 弹性元件设置在电路上，并且设备向弹性元件施加力，使得弹性元件被按压到电路上。 因此，防止了部件下的焊料中的裂纹形成。

公开(公告)号：US07427532B2

公开(公告)日：2008-09-23

申请号：US10547119

申请日：2004-01-23

Applicant: Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

Inventor： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC: H01L21/50 ,  H01L21/48

CPC classification number: H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15798 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

Abstract: According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

Abstract translation: 根据本发明，将由电绝缘材料制成的层施加到基板和其上配置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

公开(公告)号：US07208347B2

公开(公告)日：2007-04-24

申请号：US10547173

申请日：2004-01-26

Applicant: Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

Inventor： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

Abstract: A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

Abstract translation: 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20060252253A1

公开(公告)日：2006-11-09

申请号：US10547119

申请日：2004-01-23

Applicant: Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

Inventor： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC: H01L21/4763

CPC classification number: H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15798 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

Abstract: According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

Abstract translation: 根据本发明，将由电绝缘材料制成的层施加到基板和其上布置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

公开(公告)号：US20120133306A1

公开(公告)日：2012-05-31

申请号：US13389253

申请日：2010-07-15

Applicant: Norbert Seliger ,  Karl Weidner

Inventor： Norbert Seliger ,  Karl Weidner

IPC: H05H9/00 ,  H01J9/24

CPC classification number: H05H7/00 ,  H05H7/22 ,  H05H9/00

Abstract: The present invention relates to waveguides, e.g., waveguides in a dielectricwall accelerator, and to methods for the manufacture thereof. For example, planar contact electronic assemblies may be integrated in a waveguide e.g., a waveguide of an accelerator cell of a dielectricwall accelerator.

Abstract translation: 本发明涉及波导，例如介质壁加速器中的波导，以及其制造方法。 例如，平面接触电子组件可以集成在波导中，例如介电壁加速器的加速器单元的波导。