公开(公告)号：US5162240A

公开(公告)日：1992-11-10

申请号：US537492

申请日：1990-06-12

申请人： Norio Saitou ,  Hideo Todokoro ,  Katsuhiro Kuroda ,  Satoru Fukuhara ,  Genya Matsuoka ,  Hideo Arima ,  Hitoshi Yokono ,  Takashi Inoue ,  Hidetaka Shigi

发明人： Norio Saitou ,  Hideo Todokoro ,  Katsuhiro Kuroda ,  Satoru Fukuhara ,  Genya Matsuoka ,  Hideo Arima ,  Hitoshi Yokono ,  Takashi Inoue ,  Hidetaka Shigi

IPC分类号： H01L21/48 ,  H01L23/538 ,  H01L23/544 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K3/4679 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K3/4605 ,  H05K3/467

摘要： A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid substrate. The adjustment layer is formed using a direct printing process in accordance with dispersion of the shape of the thick film circuit substrate to absorb the dispersion of the substrate. Further, in order to absorb dispersion of contraction of the thick film substrate due to sintering, a position of a mark provided on the substrate is detected by an electron beam and thereafter a connection pattern is formed to be connected to a regular pattern.

摘要翻译： 厚薄膜混合多层布线基板包括设置在厚膜电路和薄膜电路之间的调整层，以便调整厚膜电路和薄膜电路的位置，具有高集成度和大面积的厚薄 薄膜混合基板。 根据厚膜电路基板的形状的分散，使用直接印刷法形成调整层，以吸收基板的分散。 此外，为了吸收由于烧结引起的厚膜基板的收缩分散，通过电子束检测设置在基板上的标记的位置，然后形成连接图案以连接到规则图案。

公开(公告)号：US5208656A

公开(公告)日：1993-05-04

申请号：US674605

申请日：1991-03-25

申请人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

发明人： Haruhiko Matsuyama ,  Mitsuo Yoshimoto ,  Jun Tanaka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Takashi Inoue ,  Tetsuya Yamazaki ,  Minoru Tanaka ,  Hidetaka Shigi

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.

摘要翻译： 通过使金属布线层通过金属如Cr，Mo等在表面上进行稳定化处理或水玻璃水溶液，可以以良好的生产率制造具有高可靠性的多层布线基板，以防止产生小丘或 晶须并改善耐化学性。

公开(公告)号：US5300735A

公开(公告)日：1994-04-05

申请号：US37543

申请日：1993-03-22

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

摘要翻译： 这里描述了互连的多层板及其制造工艺。 骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。 然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。 还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

公开(公告)号：US5388328A

公开(公告)日：1995-02-14

申请号：US187546

申请日：1994-01-28

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

摘要翻译： 制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口 从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构 井层。 此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构 填充无溶剂形式的清漆，并且清漆被固化。

公开(公告)号：US5393406A

公开(公告)日：1995-02-28

申请号：US845942

申请日：1992-03-04

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura

IPC分类号： H05K3/10 ,  H01L21/48 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46 ,  C25D5/02

CPC分类号： H01L21/4857 ,  H05K3/423 ,  H05K3/465 ,  H05K3/4682 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3511 ,  H05K2201/09881 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/107 ,  H05K3/108 ,  H05K3/205

摘要： A thin film multilayer wiring board-producing method of the present invention is intended to decrease thermal stresses developing during the formation of the multilayer construction, and also to greatly reduce the number of the steps of the process, as compared with a conventional method. A film material can be used as an insulating film of the multilayer wiring board, and is adhesively bonded to a predetermined portion. Wiring conductors are formed by electroplating. The wiring layers are repeated laminated to form the multilayer construction. A metallic film serving as an electrode is formed on one of upper and lower surfaces of a substrate, the metallic film being removed after a multilayer wiring is formed. A soluble insulating film is formed on a metallic undercoat film on the substrate, and grooves are formed in the soluble insulating film, and wiring conductors are formed in the grooves, using either electroplating or both electroplating and electroless plating. Thereafter, the soluble insulating film and the metallic undercoat film are removed. Subsequently, an insoluble insulating film is formed at those locations from which the soluble insulating film and the metallic undercoat have been removed.

摘要翻译： 本发明的薄膜多层布线板的制造方法，与以往的方法相比，旨在降低在形成多层结构时的热应力发展，并且大大减少了工艺步骤的数量。 膜材料可以用作多层布线板的绝缘膜，并且粘合到预定部分。 接线导体通过电镀形成。 重复层压布线层以形成多层结构。 用作电极的金属膜形成在基板的上表面和下表面之一上，金属膜在形成多层布线之后被去除。 在基板上的金属底涂层上形成可溶性绝缘膜，并且在可溶性绝缘膜中形成槽，并且使用电镀或电镀或无电镀两者在沟槽中形成布线导体。 然后，除去可溶性绝缘膜和金属底涂膜。 随后，在去除可溶性绝缘膜和金属底涂层的那些位置处形成不溶性绝缘膜。

公开(公告)号：US4715673A

公开(公告)日：1987-12-29

申请号：US857957

申请日：1986-05-01

申请人： Takanobu Noro ,  Yasumasa Koakutsu ,  Tamio Takeuchi ,  Masao Yano ,  Seiichi Onoda ,  Hideo Arima ,  Hitoshi Yokono ,  Hirayoshi Tanei

发明人： Takanobu Noro ,  Yasumasa Koakutsu ,  Tamio Takeuchi ,  Masao Yano ,  Seiichi Onoda ,  Hideo Arima ,  Hitoshi Yokono ,  Hirayoshi Tanei

IPC分类号： G02B6/35 ,  G02B6/36

CPC分类号： G02B6/35 ,  G02B6/3598 ,  G02B6/3542 ,  G02B6/3572 ,  G02B6/3582 ,  G02B6/3586

摘要： An optical switch having a small number of optical connections includes a substrate in which are provided a first light path for conducting optical signals and a second light path consisting of a photosensitive element and light emitting element in pairs. An optical fiber cable is interrupted by the substrate, and optical signals in the fiber cable are transmitted through the first light path or intervened by an electrical system through the second light path in response to the switching movement of the substrate.

摘要翻译： 具有少量光学连接的光学开关包括其中设置有用于传导光学信号的第一光路和由感光元件和发光元件成对组成的第二光路的基板。 光纤电缆被基板中断，并且光纤电缆中的光信号响应于基板的切换运动而通过第一光路传输或通过第二光路被电气系统干涉。

公开(公告)号：US4544729A

公开(公告)日：1985-10-01

申请号：US623168

申请日：1984-06-22

申请人： Kazuo Nate ,  Takashi Inoue ,  Hitoshi Yokono ,  Mitsuo Ishikawa ,  Makoto Kumada

发明人： Kazuo Nate ,  Takashi Inoue ,  Hitoshi Yokono ,  Mitsuo Ishikawa ,  Makoto Kumada

IPC分类号： C08G77/48 ,  C08G77/60 ,  G03F7/075 ,  C08G77/04

CPC分类号： C08G77/60 ,  C08G77/48 ,  G03F7/0754

摘要： A photo and radiation sensitive-organopolymeric material having at least one Si--Si).sub.n bond, wherein n is an integer of from 1 to 5 has a good resistance to dry etching, a good adhesion and a good heat resistance and is useful for finer patterning with a good resolution.

摘要翻译： 具有至少一个Si-Si）n键的照片和辐射敏感有机聚合物材料，其中n为1至5的整数，具有良好的抗干蚀刻性，良好的粘附性和良好的耐热性，并且对于较细的 图案分辨率好。

公开(公告)号：US5198273A

公开(公告)日：1993-03-30

申请号：US580877

申请日：1990-09-11

申请人： Setsuo Ando ,  Jiro Ushio ,  Takashi Inoue ,  Hiroaki Okudaira ,  Takeshi Shimazaki ,  Hitoshi Yokono

发明人： Setsuo Ando ,  Jiro Ushio ,  Takashi Inoue ,  Hiroaki Okudaira ,  Takeshi Shimazaki ,  Hitoshi Yokono

IPC分类号： C23C18/44

CPC分类号： C23C18/44

摘要： The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.

公开(公告)号：US4504646A

公开(公告)日：1985-03-12

申请号：US550200

申请日：1983-11-09

申请人： Kazuo Nate ,  Takashi Inoue ,  Hitoshi Yokono

发明人： Kazuo Nate ,  Takashi Inoue ,  Hitoshi Yokono

IPC分类号： G03F7/004 ,  C08G2/14 ,  C08G2/20 ,  G03C1/72 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027 ,  C08G77/06

CPC分类号： G03C1/72 ,  C08G2/14 ,  C08G2/20 ,  G03F7/0758

摘要： Aliphatic aldehyde polymer containing at least one Si atom in its molecular chain is a positive type resist having a very high sensitivity to radiation such as electron beams, X-rays, ion beams, etc.

摘要翻译： 在其分子链中含有至少一个Si原子的脂族醛聚合物是对辐射具有非常高的灵敏度的正型抗蚀剂，例如电子束，X射线，离子束等。

公开(公告)号：US5133403A

公开(公告)日：1992-07-28

申请号：US423386

申请日：1989-10-19

申请人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

发明人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L23/3733 ,  F28F2255/18 ,  H01L2224/16225

摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.

摘要翻译： 一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。 该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高 各向同性的导热性。 即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。 复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。 混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。