公开(公告)号：US11257705B2

公开(公告)日：2022-02-22

申请号：US16468324

申请日：2018-01-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Gunnar Petersen ,  Konrad Wagner

IPC: H01L21/683 ,  H01L21/78 ,  H01L25/00 ,  H01L23/00 ,  H01L21/52

Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

公开(公告)号：US11923303B2

公开(公告)日：2024-03-05

申请号：US17297405

申请日：2019-12-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Konrad Wagner ,  Michael Förster

IPC: H01L23/532 ,  H01L21/60 ,  H01L23/367 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L23/53228 ,  H01L21/60 ,  H01L23/3677 ,  H01L23/5226 ,  H01L23/528

Abstract: A carrier comprises: a main body made of a material comprising a thermal conductivity of at least 380 W/(m K), wherein the main body comprises a mounting surface for mechanical and thermal connection with a component, wherein the main body comprises a recess which penetrates the main body along a first direction perpendicular to the main extension plane of the main body, an electrically insulating filler is arranged in the recess, which comprises a further recess penetrating the filler along the first direction, an inner wall of the filler surrounding the further recess is provided with an electrically conductive coating to form a via through the main body.

公开(公告)号：US20200090975A1

公开(公告)日：2020-03-19

申请号：US16468324

申请日：2018-01-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Richter ,  Gunnar Petersen ,  Konrad Wagner

IPC: H01L21/683 ,  H01L21/78

Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

公开(公告)号：US09991621B2

公开(公告)日：2018-06-05

申请号：US14896420

申请日：2014-05-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Konrad Wagner ,  Jürgen Holz

IPC: H05K7/00 ,  H01R13/405 ,  H05K1/14 ,  H01R4/24 ,  H01R12/71 ,  H01R24/58 ,  H05K1/03 ,  H05K1/18 ,  H05K7/02 ,  H05K1/05 ,  H05K3/36 ,  H05K3/32

CPC classification number: H01R13/405 ,  H01R4/2404 ,  H01R4/2479 ,  H01R12/718 ,  H01R24/58 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/056 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/325 ,  H05K3/368 ,  H05K7/02 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10409

Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.

公开(公告)号：US09500938B2

公开(公告)日：2016-11-22

申请号：US14436071

申请日：2013-10-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Wiener ,  Konrad Wagner

IPC: G03B21/20 ,  F21V9/08 ,  F21K99/00 ,  H01L33/46 ,  G02B19/00 ,  H01L25/075 ,  H01L33/50 ,  F21Y101/02

CPC classification number: G03B21/204 ,  F21K9/64 ,  F21V9/08 ,  F21Y2101/00 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A radiation-emitting component is disclosed. In embodiments a component includes a radiation-emitting semiconductor chip having a radiation exit area including a side face and a main face, a conversion element having a radiation exit area including a side face and a main face, and a first reflection element disposed downstream of the conversion element and the radiation-emitting semiconductor chip, wherein a ratio of a sum of the radiation exit areas of the radiation-emitting semiconductor chip to a sum of the radiation exit areas of the conversion element is greater than 1, wherein the conversion element adjoins the radiation-emitting semiconductor chip, wherein the radiation-emitting semiconductor chip is configured to generate primary radiation, wherein the conversion element is configured to convert the primary radiation into secondary radiation, and wherein the primary radiation and the secondary radiation leave the radiation-emitting component exclusively through the first reflection element.

Abstract translation: 公开了辐射发射部件。 在实施例中，部件包括具有包括侧面和主面的辐射出射区域的辐射发射半导体芯片，具有包括侧面和主面的辐射出射区域的转换元件，以及设置在 转换元件和辐射发射半导体芯片，其中辐射发射半导体芯片的辐射出射面积之和与转换元件的辐射出射面积之和的比率大于1，其中转换元件 邻近辐射发射半导体芯片，其中发射辐射的半导体芯片被配置为产生主要辐射，其中转换元件被配置为将初级辐射转换成次级辐射，并且其中初级辐射和次级辐射离开辐射发射半导体芯片， 发射部件仅通过第一反射元件。

公开(公告)号：US20190267519A1

公开(公告)日：2019-08-29

申请号：US16286100

申请日：2019-02-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Nagel ,  Klaus Reingruber ,  Simone Brantl ,  Konrad Wagner ,  Ralf Müller

IPC: H01L33/54 ,  H01L33/60 ,  H01L33/50

Abstract: An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.

公开(公告)号：US09521747B2

公开(公告)日：2016-12-13

申请号：US14363823

申请日：2012-12-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Rasp ,  Konrad Wagner

IPC: H05K1/02 ,  H05K1/05 ,  F21V19/00 ,  H05K1/11 ,  H05K3/00 ,  F21Y101/00

CPC classification number: H05K1/0296 ,  F21V19/0005 ,  F21V19/003 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0268 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0061 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10886 ,  H05K2203/162 ,  H05K2203/173 ,  H01L2924/00014

Abstract: A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out.

Abstract translation: 连接板包括至少一个切口，用于将连接板固定到安装板和彼此电隔离的多个接触表面，其中当连接板通过紧固件处于紧固状态时，接触表面彼此电连接 延伸穿过切口。

公开(公告)号：US10937932B2

公开(公告)日：2021-03-02

申请号：US16286100

申请日：2019-02-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Peter Nagel ,  Klaus Reingruber ,  Simone Brantl ,  Konrad Wagner ,  Ralf Müller

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60

Abstract: An optoelectronic component includes a carrier, an optoelectronic arrangement, and a potting material, wherein the optoelectronic arrangement includes an optoelectronic semiconductor chip, the optoelectronic arrangement is arranged above a top side of the carrier, the potting material is arranged above the top side of the carrier such that the optoelectronic arrangement is embedded into the potting material, a radiation emission face of the optoelectronic arrangement is not covered by the potting material, and a surface of the potting material is formed above the radiation emission face in relation to the top side of the carrier.

公开(公告)号：US20160111803A1

公开(公告)日：2016-04-21

申请号：US14896420

申请日：2014-05-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Konrad Wagner ,  Jürgen Holz

IPC: H01R13/405 ,  H05K7/02 ,  H05K1/03 ,  H01R4/24 ,  H01R24/58 ,  H05K1/18 ,  H01R12/71

CPC classification number: H01R13/405 ,  H01R4/2404 ,  H01R4/2479 ,  H01R12/718 ,  H01R24/58 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/056 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/325 ,  H05K3/368 ,  H05K7/02 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10409

Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.

Abstract translation: 光电布置包括布置在第一电路板上的第一电路板，第二电路板和光电子半导体芯片，其中第一电接触表面和第二电接触表面形成在第一电路板的表面上， 第一配合接触表面和第二配合接触表面形成在第二电路板的表面上，并且第一电路板和第二电路板彼此连接，使得第一电路板的表面面向 第二电路板，并且第一配合接触表面导电地连接到第一接触表面，并且第二配合接触表面导电地连接到第二接触表面。

公开(公告)号：US20150268543A1

公开(公告)日：2015-09-24

申请号：US14436071

申请日：2013-10-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Daniel Wiener ,  Konrad Wagner

IPC: G03B21/20 ,  F21V9/08 ,  F21K99/00

CPC classification number: G03B21/204 ,  F21K9/64 ,  F21V9/08 ,  F21Y2101/00 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0061 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A radiation-emitting component is disclosed. In embodiments a component includes a radiation-emitting semiconductor chip having a radiation exit area including a side face and a main face, a conversion element having a radiation exit area including a side face and a main face, and a first reflection element disposed downstream of the conversion element and the radiation-emitting semiconductor chip, wherein a ratio of a sum of the radiation exit areas of the radiation-emitting semiconductor chip to a sum of the radiation exit areas of the conversion element is greater than 1, wherein the conversion element adjoins the radiation-emitting semiconductor chip, wherein the radiation-emitting semiconductor chip is configured to generate primary radiation, wherein the conversion element is configured to convert the primary radiation into secondary radiation, and wherein the primary radiation and the secondary radiation leave the radiation-emitting component exclusively through the first reflection element.

Abstract translation: 公开了辐射发射部件。 在实施例中，部件包括具有包括侧面和主面的辐射出射区域的辐射发射半导体芯片，具有包括侧面和主面的辐射出射区域的转换元件，以及设置在 转换元件和辐射发射半导体芯片，其中辐射发射半导体芯片的辐射出射面积之和与转换元件的辐射出射面积的总和之比大于1，其中转换元件 邻接辐射发射半导体芯片，其中发射辐射的半导体芯片被配置为产生主要辐射，其中转换元件被配置为将初级辐射转换成次级辐射，并且其中初级辐射和次级辐射离开辐射发射半导体芯片， 发射部件仅通过第一反射元件。