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公开(公告)号：US09991621B2
公开(公告)日：2018-06-05
申请号：US14896420
申请日：2014-05-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Konrad Wagner , Jürgen Holz
IPC: H05K7/00 , H01R13/405 , H05K1/14 , H01R4/24 , H01R12/71 , H01R24/58 , H05K1/03 , H05K1/18 , H05K7/02 , H05K1/05 , H05K3/36 , H05K3/32
CPC classification number: H01R13/405 , H01R4/2404 , H01R4/2479 , H01R12/718 , H01R24/58 , H05K1/0366 , H05K1/038 , H05K1/056 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/325 , H05K3/368 , H05K7/02 , H05K2201/012 , H05K2201/0129 , H05K2201/041 , H05K2201/10106 , H05K2201/10189 , H05K2201/10356 , H05K2201/10409
Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.
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2.发明申请公开(公告)号：US20140353710A1
公开(公告)日：2014-12-04
申请号：US14363738
申请日：2012-12-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Zitzlsperger , Jürgen Holz
CPC classification number: H01L33/62 , G01R31/2635 , H01L22/14 , H01L22/32 , H01L23/49541 , H01L23/49562 , H01L24/97 , H01L25/13 , H01L31/0203 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L2224/16245 , H01L2224/45144 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/19107 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2224/4554
Abstract: A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.
Abstract translation: 一种方法用于生产光电半导体元件。 引线框组合包括许多引线框架。 引线框架每个包括至少两个引线框架部件，并且至少部分地经由连接幅材连接在一起。 电连接连接在相邻引线框架之间。 灌封体将引线框和引线框架部分机械地连接在一起。 至少一些连接腹板被去除和/或中断，所得到的结构被分成半导体部件。
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3.发明授权Lighting device, lighting arrangement comprising lighting device and method for operating a lighting device 有权照明装置，包括照明装置的照明装置和用于操作照明装置的方法公开(公告)号：US09554439B2
公开(公告)日：2017-01-24
申请号：US14410565
申请日：2013-06-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Boris Eichenberg , Jürgen Holz
CPC classification number: H05B33/089 , B60Q1/1415 , H01L25/0753 , H01L25/167 , H01L2224/48091 , H01L2924/1301 , H05B33/0827 , H05B33/0845 , H01L2924/00014 , H01L2924/00
Abstract: A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.
Abstract translation: 一种照明装置，其特征在于，具有多个用于产生辐射的部件（2），多条行线（Z1，Z2）和多条列线（S1，S2，...，S5） 在每种情况下电导体连接到行线和列线，并且照明装置被设置用于至少两个部件的同时操作。 此外，还规定了包括这种照明装置的照明装置和用于操作照明装置的方法。
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Patent Agency Ranking
公开(公告)号：US09553078B2
公开(公告)日：2017-01-24
申请号：US14411425
申请日：2013-05-31
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Boris Eichenberg , Jürgen Holz
IPC: F21V9/16 , H01L33/50 , H01L25/075 , H01L33/48 , H01L33/54 , F21S8/10 , H01L33/56 , H01L33/60 , H01L33/62
CPC classification number: H01L25/0753 , F21S41/141 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: A light-emitting diode module includes a carrier and a plurality of optoelectronic semiconductor chips mounted on a carrier top and configured to generate primary radiation. The semiconductor chips are arranged in part at a first distance and in part at a second, greater distance from one another. Between the adjacent semiconductor chips arranged at the first distance from one another there is located a radiation-transmissive first filling for optical coupling. Between the adjacent semiconductor chips arranged at the second distance from one another there is located a radiation-opaque second filling for optical isolation.
Abstract translation: 发光二极管模块包括载体和安装在载体顶部上并被配置为产生初级辐射的多个光电子半导体芯片。 半导体芯片部分地布置在第一距离处，并且部分地彼此相距更远的距离地布置。 在彼此之间以第一距离布置的相邻半导体芯片之间，设置用于光耦合的辐射透射式第一填充物。 在以彼此相距第二距离布置的相邻半导体芯片之间设置用于光学隔离的辐射不透明的第二填充物。
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公开(公告)号：US20150228630A1
公开(公告)日：2015-08-13
申请号：US14411425
申请日：2013-05-31
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Boris Eichenberg , Jürgen Holz
CPC classification number: H01L25/0753 , F21S41/141 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: A light-emitting diode module includes a carrier and a plurality of optoelectronic semiconductor chips mounted on a carrier top and configured to generate primary radiation. The semiconductor chips are arranged in part at a first distance and in part at a second, greater distance from one another. Between the adjacent semiconductor chips arranged at the first distance from one another there is located a radiation-transmissive first filling for optical coupling. Between the adjacent semiconductor chips arranged at the second distance from one another there is located a radiation-opaque second filling for optical isolation.
Abstract translation: 发光二极管模块包括载体和安装在载体顶部上并被配置为产生初级辐射的多个光电子半导体芯片。 半导体芯片部分地布置在第一距离处，并且部分地彼此相距更远的距离地布置。 在彼此之间以第一距离布置的相邻半导体芯片之间，设置用于光耦合的辐射透射式第一填充物。 在以彼此相距第二距离布置的相邻半导体芯片之间设置用于光学隔离的辐射不透明的第二填充物。
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公开(公告)号：US09918368B2
公开(公告)日：2018-03-13
申请号：US15387553
申请日：2016-12-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Boris Eichenberg , Jürgen Holz
CPC classification number: H05B33/089 , B60Q1/1415 , H01L25/0753 , H01L25/167 , H01L2224/48091 , H01L2924/1301 , H05B33/0827 , H05B33/0845 , H01L2924/00014 , H01L2924/00
Abstract: A lighting device comprising a plurality of components (2) provided for generating radiation, a plurality of row lines (Z1, Z2) and a plurality of column lines (S1, S2, . . . , S5) is specified, wherein the components are in each case electrically conductively connected to a row line and to a column line and the lighting device is provided for the simultaneous operation of at least two components. A lighting arrangement comprising such a lighting device and a method for operating a lighting device are furthermore specified.
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公开(公告)号：US20160111803A1
公开(公告)日：2016-04-21
申请号：US14896420
申请日：2014-05-15
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Konrad Wagner , Jürgen Holz
CPC classification number: H01R13/405 , H01R4/2404 , H01R4/2479 , H01R12/718 , H01R24/58 , H05K1/0366 , H05K1/038 , H05K1/056 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/325 , H05K3/368 , H05K7/02 , H05K2201/012 , H05K2201/0129 , H05K2201/041 , H05K2201/10106 , H05K2201/10189 , H05K2201/10356 , H05K2201/10409
Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.
Abstract translation: 光电布置包括布置在第一电路板上的第一电路板，第二电路板和光电子半导体芯片，其中第一电接触表面和第二电接触表面形成在第一电路板的表面上， 第一配合接触表面和第二配合接触表面形成在第二电路板的表面上，并且第一电路板和第二电路板彼此连接，使得第一电路板的表面面向 第二电路板，并且第一配合接触表面导电地连接到第一接触表面，并且第二配合接触表面导电地连接到第二接触表面。
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8.发明授权公开(公告)号：US09219210B2
公开(公告)日：2015-12-22
申请号：US14363738
申请日：2012-12-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Zitzlsperger , Jürgen Holz
IPC: H01L21/66 , H01L33/62 , H01L31/0203 , H01L23/00 , H01L25/13 , H01L33/52 , G01R31/26 , H01L33/00 , H01L33/48 , H01L23/495
CPC classification number: H01L33/62 , G01R31/2635 , H01L22/14 , H01L22/32 , H01L23/49541 , H01L23/49562 , H01L24/97 , H01L25/13 , H01L31/0203 , H01L33/0095 , H01L33/486 , H01L33/52 , H01L2224/16245 , H01L2224/45144 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/19107 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2224/4554
Abstract: A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.
Abstract translation: 一种方法用于生产光电半导体元件。 引线框组合包括许多引线框架。 引线框架每个包括至少两个引线框架部件，并且至少部分地经由连接幅材连接在一起。 电连接连接在相邻引线框架之间。 灌封体将引线框和引线框架部分机械地连接在一起。 至少一些连接腹板被去除和/或中断，所得到的结构被分成半导体部件。
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