公开(公告)号：US20180023782A1

公开(公告)日：2018-01-25

申请号：US15547789

申请日：2016-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： I-Hsin Lin-Lefebvre ,  Reinhard Streitel ,  Michael Schmal ,  Urs Heine ,  Eric Lefebvre ,  Markus Keidler

IPC: F21V9/16 ,  B32B7/12 ,  B32B15/04 ,  F21V7/05

CPC classification number: F21V9/30 ,  B32B7/12 ,  B32B15/04 ,  F21V7/05 ,  G02F2/02 ,  G02F2201/34 ,  G02F2201/346 ,  G02F2202/28 ,  H01L33/507 ,  H01L2933/0041 ,  H01S5/005

Abstract: A device for converting the wavelength of electromagnetic radiation is disclosed. In an embodiment the device includes a carrier, a conversion layer configured to at least partly convert a wavelength of the electromagnetic radiation and an intermediate layer, wherein the conversion layer is connected to the carrier via the intermediate layer, and wherein the intermediate layer, at least in partial regions, includes a solid layer and a connection layer.

公开(公告)号：US20150228874A1

公开(公告)日：2015-08-13

申请号：US14430735

申请日：2013-09-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Reinhard Streitel ,  Kathy Schmidtke

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L33/64 ,  H01L2224/278 ,  H01L2224/2783 ,  H01L2224/2784 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2939 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An optoelectronic component includes a substrate, a connecting element applied on the substrate and a layer sequence that emits electromagnetic radiation. The layer sequence is applied on the connecting element. The connecting element includes at least one connecting material that has an oriented molecular configuration. The connecting element has at least one parameter that is anisotropic.

Abstract translation: 光电子部件包括衬底，施加在衬底上的连接元件和发射电磁辐射的层序列。 层序列应用在连接元件上。 连接元件包括至少一个具有取向分子构型的连接材料。 连接元件具有至少一个各向异性的参数。

公开(公告)号：US10520164B2

公开(公告)日：2019-12-31

申请号：US15547789

申请日：2016-01-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： I-Hsin Lin-Lefebvre ,  Reinhard Streitel ,  Michael Schmal ,  Urs Heine ,  Eric Lefebvre ,  Markus Keidler

IPC: F21V9/30 ,  B32B7/12 ,  B32B15/04 ,  F21V7/05

Abstract: A device for converting the wavelength of electromagnetic radiation is disclosed. In an embodiment the device includes a carrier, a conversion layer configured to at least partly convert a wavelength of the electromagnetic radiation and an intermediate layer, wherein the conversion layer is connected to the carrier via the intermediate layer, and wherein the intermediate layer, at least in partial regions, includes a solid layer and a connection layer.

公开(公告)号：US20190319174A1

公开(公告)日：2019-10-17

申请号：US15952194

申请日：2018-04-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： I-Hsin Lin-Lefebvre ,  Reinhard Streitel ,  Darshan Kundaliya

IPC: H01L33/50 ,  C09K11/77 ,  C09K11/08 ,  H01L33/00

Abstract: A method for producing an optic device, an optic device and an assembly including such an optic device are disclosed. In an embodiment, the method includes providing an active medium mechanically carried by a carrier body or included in the carrier body; applying an adhesive layer to at least one of the active medium or the carrier body, wherein the adhesive layer comprises at least one organic material and is applied by physical or chemical vapor phase deposition, and wherein a thickness of the adhesive layer is between 20 nm and 0.6 μm inclusive.

公开(公告)号：US09722159B2

公开(公告)日：2017-08-01

申请号：US14430735

申请日：2013-09-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Reinhard Streitel ,  Kathy Schmidtke

IPC: H01L33/00 ,  H01L23/02 ,  H01L33/62 ,  H01L23/373 ,  H01L33/64 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L33/64 ,  H01L2224/278 ,  H01L2224/2783 ,  H01L2224/2784 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2939 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: An optoelectronic component includes a substrate, a connecting element applied on the substrate and a layer sequence that emits electromagnetic radiation. The layer sequence is applied on the connecting element. The connecting element includes at least one connecting material that has an oriented molecular configuration. The connecting element has at least one parameter that is anisotropic.

公开(公告)号：US20210384395A1

公开(公告)日：2021-12-09

申请号：US17415977

申请日：2019-12-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Reinhard Streitel ,  Kathy Schmidtke

IPC: H01L33/62 ,  H01L33/64 ,  H01L33/46

Abstract: A radiation-emitting component is disclosed. In an embodiment a radiation-emitting component includes a radiation-emitting semiconductor chip and a transparent joining layer mechanically stably connecting the radiation-emitting semiconductor chip with a carrier, wherein the transparent joining layer comprises a matrix material in which a plurality of nanoparticles are located.

公开(公告)号：US20180226518A1

公开(公告)日：2018-08-09

申请号：US15749656

申请日：2016-08-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Reinhard Streitel ,  I-Hsin Lin-Lefebvre ,  Chee Eng Ooi ,  Ivan Galesic

IPC: H01L31/0232 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/46 ,  H01L31/14 ,  H01L33/62 ,  H01L31/02 ,  H01L31/0216 ,  H01L33/60 ,  H01L33/54

CPC classification number: H01L31/0232 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02161 ,  H01L31/143 ,  H01L33/405 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method of manufacturing an optoelectronic component includes providing a carrier; arranging an ink on an upper side of the carrier; arranging an adhesive on the ink; and arranging the optoelectronic semiconductor chip on the adhesive. An optoelectronic component includes a carrier, an ink arranged on an upper side of the carrier, an adhesive arranged on the ink, and an optoelectronic semiconductor chip arranged on the adhesive.

公开(公告)号：US20180182934A1

公开(公告)日：2018-06-28

申请号：US15389213

申请日：2016-12-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： I-Hsin Lin-Lefebvre ,  Reinhard Streitel ,  Darshan Kundaliya ,  Tobias Gebuhr

IPC: H01L33/50 ,  H01L33/62

CPC classification number: H01L33/508 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: A light emitting unit includes a light emitting semiconductor chip and a wavelength converter for the light of the semiconductor chip. The wavelength converter has a substrate with a first surface. The first surface includes a rough surface with recesses. The wavelength converter has a conversion layer that is arranged on the first surface of the substrate. The conversion layer has luminescent materials. A connecting layer is arranged between the wavelength converter and a light emitting surface of the light emitting semiconductor chip.

公开(公告)号：US09224924B2

公开(公告)日：2015-12-29

申请号：US14347985

申请日：2012-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Klaus Hoehn ,  Reinhard Streitel

IPC: H01L33/48 ,  H01L31/02 ,  C09J163/00 ,  C08G59/62 ,  C08G59/68

CPC classification number: H01L33/48 ,  C08G59/62 ,  C08G59/687 ,  C09J163/00 ,  H01L24/73 ,  H01L31/02 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: An optoelectronic component includes at least one active semiconductor layer sequence, at least one first and one second element, and at least one adhesive layer arranged between at least one first element and at least one second element. The adhesive layer is produced from an adhesive that comprises at least a first monofunctional, difunctional or polyfunctional epoxy resin, an accelerator and an adhesion promoter.

Abstract translation: 光电子部件包括至少一个有源半导体层序列，至少一个第一和第二元件，以及布置在至少一个第一元件和至少一个第二元件之间的至少一个粘合剂层。 粘合剂层由至少包含第一单官能，双官能或多官能环氧树脂，促进剂和粘合促进剂的粘合剂制成。

公开(公告)号：US20140225148A1

公开(公告)日：2014-08-14

申请号：US14347985

申请日：2012-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Klaus Hoehn ,  Reinhard Streitel

IPC: H01L33/48 ,  H01L31/02

CPC classification number: H01L33/48 ,  C08G59/62 ,  C08G59/687 ,  C09J163/00 ,  H01L24/73 ,  H01L31/02 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: An optoelectronic component includes at least one active semiconductor layer sequence, at least one first and one second element, and at least one adhesive layer arranged between at least one first element and at least one second element. The adhesive layer is produced from an adhesive that comprises at least a first monofunctional, difunctional or polyfunctional epoxy resin, an accelerator and an adhesion promoter.

Abstract translation: 光电子部件包括至少一个有源半导体层序列，至少一个第一和第二元件，以及布置在至少一个第一元件和至少一个第二元件之间的至少一个粘合剂层。 粘合剂层由至少包含第一单官能，双官能或多官能环氧树脂，促进剂和粘合促进剂的粘合剂制成。