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公开(公告)号：US20060073089A1
公开(公告)日：2006-04-06
申请号：US11005474
申请日：2004-12-07
IPC分类号： D01F9/12
CPC分类号： D01F9/127 , A61L27/08 , A61L27/422 , A61L27/56 , A61L2400/12 , B01D39/2055 , B01D67/0072 , B01D67/0088 , B01D67/0093 , B01D71/021 , B01D2239/10 , B01D2239/1216 , B01D2239/1291 , B01D2323/24 , B01D2325/08 , B01D2325/24 , B60R13/02 , B60R13/08 , B82Y30/00 , B82Y40/00 , C01B32/168 , H01M4/583 , H01M4/96 , Y10S977/742 , Y10T428/12424
摘要： A method of making a carbon nanotube structure includes providing an array of substantially aligned carbon nanotubes, wetting the array with a liquid, and evaporating the liquid to form the carbon nanotube structure having a pattern in the carbon nanotube array. The structure is preferably a carbon nanotube foam.
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公开(公告)号：US20090121182A1
公开(公告)日：2009-05-14
申请号：US12251716
申请日：2008-10-15
CPC分类号： D01F9/127 , A61L27/08 , A61L27/422 , A61L27/56 , A61L2400/12 , B01D39/2055 , B01D67/0072 , B01D67/0088 , B01D67/0093 , B01D71/021 , B01D2239/10 , B01D2239/1216 , B01D2239/1291 , B01D2323/24 , B01D2325/08 , B01D2325/24 , B60R13/02 , B60R13/08 , B82Y30/00 , B82Y40/00 , C01B32/168 , H01M4/583 , H01M4/96 , Y10S977/742 , Y10T428/12424
摘要： A method of making a carbon nanotube structure includes providing an array of substantially aligned carbon nanotubes, wetting the array with a liquid, and evaporating the liquid to form the carbon nanotube structure having a pattern in the carbon nanotube array. The structure is preferably a carbon nanotube foam.
摘要翻译： 制造碳纳米管结构的方法包括提供基本排列的碳纳米管阵列，用液体润湿阵列，并蒸发液体以形成在碳纳米管阵列中具有图案的碳纳米管结构。 该结构优选为碳纳米管泡沫。
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公开(公告)号：US07473411B2
公开(公告)日：2009-01-06
申请号：US11005474
申请日：2004-12-07
IPC分类号： D01F9/12
CPC分类号： D01F9/127 , A61L27/08 , A61L27/422 , A61L27/56 , A61L2400/12 , B01D39/2055 , B01D67/0072 , B01D67/0088 , B01D67/0093 , B01D71/021 , B01D2239/10 , B01D2239/1216 , B01D2239/1291 , B01D2323/24 , B01D2325/08 , B01D2325/24 , B60R13/02 , B60R13/08 , B82Y30/00 , B82Y40/00 , C01B32/168 , H01M4/583 , H01M4/96 , Y10S977/742 , Y10T428/12424
摘要： A method of making a carbon nanotube structure includes providing an array of substantially aligned carbon nanotubes, wetting the array with a liquid, and evaporating the liquid to form the carbon nanotube structure having a pattern in the carbon nanotube array. The structure is preferably a carbon nanotube foam.
摘要翻译： 制造碳纳米管结构的方法包括提供基本排列的碳纳米管阵列，用液体润湿阵列，并蒸发液体以形成在碳纳米管阵列中具有图案的碳纳米管结构。 该结构优选为碳纳米管泡沫。
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公开(公告)号：US20060252853A1
公开(公告)日：2006-11-09
申请号：US10535279
申请日：2003-11-18
CPC分类号： B82Y30/00 , B82Y40/00 , C01B32/174 , C01B2202/02 , C01B2202/06 , D06M13/144 , D06M13/51 , D06M2101/40 , D06M2400/01
摘要： The invention relates to derivatized, well-dispersed CNTs that have enhanced miscibility with organic agents. Composite materials may be made using such CNTs. The composite materials, in turn, may be used in optical and electronic applications.
摘要翻译： 本发明涉及具有增强的与有机试剂的混溶性的衍生的，良好分散的CNT。 可以使用这样的CNT来制造复合材料。 复合材料又可用于光学和电子应用。
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5.发明授权Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same 有权微电子器件的处理以及使用该微电子器件对微电子器件的损伤的方法公开(公告)号：US08304065B2
公开(公告)日：2012-11-06
申请号：US12655282
申请日：2009-12-28
申请人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
发明人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
IPC分类号： B32B7/02
CPC分类号： H01L21/6836 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/131 , H01L2224/16 , H01L2224/81007 , H01L2224/81815 , H01L2924/0001 , H01L2924/10253 , Y10T428/24124 , Y10T428/2419 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/2839 , Y10T428/2852 , Y10T428/31703 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
摘要翻译： 微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。 膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。
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6.发明申请Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same 有权微电子器件的处理以及使用该微电子器件对微电子器件的损伤的方法公开(公告)号：US20110159256A1
公开(公告)日：2011-06-30
申请号：US12655282
申请日：2009-12-28
申请人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
发明人： Leonel Arana , Dingying Xu , Vijay Wakharkar , Wen Feng , Nirupama Chakrapani , Shankar Ganapathysubramanian , Jorge Sanchez , Mohit Mamodia
CPC分类号： H01L21/6836 , H01L23/3164 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/131 , H01L2224/16 , H01L2224/81007 , H01L2224/81815 , H01L2924/0001 , H01L2924/10253 , Y10T428/24124 , Y10T428/2419 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/2839 , Y10T428/2852 , Y10T428/31703 , H01L2924/014 , H01L2224/13099 , H01L2924/00
摘要： A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.
摘要翻译： 微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。 膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。
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公开(公告)号：US20070135550A1
公开(公告)日：2007-06-14
申请号：US11304013
申请日：2005-12-14
CPC分类号： C08K3/013 , B82Y30/00 , H01L21/563 , H01L23/295 , H01L23/3121 , H01L23/49894 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73203 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/8385 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/0104 , H01L2924/01072 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a filler featuring a negative coefficient of thermal expansion and a bi-modal size distribution of filler particles. In an embodiment, the filler has micron and nanometer size filler particles. The present invention also relates to a composite having a polymer and a filler with nanometer size filler particles. Additionally, the present invention discloses a method of forming an electronic package with a composite having a polymer and a filler with nanometer size filler particles.
摘要翻译： 本发明涉及一种具有负的热膨胀系数和填料颗粒的双模尺寸分布的填料。 在一个实施方案中，填料具有微米和纳米尺寸的填料颗粒。 本发明还涉及一种具有聚合物和具有纳米尺寸填料颗粒的填料的复合材料。 此外，本发明公开了一种用具有纳米尺寸填料颗粒的聚合物和填料的复合材料形成电子封装的方法。
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公开(公告)号：US07927925B2
公开(公告)日：2011-04-19
申请号：US12756380
申请日：2010-04-08
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L23/3128 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/27013 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73203 , H01L2224/73265 , H01L2224/83051 , H01L2224/83385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/0104 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.
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9.发明申请Controlling flow of underfill using polymer coating and resulting devices 审中-公开使用聚合物涂层和所得装置控制底部填充物的流动公开(公告)号：US20080142996A1
公开(公告)日：2008-06-19
申请号：US11641638
申请日：2006-12-19
申请人： Gopalakrishnan Subramanian , Nirupama Chakrapani , Lawrence D. Decesare , Shripad Gokhale , Jason M. Murphy , Jinlin Wang
发明人： Gopalakrishnan Subramanian , Nirupama Chakrapani , Lawrence D. Decesare , Shripad Gokhale , Jason M. Murphy , Jinlin Wang
CPC分类号： H01L21/563 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01025 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： According to one embodiment, a polymer coating is disposed on a surface of a package substrate. The polymer coating comprises a material capable of inhibiting the flow of an underfill material into a keep-out zone (KOZ). In a further embodiment, a die is disposed on the substrate and a layer of the underfill material is disposed between the die and substrate, and the polymer coating inhibits the flow of the underfill into the KOZ. Other embodiments are described and may be claimed.
摘要翻译： 根据一个实施例，聚合物涂层设置在封装衬底的表面上。 聚合物涂层包括能够抑制底部填充材料流入保持区（KOZ）的材料。 在另一个实施例中，模具设置在基板上，底层填充材料层设置在模具和基板之间，聚合物涂层阻止底部填充物流入KOZ。 描述并且可以要求保护其他实施例。
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公开(公告)号：US20080026505A1
公开(公告)日：2008-01-31
申请号：US11494858
申请日：2006-07-28
申请人： Nirupama Chakrapani
发明人： Nirupama Chakrapani
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3142 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The flow of polymer formulations in in integrated circuit packages can be controlled by altering the roughness and surface chemistry of package surfaces. The surface roughness can be altered by forming protrusions having a dimension less than 500 nanometers and their chemistry can be controlled by chemical or plasma treatment. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be super-hydrophobic by particles of the same general characteristics.
摘要翻译： 通过改变封装表面的粗糙度和表面化学性，可以控制集成电路封装中的聚合物配方的流动。 表面粗糙度可以通过形成尺寸小于500纳米的突起来改变，并且它们的化学成分可以通过化学或等离子体处理来控制。 亲水性表面可以制成半吸水性，并且疏水性表面可能具有相同一般特征的颗粒的超疏水性。
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