公开(公告)号：US20190214361A1

公开(公告)日：2019-07-11

申请号：US16351751

申请日：2019-03-13

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA

IPC: H01L23/00

Abstract: A semiconductor device includes a semiconductor element having first and second main surfaces spaced apart in a thickness direction. The semiconductor element includes a metal underlying layer on the first main surface, a bonding pad on the metal underlying layer with a wire bonded to the pad, and an insulative protection layer formed on the first main surface and surrounding the bonding pad. The bonding pad includes first and second conductive layers. The first conductive layer covers the metal underlying layer and is made of a metal having a lower ionization tendency than the metal underlying layer. The second conductive layer covers the first conductive layer and is made of a metal having a lower ionization tendency than the first conductive layer. The first and second conductive layers have respective peripheries held in close contact with the protection layer and covering a part of the protection layer.

公开(公告)号：US20170294400A1

公开(公告)日：2017-10-12

申请号：US15479887

申请日：2017-04-05

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/492

CPC classification number: H01L24/43 ,  H01L23/3157 ,  H01L23/492 ,  H01L23/498 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0346 ,  H01L2224/036 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/27462 ,  H01L2224/29101 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01204 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device includes a semiconductor substrate with a wiring layer formed thereon, an insulating film formed on the semiconductor substrate so as to cover the wiring layer and having a pad opening exposing a portion of the wiring layer as a pad, a front surface protection film formed on the insulating film and being constituted of an insulating material differing from the insulating film and having a second pad opening securing exposure of at least a portion of the pad, a seed layer formed on the pad, and a plating layer formed on the seed layer.

公开(公告)号：US20190279915A1

公开(公告)日：2019-09-12

申请号：US16420978

申请日：2019-05-23

Applicant: Rohm Co., Ltd.

Inventor： Motoharu HAGA ,  Kaoru YASUDA ,  Akinori NII ,  Yuto NISHIYAMA

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

公开(公告)号：US20170271225A1

公开(公告)日：2017-09-21

申请号：US15611300

申请日：2017-06-01

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA ,  Akinori NII ,  Yuto NISHIYAMA

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56

CPC classification number: H01L23/291 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3192 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78306 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/01049

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

公开(公告)号：US20170162533A1

公开(公告)日：2017-06-08

申请号：US15367063

申请日：2016-12-01

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/0212 ,  H01L2224/0346 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/05042 ,  H01L2924/181 ,  H01L2924/01033 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/291

Abstract: A semiconductor device includes a semiconductor element having first and second main surfaces spaced apart in a thickness direction. The semiconductor element includes a metal underlying layer on the first main surface, a bonding pad on the metal underlying layer with a wire bonded to the pad, and an insulative protection layer formed on the first main surface and surrounding the bonding pad. The bonding pad includes first and second conductive layers. The first conductive layer covers the metal underlying layer and is made of a metal having a lower ionization tendency than the metal underlying layer. The second conductive layer covers the first conductive layer and is made of a metal having a lower ionization tendency than the first conductive layer. The first and second conductive layers have respective peripheries held in close contact with the protection layer and covering a part of the protection layer.

公开(公告)号：US20160013149A1

公开(公告)日：2016-01-14

申请号：US14794226

申请日：2015-07-08

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA ,  Akinori NII ,  Yuto NISHIYAMA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/10

CPC classification number: H01L23/291 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3192 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78306 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/01049

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

Abstract translation: 电子设备包括电子元件和接合到电子元件的导线。 电子元件包括接合焊盘，接合线与导线接合。 焊盘的主要部件是Al。 在金属丝中混合金属，混合金属是Pt，Pd和Au之一。