公开(公告)号：US20230369185A1

公开(公告)日：2023-11-16

申请号：US18246172

申请日：2021-09-03

Applicant: ROHM CO., LTD.

Inventor： Yuto NISHIYAMA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L24/49 ,  H01L23/49506 ,  H01L23/49513 ,  H01L24/48 ,  H01L23/49558 ,  H01L25/16 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/48137 ,  H01L24/32 ,  H01L2224/06181 ,  H01L2224/0603 ,  H01L24/29 ,  H01L2924/13091 ,  H01L2224/32245 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/29139 ,  H01L2924/10272 ,  H01L2224/06165 ,  H01L24/73

Abstract: A semiconductor device includes a switching element, a control element that controls the switching element, an island lead on which the switching element and the control element are mounted, and a plurality of terminal leads. The switching element includes a first electrode, a second electrode and a third electrode, where the first electrode and the second electrode are offset from the third electrode in a first sense of a thickness direction. The island lead has an obverse surface facing in the first sense of the thickness direction and supporting the switching element and the control element. Each terminal lead is electrically connected to the second electrode or the control element. The island lead is spaced apart from the plurality of terminal leads.

公开(公告)号：US20210257274A1

公开(公告)日：2021-08-19

申请号：US17252582

申请日：2019-06-26

Applicant: ROHM CO., LTD.

Inventor： Hirofumi TANAKA ,  Yuto NISHIYAMA

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/532 ,  H01L23/367 ,  H01L23/31

Abstract: A semiconductor element includes a main body and an obverse face electrode. The main body includes an obverse face that faces in a thickness direction. The obverse face electrode is electrically connected to the main body. The obverse face electrode includes a first section and a plurality of second sections. The first section is provided on the obverse face. The plurality of second sections are in contact with the first section, and spaced apart from each other in a direction perpendicular to the thickness direction. A total area of the plurality of second sections is smaller than an area of the first section including portions overlapping with the plurality of second sections, in a view along the thickness direction.

公开(公告)号：US20160005708A1

公开(公告)日：2016-01-07

申请号：US14755334

申请日：2015-06-30

Applicant: ROHM CO., LTD.

Inventor： Yuto NISHIYAMA ,  Motoharu HAGA

IPC: H01L23/00 ,  G01R33/02 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L24/48 ,  G01R33/0005 ,  G01R33/0047 ,  G01R33/02 ,  G01R33/0206 ,  G01R33/24 ,  H01L21/561 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/11 ,  H01L2924/146 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A semiconductor device includes: a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element mounted on the main surface of the substrate and having at least one element pad; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate for covering the wire and at least a portion of the semiconductor element. The semiconductor element has an element exposed side surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin.

Abstract translation: 半导体器件包括：基板，其具有基板部件，该基板部件具有主表面和与厚度方向相反的背面; 半导体元件，其安装在所述基板的主表面上并且具有至少一个元件焊盘; 电线，其具有接合到元件焊盘的接合部分; 以及密封树脂，其形成在所述基板的主表面上，用于覆盖所述导线和所述半导体元件的至少一部分。 半导体元件具有面向与基板的厚度方向交叉的方向的元件露出侧面，并从密封树脂露出。

公开(公告)号：US20240128169A1

公开(公告)日：2024-04-18

申请号：US18533721

申请日：2023-12-08

Applicant: ROHM CO., LTD.

Inventor： Hajime OKUDA ,  Yuto NISHIYAMA ,  Toru TAKUMA

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575

Abstract: A semiconductor device is configured to increase energy absorbed by an active clamp. The semiconductor device comprises a semiconductor element, a sealing resin, and a coating member. The semiconductor element includes a first electrode. The sealing resin covers the semiconductor element. The coating member is interposed between the first electrode and the sealing resin. The coating member contains a material with higher thermal conductivity than the sealing resin.

公开(公告)号：US20170148757A1

公开(公告)日：2017-05-25

申请号：US15426333

申请日：2017-02-07

Applicant: ROHM CO., LTD.

Inventor： Yuto NISHIYAMA ,  Motoharu HAGA

IPC: H01L23/00 ,  G01R33/02 ,  H01L23/498 ,  G01R33/00 ,  H01L23/31 ,  H01L23/13

CPC classification number: H01L24/48 ,  G01R33/0005 ,  G01R33/0047 ,  G01R33/02 ,  G01R33/0206 ,  G01R33/24 ,  H01L21/561 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/11 ,  H01L2924/146 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A semiconductor device includes: a substrate including a base member having a main surface and a back surface facing opposite in a thickness direction; a semiconductor element mounted on the main surface of the substrate and having at least one element pad; a wire having a bonding portion bonded to the element pad; and a sealing resin formed on the main surface of the substrate for covering the wire and at least a portion of the semiconductor element. The semiconductor element has an element exposed side surface that faces in a direction crossing the thickness direction of the substrate and is exposed from the sealing resin.

公开(公告)号：US20230378018A1

公开(公告)日：2023-11-23

申请号：US18317632

申请日：2023-05-15

Applicant: ROHM CO., LTD.

Inventor： Hajime OKUDA ,  Yuto NISHIYAMA ,  Toru TAKUMA ,  Katsuaki YAMADA

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/06 ,  H01L24/32 ,  H01L24/29 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05655 ,  H01L2224/05644 ,  H01L2224/05639 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2924/01014 ,  H01L2224/06181 ,  H01L2224/05552 ,  H01L2224/29144 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45139 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45644 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/48451 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/48101 ,  H01L2224/4901 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/73215 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/4945 ,  H01L23/49513

Abstract: A semiconductor device includes: a substrate; a device region provided in the substrate; a terminal covering the device region in a plan view; a plurality of pseudo-bumps densely arranged on the terminal in a state of being opened from a wire; and at least one genuine bump arranged more sparsely than the plurality of the pseudo-bumps on the terminal in a state of being connected to the wire.

公开(公告)号：US20190279915A1

公开(公告)日：2019-09-12

申请号：US16420978

申请日：2019-05-23

Applicant: Rohm Co., Ltd.

Inventor： Motoharu HAGA ,  Kaoru YASUDA ,  Akinori NII ,  Yuto NISHIYAMA

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

公开(公告)号：US20170271225A1

公开(公告)日：2017-09-21

申请号：US15611300

申请日：2017-06-01

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA ,  Akinori NII ,  Yuto NISHIYAMA

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56

CPC classification number: H01L23/291 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3192 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78306 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/01049

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

公开(公告)号：US20160013149A1

公开(公告)日：2016-01-14

申请号：US14794226

申请日：2015-07-08

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Kaoru YASUDA ,  Akinori NII ,  Yuto NISHIYAMA

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/10

CPC classification number: H01L23/291 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3192 ,  H01L23/4952 ,  H01L23/49541 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/48824 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78306 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/01049

Abstract: An electronic device includes an electronic element, and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The main component of the bonding pad is Al. A metal is mixed in the wire, and the mixed metal is one of Pt, Pd and Au.

Abstract translation: 电子设备包括电子元件和接合到电子元件的导线。 电子元件包括接合焊盘，接合线与导线接合。 焊盘的主要部件是Al。 在金属丝中混合金属，混合金属是Pt，Pd和Au之一。