公开(公告)号：US06412971B1

公开(公告)日：2002-07-02

申请号：US09258935

申请日：1999-03-01

申请人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  William Paul Kornrumpf

发明人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  William Paul Kornrumpf

IPC分类号： H01L3300

CPC分类号： H01L24/10 ,  F21K9/232 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L21/3043 ,  H01L21/76898 ,  H01L21/78 ,  H01L24/13 ,  H01L25/0652 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00 ,  H01L2224/05599

摘要： A light source includes a substrate; an array of un-packaged light emitting semiconductor devices (LESDs), each of the LESDs having at least one surface for emitting light and a substrate surface being attached to the substrate; and a plurality of electrical connections, each electrical connection coupled for providing electrical power to a respective LESD. The LESDs are arranged on the substrate with sufficient density and light generating capability to provide a predetermined irradiation from the light source.

摘要翻译： 光源包括基板; 一组未封装的发光半导体器件（LESD），每个LESD具有至少一个用于发光的表面和一个衬底表面附着于衬底; 以及多个电连接，每个电连接用于向相应的LESD提供电力。 LESD被布置在具有足够的密度和光产生能力的基板上，以提供来自光源的预定辐射。

公开(公告)号：US5900674A

公开(公告)日：1999-05-04

申请号：US781972

申请日：1996-12-23

申请人： Robert John Wojnarowski ,  Barry Scott Whitmore

发明人： Robert John Wojnarowski ,  Barry Scott Whitmore

IPC分类号： H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01L23/40

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913

摘要： An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

公开(公告)号：US6046410A

公开(公告)日：2000-04-04

申请号：US139049

申请日：1998-08-24

申请人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

发明人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

IPC分类号： H01L21/48 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R9/09

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K3/326 ,  H05K3/4092 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913

摘要： An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

摘要翻译： 界面包括具有导电垫的表面; 表面上的柔顺涂层具有延伸到垫的通孔; 金属化图案化在柔性涂层上并延伸到通孔中; 覆盖顺应性涂层并具有延伸到金属化的界面的低模量介电界面层; 以及浮动衬垫结构，其包括在电介质界面层上图案化的浮动衬垫金属化，第一部分形成中心焊盘，第二部分形成从延伸到接口通孔的中心焊盘的延伸部分。 另一个界面包括一个衬底，该衬底包括一个具有至少部分贯穿其中延伸的孔的低模量介电界面材料，以及一个浮动接触结构，其包括导电材料，该导电材料涂覆孔，浮动金属化中的至少一些从孔形成延伸。 导电接触区界面可以包括导电的第一接触区域; 面向并基本上与第一接触区域对准的导电的第二接触区域; 以及耦合在所述第一和第二接触区域之间的至少一个接口结构，并且包括具有部分敞开的内部的电导体，以在所述第一和第二接触区域之间形成柔性接头。

公开(公告)号：US06298551B1

公开(公告)日：2001-10-09

申请号：US09459586

申请日：1999-12-13

申请人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

发明人： Robert John Wojnarowski ,  Barry Scott Whitmore ,  Bernard Gorowitz

IPC分类号： H05K336

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/10257 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10S438/94 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00

摘要： An interface includes a surface having an electrically conductive pad; a compliant coating over the surface having a via extending to the pad; metallization patterned over the compliant coating and extending into the via; a low modulus dielectric interface layer overlying the compliant coating and having an interface via extending to the metallization; and a floating pad structure including floating pad metallization patterned over the dielectric interface layer with a first portion forming a central pad and a second portion forming an extension from the central pad extending into the interface via. Another interface includes a substrate including a low modulus dielectric interface material having a hole extending at least partially therethrough and a floating contact structure including electrically conductive material coating the hole with at least some of the floating pad metallization forming an extension from the hole. A conductive contact area interface may include an electrically conductive first contact area; an electrically conductive second contact area facing and being substantially aligned with the first contact area; and at least one interface structure coupled between the first and second contact areas and including an electrical conductor having a partially open interior to form a compliant joint between the first and second contact areas.

摘要翻译： 界面包括具有导电垫的表面; 表面上的柔顺涂层具有延伸到垫的通孔; 金属化图案化在柔性涂层上并延伸到通孔中; 覆盖顺应性涂层并具有延伸到金属化的界面的低模量介电界面层; 以及浮动衬垫结构，其包括在电介质界面层上图案化的浮动衬垫金属化，第一部分形成中心焊盘，第二部分形成从延伸到接口通孔的中心焊盘的延伸部分。 另一个界面包括一个衬底，该衬底包括一个具有至少部分贯穿其中延伸的孔的低模量介电界面材料，以及一个浮动接触结构，其包括导电材料，该导电材料涂覆孔，浮动金属化中的至少一些从孔形成延伸。 导电接触区界面可以包括导电的第一接触区域; 面向并基本上与第一接触区域对准的导电的第二接触区域; 以及耦合在所述第一和第二接触区域之间的至少一个接口结构，并且包括具有部分敞开的内部的电导体，以在所述第一和第二接触区域之间形成柔性接头。

公开(公告)号：US06655011B1

公开(公告)日：2003-12-02

申请号：US09677718

申请日：2000-10-02

申请人： William Paul Kornrumpf ,  Robert John Wojnarowski

发明人： William Paul Kornrumpf ,  Robert John Wojnarowski

IPC分类号： H01H1100

CPC分类号： H01H1/0036 ,  H01H61/0107 ,  H01H2001/0042 ,  H01H2001/0073 ,  H01H2001/0084 ,  H01H2061/006 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49155

摘要： A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.

摘要翻译： 具有基面的开关结构; 覆盖基底表面层的第一高密度互连（HDI）塑料互连层; HDI塑料互连层内的空腔; 覆盖HDI塑料互连层和空腔的至少一个图案形状记忆合金（SMA）层，以及至少一个图案化的SMA层上的至少一个图案化导电层; 空腔内的固定接触焊盘并附接到基体表面，以及可移动接触垫，其附接到空腔内的第一图案化SMA层的一部分，使得当第一和第二图案化SMA层和第一和第二图案化金属化层为 在第一稳定位置，可动接触垫接触固定接触垫，由此提供电连接并形成闭合的开关。 该结构具有第二稳定位置，其中SMA和金属化层从空腔弯曲，使得接触焊盘不接触并形成开放的开关。

公开(公告)号：US06262573B1

公开(公告)日：2001-07-17

申请号：US09397839

申请日：1999-09-17

申请人： Robert John Wojnarowski ,  Kenneth Brakeley Welles, II ,  William Paul Kornrumpf

发明人： Robert John Wojnarowski ,  Kenneth Brakeley Welles, II ,  William Paul Kornrumpf

IPC分类号： B61K910

CPC分类号： B61L23/044 ,  B61K9/10 ,  B61L3/121 ,  B61L25/025 ,  B61L2205/04 ,  G01M5/0025 ,  G01M5/0033 ,  G01M5/0091 ,  G01N27/82

摘要： An electromagnetic system for detecting cracked rail and enhancing traction when necessary, includes wiring coils around wheel axles, and a corresponding power source for supplying power to the coils for producing electromagnetic flux. The produced electromagnetic flux is routed through the wheel axles, wheels and rails in a closed circuit. When a cracked rail is encountered along the route, the circuit will be interrupted or open, resulting in a changed flux pattern. This pattern change is detected by a flux sensor, and the geographic location of the crack in the rail is determined. The electromagnetic system further includes an electromagnetic wheel loading means for generating an attraction to the rails. The generated attraction to the rails increases friction between the wheels and the rails, thereby increasing traction to enable hauling greater loads up steep grades.

摘要翻译： 一种用于检测裂纹轨道并在必要时增强牵引力的电磁系统包括轮轴周围的线圈线圈和用于向线圈供电以产生电磁通量的相应电源。 所产生的电磁通量在闭合回路中通过轮轴，轮子和轨道。 沿着路线遇到破裂的轨道时，电路将被中断或打开，导致通量变化曲线的变化。 这种模式变化由通量传感器检测，并确定轨道中裂纹的地理位置。 电磁系统还包括用于产生对轨道的吸引力的电磁轮加载装置。 所产生的对轨道的吸引力增加了车轮和轨道之间的摩擦，从而增加了牵引力，从而能够将更大的载荷牵引到陡坡上。

公开(公告)号：US06188301B1

公开(公告)日：2001-02-13

申请号：US09192103

申请日：1998-11-13

申请人： William Paul Kornrumpf ,  Robert John Wojnarowski

发明人： William Paul Kornrumpf ,  Robert John Wojnarowski

IPC分类号： H01P110

CPC分类号： H01H1/0036 ,  H01H61/0107 ,  H01H2001/0042 ,  H01H2001/0073 ,  H01H2001/0084 ,  H01H2061/006 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49155

摘要： A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.

摘要翻译： 具有基面的开关结构; 覆盖基底表面层的第一高密度互连（HDI）塑料互连层; HDI塑料互连层内的空腔; 覆盖HDI塑料互连层和空腔的至少一个图案形状记忆合金（SMA）层，以及至少一个图案化的SMA层上的至少一个图案化导电层; 空腔内的固定接触焊盘并附接到基体表面，以及可移动接触垫，其附接到空腔内的第一图案化SMA层的一部分，使得当第一和第二图案化SMA层和第一和第二图案化金属化层为 在第一稳定位置，可动接触垫接触固定接触垫，由此提供电连接并形成闭合的开关。 该结构具有第二稳定位置，其中SMA和金属化层从空腔弯曲，使得接触焊盘不接触并形成开放的开关。

公开(公告)号：US07572973B2

公开(公告)日：2009-08-11

申请号：US12328788

申请日：2008-12-05

申请人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

发明人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

IPC分类号： H01L35/34 ,  H02N10/00

CPC分类号： H01L35/32 ,  Y10T156/1092

摘要： A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

摘要翻译： 制造固态热转印装置的方法包括彼此相对定位的第一和第二导电基板。 固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电 底物。

公开(公告)号：US20090031733A1

公开(公告)日：2009-02-05

申请号：US11830890

申请日：2007-07-31

申请人： Stanton Earl Weaver, JR. ,  Mehmet Arik ,  James William Bray ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Mark Wayne Wilson ,  Jason Knud Klindtworth ,  Surajit Atha

发明人： Stanton Earl Weaver, JR. ,  Mehmet Arik ,  James William Bray ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Mark Wayne Wilson ,  Jason Knud Klindtworth ,  Surajit Atha

IPC分类号： F25B21/02

CPC分类号： F25B21/00 ,  F25B2321/003 ,  Y02B30/66

摘要： A refrigeration system is provided. The refrigeration system includes at least one thermal blocking thermotunneling device. The thermal blocking thermotunneling device comprises a first and a second surface separated by a nanoscale gap of less than about 20 nm, such that tunneling of electrons causes a unidirectional transfer of heat from the first surface to the second surface. Further, the at least one thermal blocking thermotunneling device has a thermal back path of less than about 70 percent.

摘要翻译： 提供制冷系统。 制冷系统包括至少一个热阻热电火花钻孔装置。 热阻焊热电火焰装置包括由小于约20nm的纳米尺度间隙分开的第一和第二表面，使得电子的隧穿导致热量从第一表面到第二表面的单向转移。 此外，所述至少一个热阻焊热电火花钻孔装置具有小于约70％的热回路径。

公开(公告)号：US06410356B1

公开(公告)日：2002-06-25

申请号：US09520751

申请日：2000-03-07

申请人： Robert John Wojnarowski ,  Ernest Wayne Balch ,  Leonard Richard Douglas

发明人： Robert John Wojnarowski ,  Ernest Wayne Balch ,  Leonard Richard Douglas

IPC分类号： H01L2166

CPC分类号： H01L22/20 ,  H01L23/34 ,  H01L2224/92144 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/00

摘要： A method for interconnecting high-temperature silicon carbide (SiC) devices enables such high-temperature devices to be used in fabricating electronic circuits of significant scale. This method comprises empirically measuring operational characteristics of a plurality of the devices to be interconnected, the operational characteristics comprising devices which are measured to be non-working and devices which are measured to be working; characterizing the operational characteristics in an operational characteristics map; designing interconnection paths between and among the devices that are characterized to be working by the operational characteristics map; and excluding from the interconnection paths, devices that are characterized to be non-working by the operational characteristics map. A preferred embodiment of this method further includes disposing a temporary polymer layer over the devices; forming via holes through the temporary polymer layer, to bonding pads of the devices; applying a current-balancing resistive metal over the temporary polymer layer; establishing connections between the current-balancing resistive metal and the bonding pads; designing the interconnection paths between and among the working devices by patterning the current-balancing resistive metal based on the operational characteristics map; and removing the temporary polymer layer.

摘要翻译： 用于互连高温碳化硅（SiC）器件的方法使得这种高温器件能够用于制造具有显着规模的电子电路。 该方法包括经验地测量待互连的多个设备的操作特性，操作特性包括被测量为不工作的设备和被测量为工作的设备; 表征操作特征图中的操作特性; 设计特征在于通过操作特征图工作的设备之间的互连路径; 并且从互连路径中排除特征在于通过操作特性图不工作的设备。 该方法的优选实施例还包括在器件上设置临时聚合物层; 通过所述临时聚合物层形成通孔到所述装置的焊盘; 在临时聚合物层上施加电流平衡电阻金属; 建立电流平衡电阻金属和焊盘之间的连接; 通过基于操作特性图构图电流平衡电阻金属来设计工作装置之间和之间的互连路径; 并除去临时聚合物层。