摘要:
A method for forming narrow length transistors by forming a trench in a first layer over a semiconductor substrate. Spacers are then formed within the trench and a gate dielectric is formed between the spacers at the bottom of the trench on the semiconductor substrate. The trench is then filled with a gate electrode material which is chemically-mechanically polished back to isolate the gate electrode material within the trench, and the first layer is removed leaving the gate dielectric, gate electrode and spacers behind.
摘要:
A novel transistor with a low resistance ultra shallow tip region and its method of fabrication in a complementary metal oxide semiconductor (CMOS) process. According to the preferred method of the present invention, a first gate dielectric and a first gate electrode are formed on a first portion of a semiconductor substrate having a first conductivity type, and a second gate dielectric and a said gate electrode are formed on a second portion of semiconductor substrate having a second conductivity type. A silicon nitride layer is formed over the first portion of the semiconductor substrate including the first gate electrode and over the second portion of the semiconductor substrate including the second gate electrode. The silicon nitride layer is removed from the second portion of the silicon substrate and from the top of the second gate electrode to thereby form a first pair of silicon nitride spacers adjacent to opposite sides of the second gate electrode. A pair of recesses are then formed in the second portion of the semiconductor substrate in alignment with the first pair of sidewall spacers. A selectively deposited semiconductor material is then formed in the recesses.
摘要:
A novel transistor with a low resistance ultra shallow tip region and its method of fabrication. The novel transistor of the present invention has a source/drain extension or tip region comprising an ultra shallow region which extends beneath the gate electrode and a raised region.
摘要:
A novel transistor with a low resistance ultra shallow tip region and its method of fabrication. The novel transistor of the present invention has a source/drain extension or tip comprising an ultra shallow region which extends beneath the gate electrode and a raised region.
摘要:
A new method of isolating a polysilicon emitter from the base region of a bipolar transistor, trenching the polysilicon emitter into the semiconductor substrate, and maintaining a consistent base width of a bipolar transistor independent of variations in emitter mask thicknesses is disclosed. The polysilicon emitter isolation provides for better electrical breakdown characteristics between the emitter and the base by protecting the dielectric layer between the polysilicon emitter and base regions from defects and contamination associated with the BiCMOS manufacturing environment. The polysilicon emitter is trenched into the semiconductor substrate in order to reduce transistor operation problems associated with hot electron injection. Consistent base widths improve transistor performance uniformity thereby improving manufacturability and reliability.
摘要:
A new method of isolating a polysilicon emitter from the base region of a bipolar transistor, trenching the polysilicon emitter into the semiconductor substrate, and maintaining a consistent base width of a bipolar transistor independent of variations in emitter mask thicknesses is disclosed. The polysilicon emitter isolation provides for better electrical breakdown characteristics between the emitter and the base by protecting the dielectric layer between the polysilicon emitter and base regions from defects and contamination associated with the BiCMOS manufacturing environment. The polysilicon emitter is trenched into the semiconductor substrate in order to reduce transistor operation problems associated with hot electron injection. Consistent base widths improve transistor performance uniformity thereby improving manufacturability and reliability.
摘要:
A method of forming an integrated circuit includes forming at least one transistor over a substrate. Forming the at least one transistor includes forming a gate dielectric structure over a substrate. A work-function metallic layer is formed over the gate dielectric structure. A conductive layer is formed over the work-function metallic layer. A source/drain (S/D) region is formed adjacent to each sidewall of the gate dielectric structure. At least one electrical fuse is formed over the substrate. Forming the at least one electrical fuse includes forming a first semiconductor layer over the substrate. A first silicide layer is formed on the first semiconductor layer.
摘要:
A multiple-phase clock generator includes at least one stage of dividers. A clock signal is supplied as a first stage clock input to dividers in a first stage of dividers. An N-th stage includes 2N dividers, where N is a positive integer number. Each divider in the first stage is configured to divide a first clock frequency of the first stage clock input by 2 to provide a first stage output. Each divider in the N-th stage is configured to divide an N-th clock frequency of an N-th stage clock input by 2 to provide an N-th stage output. The N-th stage outputs from the dividers in the N-th stage provide 2N-phase clock signals that are equally distributed with a same phase difference between adjacent phase clock signals.
摘要:
A transimpedance amplifier includes a first inverter having a first input node and a first output node. The first input node is configured to be coupled to an input signal. A second inverter has a second input node and a second output node. The second input node is configured to receive a reference voltage terminal. The first inverter and the second inverter are configured to provide a differential output voltage signal between the first output node and the second output node.
摘要:
A circuit includes a summation circuit for receiving an input data signal and a feedback signal including a previous data bit. The summation circuit is configured to output a conditioned input data signal to a clock and data recovery circuit. A first flip-flop is coupled to an output of the summation circuit and is configured to receive a first set of bits of the conditioned input data signal and a first clock signal having a frequency that is less than a frequency at which the input data signal is received by the first summation circuit. A second flip-flop is coupled to the output of the summation circuit and is configured to receive a second set of bits of the conditioned input data signal and a second clock signal having a frequency that is less than the frequency at which the input data signal is received by the first summation circuit.