公开(公告)号：US20050263867A1

公开(公告)日：2005-12-01

申请号：US11127192

申请日：2005-05-12

申请人： Rokuro Kambe ,  Tetsuya Kasiwagi ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

发明人： Rokuro Kambe ,  Tetsuya Kasiwagi ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

IPC分类号： H01F5/00 ,  H01L23/02 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K1/11 ,  H05K3/46

CPC分类号： H01L23/50 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2224/05599

摘要： An intermediate substrate is provided which reduces the effect of the difference in the coefficients of linear expansion between the terminals of the substrate and those of a semiconductor integrated circuit device, and which thus lowers the likelihood of disconnection due to thermal stress. The intermediate substrate, which is a planar member made of a polymeric material, includes a substrate core including a main core body having formed therein a sub-core compartment, and a ceramic sub-core section accommodated in the compartment. A first terminal array on the first principal surface side includes two types of terminals, functioning either as power source terminals or ground terminals, and a signal terminal. The array occupies an area entirely included within an orthogonally projected region of the sub-core section projected onto a reference plane parallel to the planar surface of the substrate core.

摘要翻译： 提供了一种中间衬底，其减小了衬底的端子与半导体集成电路器件的端子之间的线性膨胀系数的差异的影响，从而降低了由于热应力引起的断开的可能性。 作为由聚合物材料制成的平面构件的中间基板包括：基材芯，其包括形成有副芯隔室的主芯体和容纳在隔室中的陶瓷副芯部。 第一主表面侧的第一端子阵列包括用作电源端子或接地端子的两种类型的端子和信号端子。 阵列占据完全包括在子芯部分的正交投影区域内的区域，该区域投影到平行于衬底芯的平面表面的参考平面上。

公开(公告)号：US07002075B2

公开(公告)日：2006-02-21

申请号：US11126157

申请日：2005-05-11

申请人： Rokuro Kambe ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

发明人： Rokuro Kambe ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

IPC分类号： H02G3/08

CPC分类号： H05K1/0231 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/50 ,  H01L27/016 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10712 ,  H01L2224/05599

摘要： An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.

摘要翻译： 中间基板包括由主体芯体部分形成的基体芯部，所述主芯体部分由聚合物材料片构成并且具有形成在其中的副芯部容纳部分。 由陶瓷片构成的陶瓷副芯部被容纳在副芯容纳部中，其厚度与主芯体部的厚度一致。 在芯部的板状基体的第一主面侧形成薄膜电容器，并且包括通过薄膜电介质层彼此分离的第一和第二薄膜电极，以便在电极之间提供直流隔离 。 第一端子阵列的第一和第二直流隔离端子电连接到第一和第二薄膜电极。

公开(公告)号：US06979890B2

公开(公告)日：2005-12-27

申请号：US11127192

申请日：2005-05-12

申请人： Rokuro Kambe ,  Tetsuya Kasiwagi ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

发明人： Rokuro Kambe ,  Tetsuya Kasiwagi ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

IPC分类号： H01F5/00 ,  H01L23/02 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K1/11 ,  H05K3/46

CPC分类号： H01L23/50 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2224/05599

摘要： An intermediate substrate is provided which reduces the effect of the difference in the coefficients of linear expansion between the terminals of the substrate and those of a semiconductor integrated circuit device, and which thus lowers the likelihood of disconnection due to thermal stress. The intermediate substrate, which is a planar member made of a polymeric material, includes a substrate core including a main core body having formed therein a sub-core compartment, and a ceramic sub-core section accommodated in the compartment. A first terminal array on the first principal surface side includes two types of terminals, functioning either as power source terminals or ground terminals, and a signal terminal. The array occupies an area entirely included within an orthogonally projected region of the sub-core section projected onto a reference plane parallel to the planar surface of the substrate core.

摘要翻译： 提供了一种中间衬底，其减小了衬底的端子与半导体集成电路器件的端子之间的线性膨胀系数的差异的影响，从而降低了由于热应力引起的断开的可能性。 作为由聚合物材料制成的平面构件的中间基板包括：基材芯，其包括形成有副芯隔室的主芯体和容纳在隔室中的陶瓷副芯部。 第一主表面侧的第一端子阵列包括用作电源端子或接地端子的两种类型的端子和信号端子。 阵列占据完全包括在子芯部分的正交投影区域内的区域，该区域投影到平行于衬底芯的平面表面的参考平面上。

公开(公告)号：US20050207091A1

公开(公告)日：2005-09-22

申请号：US11126157

申请日：2005-05-11

申请人： Rokuro Kambe ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

发明人： Rokuro Kambe ,  Yukihiro Kimura ,  Yasuhiro Sugimoto ,  Kazuhiro Suzuki

IPC分类号： H01L23/12 ,  H01G4/228 ,  H01L23/498 ,  H01L23/50 ,  H01L27/01 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/0231 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/50 ,  H01L27/016 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10712 ,  H01L2224/05599

摘要： An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.

摘要翻译： 中间基板包括由主体芯体部分形成的基体芯部，所述主芯体部分由聚合物材料片构成并且具有形成在其中的副芯部容纳部分。 由陶瓷片构成的陶瓷副芯部被容纳在副芯容纳部中，其厚度与主芯体部的厚度一致。 在芯部的板状基体的第一主面侧形成薄膜电容器，并且包括通过薄膜电介质层彼此分离的第一和第二薄膜电极，以在电极之间提供直流隔离 。 第一端子阵列的第一和第二直流隔离端子电连接到第一和第二薄膜电极。

公开(公告)号：US20060043572A1

公开(公告)日：2006-03-02

申请号：US10927134

申请日：2004-08-27

申请人： Yasuhiro Sugimoto ,  Kazunaga Higo ,  Kazuhiro Suzuki

发明人： Yasuhiro Sugimoto ,  Kazunaga Higo ,  Kazuhiro Suzuki

IPC分类号： H01L29/40

CPC分类号： H01L23/66 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09809

摘要： A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z0; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.

摘要翻译： 一种布线板，包括：板芯，具有第一主表面和第二主表面; 包括导体线的导体层; 电介质层与所述导体层交替地层叠在所述第一和第二主表面中的至少一个上; 通孔导体; 如本文所定义的信号通孔; 如本文所定义的信号通孔导体; 如本文所定义的第一路径端垫; 如本文所定义的第二路径端垫; 如本文所定义的屏蔽通孔; 和如本文所定义的屏蔽通孔导体; 其中：如本文所定义的形成信号传输路径; 所述导体层中的至少一个设置在所述第一和第二主表面侧的每一个上; 所述第一主表面侧的所述表面导体和所述导体线形成具有恒定特性阻抗Z0的带状线，微带线或共面波导; 所述屏蔽通孔的内表面被所述屏蔽通孔导体覆盖; 并且如本文所定义的那样调节所述信号通孔导体和所述屏蔽通孔导体之间的间隔距离。

公开(公告)号：US07339260B2

公开(公告)日：2008-03-04

申请号：US10927134

申请日：2004-08-27

申请人： Yasuhiro Sugimoto ,  Kazunaga Higo ,  Kazuhiro Suzuki

发明人： Yasuhiro Sugimoto ,  Kazunaga Higo ,  Kazuhiro Suzuki

IPC分类号： H01L23/12 ,  H01L23/02 ,  H05K3/46 ,  H05K1/02 ,  H01H29/40

CPC分类号： H01L23/66 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/0969 ,  H05K2201/09718 ,  H05K2201/09809

摘要： A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z0; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.

摘要翻译： 一种布线板，包括：板芯，具有第一主表面和第二主表面; 包括导体线的导体层; 电介质层与所述导体层交替地层叠在所述第一和第二主表面中的至少一个上; 通孔导体; 如本文所定义的信号通孔; 如本文所定义的信号通孔导体; 如本文所定义的第一路径端垫; 如本文所定义的第二路径端垫; 如本文所定义的屏蔽通孔; 和如本文所定义的屏蔽通孔导体; 其中：如本文所定义的形成信号传输路径; 所述导体层中的至少一个设置在所述第一和第二主表面侧的每一个上; 所述第一主表面侧的所述表面导体和所述导体线形成具有恒定特性阻抗Z 0的带状线，微带线或共面波导; 所述屏蔽通孔的内表面被所述屏蔽通孔导体覆盖; 并且如本文所定义的那样调整所述信号通孔导体和所述屏蔽通孔导体之间的间隔距离。

公开(公告)号：US09202622B2

公开(公告)日：2015-12-01

申请号：US13813174

申请日：2012-06-29

申请人： Koji Kai ,  Kazuki Houzan ,  Akira Nagai ,  Kazuhiro Suzuki

发明人： Koji Kai ,  Kazuki Houzan ,  Akira Nagai ,  Kazuhiro Suzuki

IPC分类号： B23K11/24 ,  H01F27/06 ,  H01F38/08 ,  B23K11/11 ,  H01F27/40

CPC分类号： H01F38/085 ,  B23K11/115 ,  B23K11/241 ,  B23K2101/18 ,  H01F2027/408

摘要： It is possible to control a welding in a high speed and a high precision large electric current, and consumption electric power is also reduced. In the welding transformer, a loop magnetic core 25, a wound primary coil 12, plural positive side coils 14 and plural negative side coils 16 that are alternately sandwiched between respective gaps 12a of the primary coil 12, are comprised. A coil is fixed on the other surface of a contact base member 62. On the other surface of the contact base member 62, a first connection polar board 44 is electrically connected to a positive side electric conductor 30 through the first connection polar board 44. A negative side coil 16 is electrically connected to a negative side electric conductor 32. The connecting part of the positive side coil 14 and the negative side coil 16 is electrically connected to the third connection polar board 48. By sandwiching a thin insulation layer 31, a positive side electric conductor 30, a rectifying device 18 and a first polar board 34 are arranged on one side; A negative side electric conductor 32, a rectifying device 20 and a second polar board 36 are arranged on the other side; and the first polar board 34 and the second polar board 36 are electrically connected to a third polar board 38. It is possible to use by combining plural units and by connecting an output side in parallel in a small size and a large capacity.

摘要翻译： 可以高速，高精度的大电流控制焊接，消耗电力也降低。 在焊接变压器中，包括交替夹在初级线圈12的相应间隙12a之间的环形磁芯25，绕组初级线圈12，多个正侧线圈14和多个负侧线圈16。 线圈固定在接触基底构件62的另一个表面上。在接触基底构件62的另一个表面上，第一连接极板44通过第一连接极板44电连接到正侧电导体30。 负极侧线圈16与负极侧导体32电连接。正极侧线圈14与负极侧线圈16的连接部与第3连接极板48电连接。通过夹持薄层绝缘层31， 正侧导电体30，整流装置18和第一极板34一侧配置; 负侧导电体32，整流装置20和第二极板36配置在另一侧。 并且第一极板34和第二极板36电连接到第三极板38.可以通过组合多个单元并且通过以小尺寸和大容量并联连接输出侧来使用。

公开(公告)号：US09076256B2

公开(公告)日：2015-07-07

申请号：US13578952

申请日：2011-03-09

申请人： Hiroyuki Ishige ,  Kazuhiro Suzuki ,  Akira Miyashita

发明人： Hiroyuki Ishige ,  Kazuhiro Suzuki ,  Akira Miyashita

IPC分类号： G06K9/36 ,  G06T19/00 ,  G06T7/00 ,  G06F3/01

CPC分类号： G06T19/006 ,  G06F3/011 ,  G06T7/73

摘要： An information processing apparatus that acquires first posture information corresponding to the information processing apparatus and a first distance coordinate corresponding to the information processing apparatus, and second posture information corresponding to another information processing apparatus and a second distance coordinate corresponding to the another information processing apparatus. The information processing apparatus then calculates an object's position in a virtual space based on the first and second posture information and the first and second distance coordinates.

摘要翻译： 一种信息处理装置，其获取与所述信息处理装置对应的第一姿态信息和与所述信息处理装置对应的第一距离坐标，以及与所述另一信息处理装置对应的第二姿势信息和与所述另一信息处理装置对应的第二距离坐标。 信息处理装置然后基于第一和第二姿势信息以及第一和第二距离坐标来计算物体在虚拟空间中的位置。

公开(公告)号：US09005500B2

公开(公告)日：2015-04-14

申请号：US12970672

申请日：2010-12-16

申请人： Michimasa Ote ,  Takashi Gonda ,  Junya Ishida ,  Kenro Takizawa ,  Kazuhiro Suzuki ,  Yuzo Morioka

发明人： Michimasa Ote ,  Takashi Gonda ,  Junya Ishida ,  Kenro Takizawa ,  Kazuhiro Suzuki ,  Yuzo Morioka

IPC分类号： B29C47/10 ,  B29C47/94 ,  B29C47/92 ,  B29C47/00 ,  B29C47/88 ,  C08J5/18 ,  C08L79/08 ,  H01G4/18 ,  H01G13/00 ,  B29C47/14 ,  B29K79/00 ,  B29K105/00

CPC分类号： B29C47/10 ,  B29C47/0004 ,  B29C47/0021 ,  B29C47/1072 ,  B29C47/14 ,  B29C47/8845 ,  B29C47/886 ,  B29C47/92 ,  B29C2947/92152 ,  B29C2947/922 ,  B29C2947/92228 ,  B29C2947/92238 ,  B29C2947/92285 ,  B29C2947/92342 ,  B29C2947/92438 ,  B29C2947/92447 ,  B29C2947/9259 ,  B29C2947/92923 ,  B29K2079/085 ,  B29K2105/256 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H01G4/18 ,  H01G13/00 ,  Y10T428/24355

摘要： When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portion 7a of a T-die 7, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die 7. Having been covered with a very thin film 8a of the simple polyetherimide resin, on a flow passage face of the lip portion 7a of the T-die 7, a resin composition layer 8b including a polyetherimide resin and a fluorine resin, which has affinity with the film 8a, is then formed at a center part.

摘要翻译： 当通过挤出机挤出熔融树脂时，将简单的聚醚酰亚胺树脂从T型模头7的唇部7a熔融挤出，并且模制简单的聚醚酰亚胺树脂的膜。 然后将成型材料切换成包括聚醚酰亚胺树脂和氟树脂的树脂组合物，然后将树脂组合物的膜从T模具7连续地挤出和模塑。已经用简单的薄膜8a覆盖 聚醚酰亚胺树脂，在T型模​​7的唇部7a的流路面上，与中心部分形成有与膜8a亲和的聚醚酰亚胺树脂和氟树脂的树脂组合物层8b。

公开(公告)号：US08742527B2

公开(公告)日：2014-06-03

申请号：US13416290

申请日：2012-03-09

申请人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

发明人： Kazuhiro Suzuki ,  Risako Ueno ,  Honam Kwon ,  Mitsuyoshi Kobayashi ,  Hideyuki Funaki

IPC分类号： H01L21/00 ,  H01L31/0232

CPC分类号： H01L27/14605 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： According to one embodiment, a solid state imaging device includes a sensor substrate curved such that an upper face having a plurality of pixels formed is recessed and an imaging lens provided on the upper face side.

摘要翻译： 根据一个实施例，固态成像装置包括弯曲的传感器基板，使得形成有多个像素的上表面凹陷，并且设置在上表面侧的成像透镜。