公开(公告)号：US20060193108A1

公开(公告)日：2006-08-31

申请号：US11359429

申请日：2006-02-23

申请人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue ,  Makoto Murai

发明人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue ,  Makoto Murai

IPC分类号： H02B1/00

CPC分类号： H01L23/5389 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/24145 ,  H01L2224/24195 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/323 ,  H05K3/4652 ,  H05K2201/10515 ,  H01L2924/00

摘要： A thin circuit device that can operate at a high speed is provided. The circuit device includes a first circuit element and a circuit element portion formed on a substrate. The first circuit element and the circuit element portion are arranged in such a manner that element surfaces thereof are opposed to each other. A terminal formed on the element surface of the first circuit element and a terminal formed on the element surface of the circuit element portion are electrically connected to each other via conductive particles in a binder forming an anisotropic conductive film and a via. The anisotropic conductive film and a third insulating resin film are bonded by thermocompression bonding in the same step, thereby simplifying manufacturing steps of the circuit device.

摘要翻译： 提供可以高速运行的薄电路器件。 电路装置包括第一电路元件和形成在基板上的电路元件部分。 第一电路元件和电路元件部分以其元件表面彼此相对的方式布置。 形成在第一电路元件的元件表面上的端子和形成在电路元件部分的元件表面上的端子通过形成各向异性导电膜和通孔的粘合剂中的导电颗粒彼此电连接。 各向异性导电膜和第三绝缘树脂膜在同一步骤中通过热压接合，从而简化了电路器件的制造步骤。

公开(公告)号：US20070164349A1

公开(公告)日：2007-07-19

申请号：US11616182

申请日：2006-12-26

申请人： Mayumi Nakasato ,  Makoto Murai ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

发明人： Mayumi Nakasato ,  Makoto Murai ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

IPC分类号： H01L29/788

CPC分类号： H01L21/6835 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0206 ,  H05K1/0373 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0266 ,  H05K2201/09509 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A circuit board includes a substrate and an insulating layer. The substrate has a first surface. The insulating layer has a second surface and is connected to the substrate. The first surface is in contact with the second surface. Heat-conductive particles are provided in the insulating layer. A part of the particles projects from the second surface of the insulating layer and is in contact with the first surface of the substrate.

摘要翻译： 电路板包括基板和绝缘层。 衬底具有第一表面。 绝缘层具有第二表面并连接到基板。 第一表面与第二表面接触。 在绝缘层中设置导热粒子。 一部分颗粒从绝缘层的第二表面突出并且与衬底的第一表面接触。

公开(公告)号：US08093699B2

公开(公告)日：2012-01-10

申请号：US11313743

申请日：2005-12-22

申请人： Yasuhiro Kohara ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

发明人： Yasuhiro Kohara ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/73203 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.

摘要翻译： 提供了可以实现用树脂高度可靠的密封的电路装置。 在绝缘树脂膜的一个表面上设置半导体芯片，并且在绝缘树脂膜的另一个表面上设置与半导体芯片电连接的导电层。 用于连接电路板的焊球（电极）设置在导电层上。 在导电层和电路板之间还设置有绝缘树脂层，以将电极嵌入其中。 以这种方式形成电路装置。 半导体芯片的侧面被绝缘树脂膜覆盖。

公开(公告)号：US07855452B2

公开(公告)日：2010-12-21

申请号：US12022865

申请日：2008-01-30

申请人： Yasuyuki Yanase ,  Yoshio Okayama ,  Kiyoshi Shibata ,  Yasunori Inoue ,  Hideki Mizuhara ,  Ryosuke Usui ,  Tetsuya Yamamoto ,  Masurao Yoshii

发明人： Yasuyuki Yanase ,  Yoshio Okayama ,  Kiyoshi Shibata ,  Yasunori Inoue ,  Hideki Mizuhara ,  Ryosuke Usui ,  Tetsuya Yamamoto ,  Masurao Yoshii

IPC分类号： H01L23/48 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/94 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/274 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area.The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.

摘要翻译： 在半导体模块中的半导体衬底的安装表面（特别是其外周）上形成用于半导体器件的电极。 为了确保电极之间的大间隙，在电极上形成绝缘层。 还形成有穿过绝缘层并连接到电极的多个凸块，以及与凸块一体形成的重新布线图案。 重新布线图案包括凸起区域和与凸起区域相邻延伸的布线区域。 绝缘层形成为具有在凸起之间的间隔中的凹的上表面，并且重新布线图案的布线区域形成为适合该上表面。 重布线图案的布线区域相对于重新布线图案的凸起区域形成为朝向半导体基板压下。

公开(公告)号：US07553164B2

公开(公告)日：2009-06-30

申请号：US11416083

申请日：2006-05-01

申请人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

发明人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

IPC分类号： H05K1/14

CPC分类号： H01L21/6835 ,  G01C19/56 ,  G01P1/023 ,  G01P15/18 ,  H01L21/4832 ,  H01L21/4842 ,  H01L21/568 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A circuit device of the present invention includes a first element which is placed parallel to a first reference plane and which senses a physical quantity, and a second element placed parallel to a second reference plane which intersects the first reference plane at a predetermined angle. The circuit device further includes a sealing resin for integrally sealing the first and second elements, a first conductive pattern which is electrically connected to the first element and placed parallel to the first reference plane and which has a back surface exposed from the sealing resin, and a second conductive pattern which is electrically connected to the second element and placed parallel to the second reference plane and which has a back surface exposed from the sealing resin.

摘要翻译： 本发明的电路装置包括平行于第一参考平面并感测物理量的第一元件和平行于与第一参考平面以预定角度相交的第二参考平面放置的第二元件。 电路装置还包括用于一体地密封第一和第二元件的密封树脂，与第一元件电连接并平行于第一参考平面放置并且具有从密封树脂露出的后表面的第一导电图案，以及 第二导电图案，其电连接到第二元件并且平行于第二参考平面放置，并且具有从密封树脂暴露的后表面。

公开(公告)号：US20060001166A1

公开(公告)日：2006-01-05

申请号：US11165680

申请日：2005-06-24

申请人： Yusuke Igarashi ,  Takeshi Nakamura ,  Yasunori Inoue ,  Ryosuke Usui ,  Hideki Mizuhara

发明人： Yusuke Igarashi ,  Takeshi Nakamura ,  Yasunori Inoue ,  Ryosuke Usui ,  Hideki Mizuhara

IPC分类号： H01L23/48

CPC分类号： H01L23/5384 ,  H01L23/3128 ,  H01L24/48 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.

摘要翻译： 提供一种包括具有改善的散热性能的多层布线结构的电路装置及其制造方法。 本发明的电路器件包括第一布线层和在插入第一绝缘层的同时层叠的第二布线层。 第一布线层通过形成为穿透第一绝缘层的连接部分在期望位置连接到第二布线层。 连接部分包括从第一布线层沿厚度方向突出的第一连接部分和从第二布线层沿厚度方向突出的第二连接部分。 第一连接部和第二连接部在绝缘层的厚度方向的中间部彼此接触。

公开(公告)号：US20110074025A1

公开(公告)日：2011-03-31

申请号：US12961171

申请日：2010-12-06

申请人： Yasuyuki Yanase ,  Yoshio Okayama ,  Kiyoshi Shibata ,  Yasunori Inoue ,  Hideki Mizuhara ,  Ryosuke Usui ,  Tetsuya Yamamoto ,  Masurao Yoshii

发明人： Yasuyuki Yanase ,  Yoshio Okayama ,  Kiyoshi Shibata ,  Yasunori Inoue ,  Hideki Mizuhara ,  Ryosuke Usui ,  Tetsuya Yamamoto ,  Masurao Yoshii

IPC分类号： H01L23/482 ,  H01L23/52

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/94 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/274 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.

摘要翻译： 在半导体模块中的半导体衬底的安装表面（特别是其外周）上形成用于半导体器件的电极。 为了确保电极之间的大间隙，在电极上形成绝缘层。 还形成有穿过绝缘层并连接到电极的多个凸块，以及与凸块一体形成的重新布线图案。 重新布线图案包括凸起区域和与凸起区域相邻延伸的布线区域。 绝缘层形成为具有在凸起之间的间隔中的凹的上表面，并且重新布线图案的布线区域形成为适合该上表面。 重布线图案的布线区域相对于重新布线图案的凸起区域形成为朝向半导体基板压下。

公开(公告)号：US20060191894A1

公开(公告)日：2006-08-31

申请号：US11362121

申请日：2006-02-27

申请人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue ,  Noriaki Kojima ,  Hiroyuki Watanabe ,  Shinya Nakano

发明人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue ,  Noriaki Kojima ,  Hiroyuki Watanabe ,  Shinya Nakano

IPC分类号： H05B3/68

CPC分类号： G06F1/203 ,  H05K7/20445

摘要： In a heat radiation structure for an electronic appliance in which heat generated in a heat generating member inside a flap of the electronic appliance is radiated to a space outside the flap, a heat radiation plate integrally formed with a circuit element is thermally coupled to the heat generating member and is exposed outside the flap. Heat generated in the heat generating member is conducted to the heat radiation plate via a contact portion and is radiated to a space outside the flap from an exposed surface along with heat generated in the circuit element.

摘要翻译： 在用于电子设备的热辐射结构中，其中在电子设备的翼片内的发热元件中产生的热量辐射到翼片外部的空间，与电路元件整体形成的散热板热耦合到热 并且暴露在皮瓣外部。 在发热元件中产生的热量经由接触部分被传导到散热板，并且随着在电路元件中产生的热量从露出的表面辐射到翼片之外的空间。

公开(公告)号：US20060131746A1

公开(公告)日：2006-06-22

申请号：US11313743

申请日：2005-12-22

申请人： Yasuhiro Kohara ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

发明人： Yasuhiro Kohara ,  Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue

IPC分类号： H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/12105 ,  H01L2224/73203 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A circuit device in which highly reliable sealing with a resin can be achieved is provided. A semiconductor chip is provided on one surface of an insulating resin film and a conductive layer that is electrically connected to the semiconductor chip is provided on another surface of the insulating resin film. A solder ball (electrode) for the connection to a circuit board is provided on the conductive layer. An insulating resin layer is further provided between the conductive layer and the circuit board to embed the electrode therein. In this manner, the circuit device is formed. A side face of the semiconductor chip is covered with the insulating resin film.

摘要翻译： 提供了可以实现用树脂高度可靠的密封的电路装置。 在绝缘树脂膜的一个表面上设置半导体芯片，并且在绝缘树脂膜的另一个表面上设置与半导体芯片电连接的导电层。 用于连接电路板的焊球（电极）设置在导电层上。 在导电层和电路板之间还设置有绝缘树脂层，以将电极嵌入其中。 以这种方式形成电路装置。 半导体芯片的侧面被绝缘树脂膜覆盖。

公开(公告)号：US08338946B2

公开(公告)日：2012-12-25

申请号：US12961171

申请日：2010-12-06

申请人： Yasuyuki Yanase ,  Yoshio Okayama ,  Kiyoshi Shibata ,  Yasunori Inoue ,  Hideki Mizuhara ,  Ryosuke Usui ,  Tetsuya Yamamoto ,  Masurao Yoshii

发明人： Yasuyuki Yanase ,  Yoshio Okayama ,  Kiyoshi Shibata ,  Yasunori Inoue ,  Hideki Mizuhara ,  Ryosuke Usui ,  Tetsuya Yamamoto ,  Masurao Yoshii

IPC分类号： H01L23/48 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/94 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/274 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01059 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electrode for a semiconductor device is formed on the mounting surface (particularly, the outer periphery thereof) of a semiconductor substrate in a semiconductor module. In order to secure a large gap between the electrodes, an insulating layer is formed on the electrode. Also formed are a plurality of bumps penetrating the insulating layer and connected to the electrode, and a rewiring pattern integrally formed with the bumps. The rewiring pattern includes a bump area and a wiring area extending contiguously with the bump area. The insulating layer is formed to have a concave upper surface in an interval between the bumps, and the wiring area of the rewiring pattern is formed to fit that upper surface. The wiring area of the rewiring pattern is formed to be depressed toward the semiconductor substrate in relation to the bump area of the rewiring pattern.

摘要翻译： 在半导体模块中的半导体衬底的安装表面（特别是其外周）上形成用于半导体器件的电极。 为了确保电极之间的大间隙，在电极上形成绝缘层。 还形成有穿过绝缘层并连接到电极的多个凸块，以及与凸块一体形成的重新布线图案。 重新布线图案包括凸起区域和与凸起区域相邻延伸的布线区域。 绝缘层形成为具有在凸起之间的间隔中的凹的上表面，并且重新布线图案的布线区域形成为适合该上表面。 重布线图案的布线区域相对于重新布线图案的凸起区域形成为朝向半导体基板压下。