公开(公告)号：US20140191387A1

公开(公告)日：2014-07-10

申请号：US14177146

申请日：2014-02-10

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics Grenoble 2 SAS

Inventor： Yonggang JIN ,  Romain COFFY ,  Jerome TEYSSEYRE

IPC: H01L23/498 ,  H01L23/34

CPC classification number: H01L23/498 ,  H01L21/561 ,  H01L21/76283 ,  H01L21/76802 ,  H01L21/76838 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49174 ,  Y10T29/49204 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid array on a face of the package. A copper heat spreader is formed in the redistribution layer over the die in a same layer as a plurality of electrical traces configured to couple circuit pads of the semiconductor die to respective contact lands of the land grid array. In operation, the heat spreader improves efficiency of heat transfer from the die to the circuit board.

Abstract translation: 扇出晶片级封装设置有嵌入重构晶片中的半导体管芯。 再分配层位于半导体管芯上方，并且在封装的表面上包括焊盘栅格阵列。 铜管散热器形成在芯片上的再分配层中，与多个配置成将半导体管芯的电路焊盘耦合到焊盘栅极阵列的接触焊盘的多个电迹线相同的层中。 在操作中，散热器提高了从模具到电路板的热传递的效率。

公开(公告)号：US20150028187A1

公开(公告)日：2015-01-29

申请号：US13948507

申请日：2013-07-23

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Bin-Hong HUANG

IPC: H01L31/18 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2224/16225

Abstract: An image sensor device may include a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity, an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening, and an adhesive bead on the image sensor IC surrounding the image sensing area. Furthermore, an infrared (IR) filter may be within the filter-receiving opening and have peripheral portions contacting the adhesive bead.

Abstract translation: 图像传感器装置可以包括其中具有IC接收腔的安装基板和与IC接收腔对准的滤光器接收开口，IC接收腔内的图像传感器集成电路（IC），并且具有图像感测区域 与过滤器接收开口对准，以及围绕图像感测区域的图像传感器IC上的粘合剂珠粒。 此外，红外（IR）滤光器可以在过滤器接收开口内，并且具有与粘合剂珠接触的周边部分。

公开(公告)号：US20160103109A1

公开(公告)日：2016-04-14

申请号：US14511280

申请日：2014-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Ravi SHANKAR

IPC: G01N33/00

CPC classification number: G01N33/0009 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.

Abstract translation: 气体传感器装置可以包括具有气体检测表面的气体传感器集成电路（IC）和与气体感测表面相邻的接合焊盘，以及具有在气体感测表面附近延伸穿过的气体通道的框架。 气体传感器装置可以包括引线，每个引线具有与框架间隔开并且接合到相应的接合焊盘的近端，以及从近端向下延伸的远端，以及填充引线的近端之间的空间的封装材料以及 框架。

公开(公告)号：US20180229334A1

公开(公告)日：2018-08-16

申请号：US15950719

申请日：2018-04-11

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Yun LIU

IPC: B23K35/36 ,  B23K35/02

CPC classification number: B23K35/3618 ,  B23K35/0227 ,  B23K35/0266 ,  B23K35/3613

Abstract: The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.

公开(公告)号：US20180053861A1

公开(公告)日：2018-02-22

申请号：US15802271

申请日：2017-11-02

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics R&D Limited

Inventor： Yonggang JIN ,  David LAWSON ,  Colin CAMPBELL ,  Anandan RAMASAMY

IPC: H01L31/0216 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/02

CPC classification number: H01L31/02165 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/1013 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

公开(公告)号：US20160184938A1

公开(公告)日：2016-06-30

申请号：US14586678

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Yun LIU

IPC: B23K35/36 ,  B23K35/02

CPC classification number: B23K35/3618 ,  B23K35/0227 ,  B23K35/0266 ,  B23K35/3613

Abstract: The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.

Abstract translation: 本公开涉及一种焊丝，其包括具有松香焊剂和热固性材料两者的芯。 所述焊丝被配置为在单个焊接步骤中提供氧化物去除松香助焊剂到电组件，到电组件的焊料合金以及焊料合金的保护层。