Integrated circuit devices including a common gate electrode and methods of forming the same

    公开(公告)号:US12243946B2

    公开(公告)日:2025-03-04

    申请号:US17504755

    申请日:2021-10-19

    Abstract: Integrated circuit devices and methods of forming the same are provided. Integrated circuit devices may include a first channel layer including a first surface, a second channel layer that is spaced apart from the first channel layer in a first direction and includes a second surface, a first gate electrode and a second gate electrode. The first surface and the second surface may be spaced apart from each other in the first direction and may face opposite directions. The first channel layer may be in the first gate electrode, and the first gate electrode may be absent from the first surface of the first channel layer. The second channel layer may be in the second gate electrode, and the second gate electrode may be absent from the second surface of the second channel layer.

    INTEGRATED CIRCUIT DEVICES INCLUDING METALLIC SOURCE/DRAIN REGIONS

    公开(公告)号:US20230420459A1

    公开(公告)日:2023-12-28

    申请号:US18056181

    申请日:2022-11-16

    CPC classification number: H01L27/0922 H01L27/0688 H01L21/768

    Abstract: Integrated circuit devices and methods of forming the same are provided. The integrated circuit devices may include a substrate and a transistor stack on the substrate. The transistor stack comprises a first transistor and a second transistor stacked in a first direction. The first transistor comprises first and second source/drain regions and a first channel region between the first and second source/drain regions, and the first source/drain region comprises a first metal layer. The second transistor comprises third and fourth source/drain regions and a second channel region between the third and fourth source/drain regions, and the first and third source/drain regions overlap each other in the first direction. The transistor stack further comprises a metal interconnector contacting the third source/drain region and the first metal layer of the first source/drain region material.

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