公开(公告)号：US20130035756A1

公开(公告)日：2013-02-07

申请号：US13642657

申请日：2011-04-19

申请人： Sang Ho Kim ,  Jong Chae Park ,  Eun Jin Kim ,  Il Gyun Shin ,  Dong Gon Kim ,  Han Gi Kim

发明人： Sang Ho Kim ,  Jong Chae Park ,  Eun Jin Kim ,  Il Gyun Shin ,  Dong Gon Kim ,  Han Gi Kim

IPC分类号： A61F2/82

CPC分类号： A61F2/90 ,  A61F2/958 ,  A61F2250/0067 ,  A61L31/10 ,  A61L31/16 ,  A61L2300/416 ,  A61L2300/606

摘要： Disclosed is a vascular stent which is inserted inside a blood vessel. The disclosed vascular stent includes: a first coating film comprising a restenosis inhibiting drug provided on the outside surface of the stent strut; and a second coating film comprising an internal-capsule cellularization promoting drug provided on the inside surface of the stent strut. In this way, restenosis and thrombosis can be prevented from occurring inside the stent.

摘要翻译： 公开了一种插入血管内的血管支架。 所公开的血管支架包括：设置在支架支柱的外表面上的包含再狭窄抑制药物的第一涂膜; 以及第二涂膜，其包含设置在支架支柱的内表面上的内囊增殖促进药。 以这种方式，可以防止在支架内发生再狭窄和血栓形成。

公开(公告)号：US20140231122A1

公开(公告)日：2014-08-21

申请号：US14119122

申请日：2012-05-21

申请人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

发明人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

IPC分类号： H05K1/05 ,  C09K5/14

CPC分类号： H05K1/05 ,  C08G59/621 ,  C08G59/686 ,  C08K3/013 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08L63/00 ,  C09K5/14 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106

摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。

公开(公告)号：US09543561B2

公开(公告)日：2017-01-10

申请号：US14128913

申请日：2012-06-20

申请人： Jae Myoung Lee ,  Eun Jin Kim ,  Jae Yun Min

发明人： Jae Myoung Lee ,  Eun Jin Kim ,  Jae Yun Min

IPC分类号： H01M2/30 ,  H01M2/26 ,  H01M2/20 ,  H01M10/052

CPC分类号： H01M2/26 ,  H01M2/206 ,  H01M2/266 ,  H01M2/30 ,  H01M10/052

摘要： A battery comprises: a battery cell; and tabs configured as one pair of an anode tab and a cathode tab and included in the battery cell. At least one of the anode tab and the cathode tab is configured in such a way that a welding region exposed outside the battery cell and a reaction region positioned in the battery cell are formed of different metals and are joined to each other.

摘要翻译： 电池包括：电池单元; 以及被配置为一对阳极片和阴极片并且包括在电池单元中的突片。 阳极片和阴极片中的至少一个以这样的方式配置，使得暴露在电池单元外的焊接区域和位于电池单元中的反应区域由不同的金属形成并且彼此接合。

公开(公告)号：US09451695B2

公开(公告)日：2016-09-20

申请号：US14119122

申请日：2012-05-21

申请人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

发明人： Jae Man Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Hyun Gyu Park ,  Yun Ho An ,  In Hee Cho

IPC分类号： C08L63/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  H05K1/05 ,  C08G59/62 ,  C08G59/68 ,  C09K5/14 ,  C08K3/28 ,  C08K3/00

CPC分类号： H05K1/05 ,  C08G59/621 ,  C08G59/686 ,  C08K3/013 ,  C08K3/36 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/385 ,  C08L63/00 ,  C09K5/14 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106

摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，可以通过使用上述环氧树脂作为印刷电路板的绝缘材料来提供高辐射热板。

公开(公告)号：US20140120405A1

公开(公告)日：2014-05-01

申请号：US14128913

申请日：2012-06-20

申请人： Jae Myoung Lee ,  Eun Jin Kim ,  Jae Yun Min

发明人： Jae Myoung Lee ,  Eun Jin Kim ,  Jae Yun Min

IPC分类号： H01M2/26 ,  H01M2/30

CPC分类号： H01M2/26 ,  H01M2/206 ,  H01M2/266 ,  H01M2/30 ,  H01M10/052

摘要： The present invention relates to a battery. The objective of the present invention is to provide a battery in which a cell tab is made of various types of metals so as to enable parts to be welded so as to have the same physical properties, thereby achieving maximized weldability.

摘要翻译： 电池技术领域本发明涉及电池。 本发明的目的是提供一种电池，其中电池片由各种类型的金属制成，以便能够焊接部件以具有相同的物理性能，从而实现最大的可焊接性。

公开(公告)号：US08564107B2

公开(公告)日：2013-10-22

申请号：US13256091

申请日：2010-02-23

申请人： In Kuk Cho ,  Kyoung Taek Park ,  Sang Soo Kwak ,  Eun Jin Kim ,  Jin Young Son ,  Chang Hwa Park

发明人： In Kuk Cho ,  Kyoung Taek Park ,  Sang Soo Kwak ,  Eun Jin Kim ,  Jin Young Son ,  Chang Hwa Park

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49582 ,  H01L24/48 ,  H01L2224/48 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/45099

摘要： A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer.

摘要翻译： 引线框架包括：基底金属层; 包括铜层和包含铜的合金层中的一个的铜镀层，被配置为对所述基底金属层进行平板化以形成表面粗糙度; 以及上镀层，其包括至少一层包含选自镍，钯，金，银，镍合金，钯合金，金合金和银合金中的至少一种的镀层， 被配置为镀覆所述镀铜层。

公开(公告)号：US20130206459A1

公开(公告)日：2013-08-15

申请号：US13878319

申请日：2011-10-05

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： H05K1/02

CPC分类号： H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US09549458B2

公开(公告)日：2017-01-17

申请号：US13878319

申请日：2011-10-05

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： H05K1/02 ,  H01L25/075 ,  H05K1/05 ,  H01L23/367 ,  H01L23/498 ,  H01L33/64

CPC分类号： H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US20130188359A1

公开(公告)日：2013-07-25

申请号：US13878637

申请日：2011-10-10

申请人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

发明人： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC分类号： H05K7/20 ,  H05K13/00 ,  H05K3/30 ,  F21V29/00

CPC分类号： H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US20130118782A1

公开(公告)日：2013-05-16

申请号：US13811365

申请日：2011-07-15

申请人： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

发明人： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC分类号： H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

摘要翻译： 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板，该金属板包括金属突起，该金属突起具有焊料，发光装置附着到该金属突起上，金属突起上的接合层， 金属板以暴露金属突起，以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板，将从发热装置发出的热量直接传递到金属板，从而提高散热效率。 热辐射突起的表面镀有包含铜的合金，从而提高相对于焊料的粘合性，从而降低了故障率。