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41 条记录 (耗时 0.033 秒)

    Pressure sensor and manufacturing method thereof
    1.
    发明授权
    Pressure sensor and manufacturing method thereof 失效
    压力传感器及其制造方法

    公开(公告)号：US06860154B2

    公开(公告)日：2005-03-01

    申请号：US10047627

    申请日：2002-01-14

    申请人： Satoshi Yamamoto ,  Osamu Nakao ,  Hitoshi Nishimura ,  Masahiro Sato

    发明人： Satoshi Yamamoto ,  Osamu Nakao ,  Hitoshi Nishimura ,  Masahiro Sato

    IPC分类号： G01L1/14 ,  G01L9/00 ,  G01L9/12 ,  G01L7/08 ,  G01L9/16

    CPC分类号： G01L9/0073 ,  G01L1/148

    摘要： It is an object of the present invention to provide a touch mode capacitive pressure sensor having higher pressure durability than conventional sensors. In this invention, a touch mode capacitive pressure sensor has a diaphragm made from boron-doped silicon, and the boron concentration at the top face of the diaphragm is equal to or greater than 1×1019 cm−3 and less than 9×1019 cm−3. Further, in this invention, a touch mode capacitive pressure sensor has a conductive diaphragm made by doping of an impurity and anisotropic etching, and the etch pit density on the top face of the diaphragm is equal to or less than five per μm2, and preferably equal to or less than one per μm2. As a result, the pressure durability of the diaphragm is greatly improved.

    摘要翻译： 本发明的目的是提供一种具有比常规传感器更高的耐压耐久性的触摸模式电容式压力传感器。 在本发明中，触摸模式电容式压力传感器具有由硼掺杂硅制成的光阑，并且隔膜顶面的硼浓度等于或大于1×10 19 cm -3且小于9×10 9 <19>厘米-3。 此外，在本发明中，触摸模式电容式压力传感器具有通过掺杂杂质和各向异性蚀刻而形成的导电隔膜，并且隔膜顶面上的蚀刻坑密度等于或小于每mum 2的5个/ ，并且优选等于或小于每个m.2的一个。 结果，隔膜的耐久性大大提高。

    Pressure sensor
    2.
    发明授权
    Pressure sensor 失效
    压力传感器

    公开(公告)号：US06363791B1

    公开(公告)日：2002-04-02

    申请号：US09356666

    申请日：1999-07-19

    申请人： Akihito Kurosaka ,  Osamu Nakao ,  Takanao Suzuki ,  Masahiro Sato ,  Hitoshi Nishimura

    发明人： Akihito Kurosaka ,  Osamu Nakao ,  Takanao Suzuki ,  Masahiro Sato ,  Hitoshi Nishimura

    IPC分类号： G01L912

    CPC分类号： G01L9/0073

    摘要： A capacitance pressure sensor that prevents leakage from outside the sensor to the reference pressure cavity, has a structure that can decrease defects due to leakage compared to conventional technology. An electrode comprising a thin metallic layer is formed on the upper surface of a glass substrate that forms one of the substrates of a pressure sensor and an external electrode is formed on the surface edge of the substrate. In addition, in the region where the silicon substrate is bonded, a feedthrough extending from the electrode to the external electrode is formed, and spine shaped layers with three braches for blocking leakage gas are formed perpendicularly to the feedthrough.

    摘要翻译： 阻止传感器外部泄漏到参考压力腔的电容式压力传感器具有与传统技术相比能够减少泄漏的缺陷的结构。 在形成压力传感器的基板之一的玻璃基板的上表面上形成有薄金属层的电极，在基板的表面边缘上形成外部电极。 此外，在硅基板接合的区域中，形成从电极延伸到外部电极的馈通，并且与馈通垂直地形成具有三个用于阻断泄漏气体的支柱的脊形层。

    MAGNETIC SENSOR MODULE AND PISTON POSITION DETECTOR
    4.
    发明申请
    MAGNETIC SENSOR MODULE AND PISTON POSITION DETECTOR 审中-公开
    磁传感器模块和活塞位置检测器

    公开(公告)号：US20100090692A1

    公开(公告)日：2010-04-15

    申请号：US12528585

    申请日：2008-02-08

    申请人： Kazuhisa Itoi ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao

    发明人： Kazuhisa Itoi ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao

    IPC分类号： G01R33/02

    CPC分类号： G01R33/09 ,  G01D5/147 ,  G01R33/0011 ,  G01R33/07 ,  G01R33/072

    摘要： A magnetic sensor module which includes: a semiconductor substrate including an integrated circuit for switching operation; a magneto-resistive element which is disposed on a first surface of the semiconductor substrate and has a magneto-sensitive direction in a direction along the first surface; and a bias magnetic field applying member provided on the semiconductor substrate and disposed on a surface which is parallel to the first surface, wherein: the bias magnetic field applying member is magnetized in a direction along the surface on which the bias magnetic field applying member is disposed; and when no external magnetic field is applied, the bias magnetic field applying member applies a bias magnetic field in the direction along the first surface on which the magneto-resistive element is provided.

    摘要翻译： 一种磁传感器模块，包括：包括用于切换操作的集成电路的半导体衬底; 磁阻元件，其设置在所述半导体衬底的第一表面上，并且沿着所述第一表面的方向具有磁敏方向; 以及偏置磁场施加构件，其设置在所述半导体基板上并配置在与所述第一面平行的面上，其中：所述偏置磁场施加构件沿着所述偏置磁场施加构件的表面的方向被磁化， 处置 并且当没有施加外部磁场时，偏置磁场施加构件沿着设置有磁阻元件的第一表面的方向施加偏置磁场。

    MAGNETIC DEVICE
    6.
    发明申请
    MAGNETIC DEVICE 失效
    磁性装置

    公开(公告)号：US20090066326A1

    公开(公告)日：2009-03-12

    申请号：US12267169

    申请日：2008-11-07

    申请人： Kazuhisa ITOI ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao ,  Shigekazu Kawai

    发明人： Kazuhisa ITOI ,  Katsubumi Nagasu ,  Takuya Aizawa ,  Osamu Nakao ,  Shigekazu Kawai

    IPC分类号： G01R33/00

    CPC分类号： G01R33/09 ,  G01R33/0011 ,  G01R33/02 ,  G01R33/063 ,  G01R33/18 ,  H01L43/12

    摘要： A magnetic device comprises a magnetic element, a first magnetic field applying means, and a second magnetic field applying means. The first and second magnetic field applying means are disposed on mutually opposite sides of the magnetic element. The magnetic element is, for example, an element in which a soft magnetic film is formed in a meandering shape on a nonmagnetic substrate. The first and second magnetic field applying means create a magnetic field in one direction from the first magnetic field applying means toward the second magnetic field applying means. The bias magnetic field in one direction is thereby applied to the entire soft magnetic film in the magnetic element disposed between the first and second magnetic field applying means.

    摘要翻译： 磁性装置包括磁性元件，第一磁场施加装置和第二磁场施加装置。 第一和第二磁场施加装置设置在磁性元件的彼此相对的两侧。 磁性元件例如是在非磁性基板上以曲折形状形成软磁性膜的元件。 第一和第二磁场施加装置在从第一磁场施加装置朝向第二磁场施加装置的一个方向上产生磁场。 因此，一个方向上的偏置磁场被施加到设置在第一和第二磁场施加装置之间的磁性元件中的整个软磁膜上。

    Multilayer board manufacturing method
    7.
    发明授权
    Multilayer board manufacturing method 有权
    多层板制造方法

    公开(公告)号：US07421779B2

    公开(公告)日：2008-09-09

    申请号：US10545731

    申请日：2004-02-13

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/30

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。

    Multilayer board and its manufacturing method
    8.
    发明申请
    Multilayer board and its manufacturing method 有权
    多层板及其制造方法

    公开(公告)号：US20060191133A1

    公开(公告)日：2006-08-31

    申请号：US10545731

    申请日：2004-02-13

    申请人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    发明人： Osamu Nakao ,  Reiji Higuchi ,  Syouji Ito ,  Masahiro Okamoto

    IPC分类号： H05K3/36 ,  H05K3/20

    CPC分类号： H05K3/4617 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

    摘要翻译： 基材（20）布置在至少一个第一内层基材（10）的顶部上，并且第二内基材（30）布置在基材（10）的下方。 此后，表面层电路导电箔（40）布置在基底材料（30）的下面，随后将这些材料进行混合以形成一个混合体（80）。 在这种分层操作中，形成在基材10,30中的导电部分被对齐以彼此电连接以形成内部电路。 此后，形成电连接到内部电路的层间导电部分（51），并且相应地在基底材料（20）的顶部和导电箔（40）上形成分电路。

    Component mounting method and apparatus
    10.
    发明授权
    Component mounting method and apparatus 失效
    涉及线性电动机的部件安装方法和装置

    公开(公告)号：US06513233B1

    公开(公告)日：2003-02-04

    申请号：US09807966

    申请日：2001-05-31

    申请人： Osamu Nakao ,  Noriaki Yoshida ,  Takeshi Takeda

    发明人： Osamu Nakao ,  Noriaki Yoshida ,  Takeshi Takeda

    IPC分类号： B23P1900

    CPC分类号： H05K13/0413 ,  H05K13/0409 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： The component handling tool (14) is moved linearly up and down on a moving mechanism (11) by feedback control of a linear motor (16) for performing pickup and mounting actions of components (3). The linear motor is controlled to effect a downward movement of the component handling tool for bringing the component handling tool or the component held thereby closer to the component or to a mounting object, and upon detecting changes in control information when contact is made with the component or the mounting object, control of the linear motor is switched to a pressing operation, whereby the holding or mounting of the component in a prescribed pressed condition is accomplished.

    摘要翻译： 通过用于执行部件（3）的拾取和安装动作的线性电动机（16）的反馈控制，部件处理工具（14）在移动机构（11）上线性地上下移动。 控制线性电动机以实现部件搬运工具的向下运动，以使部件搬运工具或由此保持的部件更靠近部件或安装对象，并且当检测到与部件接触时控制信息的改变 或安装对象，线性电动机的控制切换为按压操作，从而实现部件在规定的按压状态下的保持或安装。