公开(公告)号：US07013561B2

公开(公告)日：2006-03-21

申请号：US10314034

申请日：2002-12-05

申请人： Seiichi Nakatani ,  Koichi Hirano ,  Mikinari Shimada ,  Yasuhiro Sugaya

发明人： Seiichi Nakatani ,  Koichi Hirano ,  Mikinari Shimada ,  Yasuhiro Sugaya

IPC分类号： H01K3/10

CPC分类号： H01G9/26 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/383 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/5313 ,  H01L2924/00

摘要： A capacitor-mounted metal foil of the present invention is provided with a metal foil and a plurality of capacitors formed on the metal foil. Each of the capacitors includes a conductive layer disposed above the metal foil, and a dielectric layer disposed between the metal foil and the conductive layer.

摘要翻译： 本发明的电容器安装的金属箔在金属箔上设置有金属箔和多个电容器。 每个电容器包括设置在金属箔上方的导电层和设置在金属箔和导电层之间的电介质层。

公开(公告)号：US06525921B1

公开(公告)日：2003-02-25

申请号：US09711015

申请日：2000-11-09

申请人： Seiichi Nakatani ,  Koichi Hirano ,  Mikinari Shimada ,  Yasuhiro Sugaya

发明人： Seiichi Nakatani ,  Koichi Hirano ,  Mikinari Shimada ,  Yasuhiro Sugaya

IPC分类号： H01G4228

CPC分类号： H01G9/26 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/383 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/5313 ,  H01L2924/00

摘要： A capacitor-mounted metal foil of the present invention is provided with a metal foil and a plurality of capacitors formed on the metal foil. Each of the capacitors includes a conductive layer disposed above the metal foil, and a dielectric layer disposed between the metal foil and the conductive layer.

公开(公告)号：US06871396B2

公开(公告)日：2005-03-29

申请号：US09778709

申请日：2001-02-07

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H01R43/02

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

公开(公告)号：US06538210B2

公开(公告)日：2003-03-25

申请号：US09738522

申请日：2000-12-15

申请人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

发明人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

IPC分类号： H05K100

CPC分类号： H01L23/295 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/28 ,  H01L25/105 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/185 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiring patterns 102a and 102b formed on one principal surface and another principal surface of the insulating substrate 101, a circuit component 103a electrically connected to the wiring pattern 102a and sealed with the second mixture 106 in an internal portion of the insulating substrate 101, the inner via conductor 104 electrically connecting the wiring pattern 102a and 102b.

公开(公告)号：US07888789B2

公开(公告)日：2011-02-15

申请号：US11090401

申请日：2005-03-25

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H01L23/12 ,  H01L21/4763 ,  H01R43/20

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板上的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

公开(公告)号：US07394663B2

公开(公告)日：2008-07-01

申请号：US10775656

申请日：2004-02-09

申请人： Yoshihisa Yamashita ,  Koichi Hirano ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiichi Nakatani

发明人： Yoshihisa Yamashita ,  Koichi Hirano ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiichi Nakatani

IPC分类号： H05K1/16

CPC分类号： H05K1/187 ,  H01L23/49894 ,  H01L23/5389 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/4614 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair of circuit substrates and contains an inorganic filler and a resin composition containing a thermosetting resin, an electronic component that is embedded in the insulating layer, and an inner via that is provided in the insulating layer so as to make an electrical connection between wiring patterns provided on different circuit substrates. A glass transition temperature Tg1 of the resin composition contained in the insulating layer and a glass transition temperature Tg2 of the insulating base material included in each of the circuit substrates satisfy a relationship Tg1>Tg2.

摘要翻译： 根据本发明的电子部件内置模块包括一对相对的电路基板，每个电路基板包括布线图案和包含树脂的绝缘基材，绝缘层位于该对电路基板之间并且包含 无机填料和包含热固性树脂的树脂组合物，嵌入在绝缘层中的电子部件和设置在绝缘层中的内部通孔，以便在设置在不同电路基板上的布线图案之间形成电连接。 包含在绝缘层中的树脂组合物的玻璃化转变温度Tg1和包含在每个电路基板中的绝缘基材的玻璃化转变温度Tg2满足Tg1> Tg2。

公开(公告)号：US06936774B2

公开(公告)日：2005-08-30

申请号：US10283386

申请日：2002-10-29

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H05K1/05 ,  H01R43/20

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

摘要翻译： 能够可靠且容易地将精细布线图案转印到基板的转印材料。 转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。 在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

公开(公告)号：US20050186768A1

公开(公告)日：2005-08-25

申请号：US11090401

申请日：2005-03-25

申请人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

发明人： Yasuhiro Sugaya ,  Shingo Komatsu ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Toshiyuki Asahi ,  Yoshihisa Yamashita

IPC分类号： H05K1/03 ,  H05K1/16 ,  H05K3/20 ,  H05K3/40 ,  H01L21/00 ,  H01L21/44 ,  H01L21/461 ,  H01L23/48 ,  H01L29/40

CPC分类号： H05K3/20 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/205 ,  H05K3/4061 ,  H05K3/4069 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T428/12486 ,  H01L2924/00

摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

公开(公告)号：US06931725B2

公开(公告)日：2005-08-23

申请号：US10340170

申请日：2003-01-09

申请人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

发明人： Yasuhiro Sugaya ,  Koichi Hirano ,  Seiichi Nakatani ,  Yasuyuki Matsuoka ,  Satoru Yuuhaku ,  Toshiyuki Asahi

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L25/16 ,  H05K1/03 ,  H05K1/18 ,  H01K3/10

CPC分类号： H01L23/295 ,  H01L21/56 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/28 ,  H01L25/105 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/185 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiring patterns 102a and 102b formed on one principal surface and another principal surface of the insulating substrate 101, a circuit component 103a electrically connected to the wiring pattern 102a and sealed with the second mixture 106 in an internal portion of the insulating substrate 101, the inner via conductor 104 electrically connecting the wiring pattern 102a and 102b.

摘要翻译： 一种电路元件内置模块，能够高密度地安装电路元件，具有高散热性和高可靠性。 电路部件内置模块100包括由第一混合物105和第二混合物106制成的绝缘基板101，形成在一个主表面上的布线图案102a和102b以及绝缘基板101的另一主表面，电路部件 103a，其电连接到布线图案102a并且在绝缘基板101的内部部分中与第二混合物106密封，内部通孔导体104电连接布线图案102a和102b。

公开(公告)号：US07134198B2

公开(公告)日：2006-11-14

申请号：US10654343

申请日：2003-09-03

申请人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

发明人： Seiichi Nakatani ,  Yoshihiro Bessho ,  Yasuhiro Sugaya ,  Keiji Onishi

IPC分类号： H05K3/30

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/187 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10378 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method for manufacturing an electric element built-in module including flip-chip mounting at least one electric element such as a semiconductor chip or a surface acoustic wave device on a wiring pattern, sealing the electric element with a thermosetting resin composition, and grinding or abrading the thermosetting resin composition and electric element from a side of the electric element opposite that of the wiring pattern. The method provides upper surfaces of the electric element and the thermosetting resin composition that are substantially flush with each other. The method provides an electric element built-in module suitable for high-density packaging with a reduced thickness without damaging the electric element and while maintaining mechanical strength.

摘要翻译： 一种电气元件内置模块的制造方法，其包括在布线图案上安装诸如半导体芯片或表面声波装置的至少一个电气元件的倒装芯片，用热固性树脂组合物密封电气元件，以及研磨或 从电气元件的与布线图案相反的一侧研磨热固性树脂组合物和电气元件。 该方法提供电气元件和热固性树脂组合物的彼此基本齐平的上表面。 该方法提供一种电子元件内置模块，适用于厚度较小的高密度封装，而不会损坏电气元件，同时保持机械强度。