公开(公告)号：US07986032B2

公开(公告)日：2011-07-26

申请号：US12547439

申请日：2009-08-25

申请人： Seng Guan Chow ,  Ming Ying ,  Ii Kwon Shim ,  Lip Seng Tan

发明人： Seng Guan Chow ,  Ming Ying ,  Ii Kwon Shim ,  Lip Seng Tan

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

摘要翻译： 提供半导体封装系统。 提供具有管芯附接板的衬底。 第一组多个引线设置在具有第一多个引线端的管芯附接焊盘的周围。 第二多个引线设置在与第一多个引线交错的管芯附接焊盘周围，第二多个引线中的至少一些具有多个凹陷引线尖端。 第一管芯附接到管芯附接板上。 模具被引线接合到第一多个引线和第二多个引线。 模具被封装。

公开(公告)号：US20090309237A1

公开(公告)日：2009-12-17

申请号：US12547439

申请日：2009-08-25

申请人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Lip Seng Tan

发明人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Lip Seng Tan

IPC分类号： H01L23/49 ,  H01L21/56 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

摘要翻译： 提供半导体封装系统。 提供具有管芯附接板的衬底。 第一组多个引线设置在具有第一多个引线端的管芯附接焊盘的周围。 第二多个引线设置在与第一多个引线交错的管芯附接焊盘周围，第二多个引线中的至少一些具有多个凹陷引线尖端。 第一管芯附接到管芯附接板上。 模具被引线接合到第一多个引线和第二多个引线。 模具被封装。

公开(公告)号：US07598599B2

公开(公告)日：2009-10-06

申请号：US11276681

申请日：2006-03-09

申请人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Lip Seng Tan

发明人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Lip Seng Tan

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

摘要翻译： 提供半导体封装系统。 提供具有管芯附接板的衬底。 第一组多个引线设置在具有第一多个引线端的管芯附接焊盘的周围。 第二多个引线设置在与第一多个引线交错的管芯附接焊盘周围，第二多个引线中的至少一些具有多个凹陷引线尖端。 第一管芯附接到管芯附接板上。 模具被引线接合到第一多个引线和第二多个引线。 模具被封装。

公开(公告)号：US20070210422A1

公开(公告)日：2007-09-13

申请号：US11276681

申请日：2006-03-09

申请人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Lip Seng Tan

发明人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Lip Seng Tan

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49109 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

摘要翻译： 提供半导体封装系统。 提供具有管芯附接板的衬底。 第一组多个引线设置在具有第一多个引线端的管芯附接焊盘的周围。 第二多个引线设置在与第一多个引线交错的管芯附接焊盘周围，第二多个引线中的至少一些具有多个凹陷引线尖端。 第一管芯附接到管芯附接板上。 模具被引线接合到第一多个引线和第二多个引线。 模具被封装。

公开(公告)号：US08704349B2

公开(公告)日：2014-04-22

申请号：US11354806

申请日：2006-02-14

申请人： Seng Guan Chow ,  II Kwon Shim ,  Byung Joon Han

发明人： Seng Guan Chow ,  II Kwon Shim ,  Byung Joon Han

IPC分类号： H01L23/02 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including providing a substrate having a first surface and second surface; mounting interconnects to the first surface; mounting integrated circuit dies to the first surface; embedding the interconnects and the integrated circuit die within an encapsulant on the substrate and leaving top portions of the interconnects exposed; attaching solder balls to the second surface; and singulating the substrate and the encapsulant into a plurality of integrated circuit packages.

摘要翻译： 提供一种集成电路封装系统，包括提供具有第一表面和第二表面的衬底; 将互连件安装到第一表面; 将集成电路模具安装到第一表面; 将所述互连和所述集成电路管芯嵌入在所述衬底上的密封剂中并且使所述互连的顶部部分暴露; 将焊球附接到第二表面; 以及将所述衬底和所述密封剂分离成多个集成电路封装。

公开(公告)号：US20120286422A1

公开(公告)日：2012-11-15

申请号：US13555531

申请日：2012-07-23

申请人： II Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

发明人： II Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/50 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10674 ,  H01L2924/00

摘要： A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

摘要翻译： 半导体器件具有形成在半导体晶片的有源表面上的保护层。 具有预先施加的保护层的半导体管芯从半导体晶片移动并安装在载体上。 载体上的半导体管芯和接触焊盘被封装。 载体被移除。 在预先施加的保护层和接触垫上形成第一绝缘层。 在第一绝缘层和预先施加的保护层中形成通孔以暴露半导体管芯上的互连部位。 在第一绝缘层上形成互连结构，与半导体管芯和接触焊盘上的互连部位电接触。 互连结构具有形成在第一绝缘层上的再分布层，形成在再分配层上的第二绝缘层和形成在与再分布层电接触的第二电介质上的凸块下金属化层。

公开(公告)号：US08004095B2

公开(公告)日：2011-08-23

申请号：US12822080

申请日：2010-06-23

申请人： II Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

发明人： II Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/50 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/18 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10674 ,  H01L2924/00

摘要： A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

摘要翻译： 半导体器件具有形成在半导体晶片的有源表面上的保护层。 具有预先施加的保护层的半导体管芯从半导体晶片移动并安装在载体上。 载体上的半导体管芯和接触焊盘被封装。 载体被移除。 在预先施加的保护层和接触垫上形成第一绝缘层。 在第一绝缘层和预先施加的保护层中形成通孔以暴露半导体管芯上的互连部位。 在第一绝缘层上形成互连结构，与半导体管芯和接触焊盘上的互连部位电接触。 互连结构具有形成在第一绝缘层上的再分布层，形成在再分配层上的第二绝缘层和形成在与再分布层电接触的第二电介质上的凸块下金属化层。

公开(公告)号：US20110233744A1

公开(公告)日：2011-09-29

申请号：US13154308

申请日：2011-06-06

申请人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Roger Emigh

发明人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim ,  Roger Emigh

IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L21/98

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：提供引线框架; 在引线框上形成突出的焊盘; 将模具附接到引线框架; 将管芯电连接到引线框架; 并且将引线框，突出垫和模具的至少一部分封装在密封剂中。

公开(公告)号：US20060197207A1

公开(公告)日：2006-09-07

申请号：US11164453

申请日：2005-11-22

申请人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim

发明人： Seng Guan Chow ,  Ming Ying ,  Il Kwon Shim

IPC分类号： H01L23/02 ,  H01L21/50

CPC分类号： H01L23/552 ,  H01L21/4828 ,  H01L23/3135 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01077 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

摘要翻译： 一种具有管芯和封装组合的集成封装系统，包括形成具有内部引线和外部引线的引线框架，在引线框上封装第一集成电路，并在第一集成电路上封装第二集成电路。

公开(公告)号：US07960816B2

公开(公告)日：2011-06-14

申请号：US11306354

申请日：2005-12-23

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Ming Ying ,  Byung Hoon Ahn

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16245 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K3/202 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

摘要翻译： 提供了一种用于集成电路封装的系统，其包括具有引线指的引线框架。 凹槽位于用于导电粘合剂的引线指中，并且无源器件位于沟槽中以由导电粘合剂保持。