公开(公告)号：US20190070696A1

公开(公告)日：2019-03-07

申请号：US16083225

申请日：2017-03-08

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Ken Tachibana ,  Takahiro Hattori

IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34 ,  B23K35/02

Abstract: Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.

公开(公告)号：US10076808B2

公开(公告)日：2018-09-18

申请号：US13959321

申请日：2013-08-05

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Tsukasa Ohnishi ,  Shunsaku Yoshikawa ,  Ken Tachibana ,  Yoshie Yamanaka ,  Hikaru Nomura ,  Kyu-oh Lee

IPC: B32B15/01 ,  B23K35/26 ,  B23K1/00 ,  B23K35/02 ,  C22C13/00 ,  B23K101/40

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/40 ,  C22C13/00 ,  H01L24/13 ,  H01L24/81 ,  Y10T403/479

Abstract: A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors.

公开(公告)号：US09837757B2

公开(公告)日：2017-12-05

申请号：US14782142

申请日：2014-04-03

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Shunsaku Yoshikawa ,  Naoko Hirai ,  Ken Tachibana ,  Yoshie Tachibana

IPC: H01R13/58 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  B23K35/02 ,  H01R4/02 ,  H01R12/71 ,  B23K101/36 ,  B23K101/42

CPC classification number: H01R13/58 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C13/00 ,  C22C13/02 ,  H01R4/02 ,  H01R12/71

Abstract: With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of −40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained.

公开(公告)号：US20240363571A1

公开(公告)日：2024-10-31

申请号：US18766832

申请日：2024-07-09

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Yoshie Yamanaka ,  Hikaru Nomura ,  Ken Tachibana ,  Shunsaku Yoshikawa

IPC: H01L23/00 ,  B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  H01B1/02 ,  H05K3/34

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/0261 ,  B23K35/26 ,  B23K35/262 ,  C22C13/00 ,  C22C13/02 ,  H01B1/02 ,  H01L24/11 ,  H05K3/3457 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1301 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/2076 ,  H05K2203/041

Abstract: A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, at least one of Fe and Co in a total amount of 0.003-0.1 mass %, and a remainder of Sn.

公开(公告)号：US11465244B2

公开(公告)日：2022-10-11

申请号：US15500740

申请日：2016-02-15

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Ken Tachibana ,  Takahiro Hattori

IPC: B23K35/26 ,  C22C13/02 ,  H05K3/34 ,  B23K35/22 ,  C22C13/00 ,  B23K35/02

Abstract: A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.

公开(公告)号：US09700963B2

公开(公告)日：2017-07-11

申请号：US15196227

申请日：2016-06-29

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

IPC: B23K35/00 ,  B23K35/22 ,  B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  B32B15/01 ,  H05K3/34 ,  B23K1/00 ,  H01L23/00 ,  H01L23/31

CPC classification number: B23K35/0244 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B32B15/018 ,  C22C13/00 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/2076 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/207 ,  H01L2924/00014

Abstract: Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board.

公开(公告)号：US20160074971A1

公开(公告)日：2016-03-17

申请号：US14785179

申请日：2013-04-18

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Ken Tachibana ,  Hikaru Nomura

IPC: B23K35/26 ,  C22C12/00 ,  H01L23/00 ,  C22C13/02

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/264 ,  C22C12/00 ,  C22C13/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01103 ,  H01L2924/01108 ,  H01L2924/01109 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15701 ,  H05K3/3463 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a Sn—Bi—Cu—Ni series lead-free solder alloy which has a low melting point, good ductility and high tensile strength, suppresses strain in the substrate by suppressing generation of P-rich layer on a joining interface to have high shear strength and is superior in joining reliability. In order to suppress diffusion of Cu and Ni in an electrode and to maintain elongation and wettability of the solder alloy, a solder alloy has an alloy composition containing 31 to 59 mass % of Bi, 0.3 to 1.0 mass % of Cu, 0.01 to 0.06 mass % of Ni and balance of Sn.

Abstract translation: 公开了一种Sn-Bi-Cu-Ni系无铅焊料合金，它具有低熔点，良好的延展性和高拉伸强度，通过抑制在接合界面上产生富P层从而抑制基板中的应变，使其具有高 剪切强度，连接可靠性优异。 为了抑制电极中Cu和Ni的扩散，并且为了保持焊料合金的伸长率和润湿性，焊料合金具有合金组成，其含有Bi为31〜59质量％，Cu为0.3〜1.0质量％，0.01〜0.06 Ni的质量％和Sn的平衡。

公开(公告)号：US20160339543A1

公开(公告)日：2016-11-24

申请号：US15196227

申请日：2016-06-29

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Tsukasa Ohnishi ,  Yoshie Yamanaka ,  Ken Tachibana

IPC: B23K35/02 ,  H05K3/34 ,  C22C13/00 ,  H01L23/00 ,  B23K1/00 ,  B23K35/26

CPC classification number: B23K35/0244 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B32B15/018 ,  C22C13/00 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/81815 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/2076 ,  H05K3/3463 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/207 ,  H01L2924/00014

Abstract: Provided is a process for mounting a BGA (Ball Grid Array) or CSP (Chip Size Package) on a printed circuit board. The process includes melting and fusing together solder paste and a solder ball. The solder ball has a solder composition that includes 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. In the process, the solder ball is placed on an electrode of the BGA or CSP substrate and the solder paste is applied onto an opposing electrode of the printed circuit board.

Abstract translation: 提供了将BGA（球栅阵列）或CSP（芯片尺寸封装）安装在印刷电路板上的工艺。 该工艺包括将焊膏和焊球融合在一起并熔接在一起。 焊球具有焊料组成，其包含Ag的0.5-1.1质量％，Cu的0.7-0.8质量％，Ni的0.05-0.08质量％，剩余的Sn。 在该过程中，将焊球放置在BGA或CSP衬底的电极上，并将焊膏施加到印刷电路板的相对电极上。

公开(公告)号：US20160214212A1

公开(公告)日：2016-07-28

申请号：US14916730

申请日：2014-05-21

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Ken Tachibana ,  Yuya Nagasawa

IPC: B23K35/26 ,  C22C13/02 ,  C22C13/00 ,  B23K35/02

CPC classification number: B23K35/262 ,  B23K35/0244 ,  B23K2101/40 ,  C22C13/00 ,  C22C13/02 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/13 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/16238 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/00

Abstract: Lead-free solder is characterized in that the lead-free solder contains Ag of 1.2 mass % through 4.5 mass %, Cu of 0.25 mass % through 0.75 mass %, Bi of 1 mass % through 5.8 mass %, Ni of 0.01 mass % through 0.15 mass % and Sn as the remainder. These addition amounts allow to be further improved the common solder properties such as wettability, shear strength properties and the like, in addition to the thermal fatigue resistance.

Abstract translation: 无铅焊料的特征在于，无铅焊料含有1.2质量％〜4.5质量％的Ag，0.25质量％的Cu，0.75质量％的Cu，1质量％〜5.8质量％的Bi，0.01质量％的Ni 0.15质量％，Sn为余量。 这些添加量除了耐热疲劳性以外，还可以进一步提高普通焊料性质，例如润湿性，剪切强度性能等。

公开(公告)号：US20150282332A1

公开(公告)日：2015-10-01

申请号：US14435333

申请日：2012-10-15

Applicant: SENJU METAL INDUSTRY CO., LTD.,

Inventor： Masato Shimamura ,  Ken Tachibana ,  Takayuki Hori

IPC: H05K3/34 ,  C22C12/00 ,  B23K35/26 ,  C22C13/02 ,  B23K1/00 ,  B23K35/02

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/40 ,  C22C12/00 ,  C22C13/02 ,  H05K3/3463 ,  H05K2203/04 ,  H05K2203/12

Abstract: Even if the strength of a solder composition close to a SnBi eutectic composition was improved, it was brittle, so when it was used for small electronic devices such as mobile phones or notebook computers, the resistance to drop impacts when the small electronic equipment was dropped was low. Therefore, interface peeling often took place between the soldered surface and a printed circuit board, resulting in the devices being destroyed. As disclosed, when soldering using a solder paste containing a SnBi-based low-temperature solder, at least one type of solder composition selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition is diffused into the solder paste by simultaneously supplying at least one type of preform selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition, whereby resistance to drop impacts is improved.

Abstract translation: 即使接近SnBi共晶组合物的焊料组合物的强度提高，因此易碎，因此当用于诸如手机或笔记本电脑的小型电子设备时，当小型电子设备掉落时，其耐跌落影响 是低的 因此，通常在焊接表面和印刷电路板之间发生界面剥离，导致器件被破坏。 如所公开的，当使用含有SnBi基低温焊料的焊膏进行焊接时，将选自Sn-Ag，Sn-Cu和Sn-Ag-Cu焊料组合物中的至少一种焊料组分扩散到 通过同时供给选自Sn-Ag，Sn-Cu和Sn-Ag-Cu焊料组合物中的至少一种类型的预成型体，从而提高了耐跌落冲击的焊膏。