公开(公告)号：US07341934B2

公开(公告)日：2008-03-11

申请号：US11079389

申请日：2005-03-15

申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih ,  Meng-Da Chou

发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih ,  Meng-Da Chou

IPC分类号： H01L21/44

CPC分类号： H05K3/3473 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/242 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/09436 ,  H05K2201/096 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0574 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K2203/1581 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board. Subsequently, a resist layer is formed on the second surface of the circuit board to cover the conductive bump, and another resist layer having openings penetrating therethrough is formed on the first surface of the circuit board to expose the conductive pad. Finally, a conductive bump is formed on the conductive pad located on the first surface of the circuit board by an electroplating process. By such arrangement, the conductive bumps are successively formed on the first surface and the second surface of the circuit board.

摘要翻译： 提出了一种用于制造电路板的导电凸块的方法。 首先，提供具有第一表面和相应的第二表面的电路板。 在所述第一表面和所述第二表面中的每一个上形成具有多个导电焊盘的电路结构，并且在所述电路板中形成导电结构以电连接所述电路结构。 此外，在电路板上形成具有贯穿其中的多个开口的绝缘层，用于暴露导电焊盘。 然后，在具有形成在电路板的第一表面上的开口的绝缘层的表面上形成导电层。 通过导电层和导电结构进行电镀处理，使得在位于电路板的第二表面上的导电焊盘上形成导电凸块。 随后，在电路板的第二表面上形成抗蚀剂层以覆盖导电凸块，并且在电路板的第一表面上形成具有贯穿其中的开口的另一个抗蚀剂层，以露出导电焊盘。 最后，通过电镀工艺在位于电路板的第一表面上的导电焊盘上形成导电凸块。 通过这种布置，导电凸块依次形成在电路板的第一表面和第二表面上。

公开(公告)号：US20060051952A1

公开(公告)日：2006-03-09

申请号：US11079389

申请日：2005-03-15

申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih ,  Meng-Da Chou

发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih ,  Meng-Da Chou

IPC分类号： H01L21/44

CPC分类号： H05K3/3473 ,  H01L21/4853 ,  H01L23/49816 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/242 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/09436 ,  H05K2201/096 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0574 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K2203/1581 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fabricating conductive bumps of a circuit board is proposed. First of all, a circuit board having a first surface and a corresponding second surface is provided. A circuit structure having a plurality of conductive pads is formed on each of the first surface and the second surface, and conductive structures are formed in the circuit board for electrically connecting the circuit structures. Also, an insulating layer having a plurality of openings penetrating therethrough is formed on the circuit board for exposing the conductive pad. Then, a conductive layer is formed on a surface of the insulating layer having the opening formed on the first surface of the circuit board. An electroplating process is performed via the conductive layer and the conductive structure, such that a conductive bump is formed on the conductive pad located on the second surface of the circuit board. Subsequently, a resist layer is formed on the second surface of the circuit board to cover the conductive bump, and another resist layer having openings penetrating therethrough is formed on the first surface of the circuit board to expose the conductive pad. Finally, a conductive bump is formed on the conductive pad located on the first surface of the circuit board by an electroplating process. By such arrangement, the conductive bumps are successively formed on the first surface and the second surface of the circuit board.

摘要翻译： 提出了一种用于制造电路板的导电凸块的方法。 首先，提供具有第一表面和相应的第二表面的电路板。 在所述第一表面和所述第二表面中的每一个上形成具有多个导电焊盘的电路结构，并且在所述电路板中形成导电结构以电连接所述电路结构。 此外，在电路板上形成具有贯穿其中的多个开口的绝缘层，用于暴露导电焊盘。 然后，在具有形成在电路板的第一表面上的开口的绝缘层的表面上形成导电层。 通过导电层和导电结构进行电镀处理，使得在位于电路板的第二表面上的导电焊盘上形成导电凸块。 随后，在电路板的第二表面上形成抗蚀剂层以覆盖导电凸块，并且在电路板的第一表面上形成具有贯穿其中的开口的另一个抗蚀剂层，以露出导电焊盘。 最后，通过电镀工艺在位于电路板的第一表面上的导电焊盘上形成导电凸块。 通过这种布置，导电凸块依次形成在电路板的第一表面和第二表面上。

公开(公告)号：US07151050B2

公开(公告)日：2006-12-19

申请号：US11250110

申请日：2005-10-12

申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0574 ,  H05K2203/0723

摘要： A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

公开(公告)号：US20060252247A1

公开(公告)日：2006-11-09

申请号：US11429886

申请日：2006-05-08

申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih

发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H01L2224/11 ,  H05K3/26 ,  H05K2203/0392 ,  H05K2203/054 ,  H05K2203/0723

摘要： A processing apparatus for electroplating conductive bumps on an organic circuit board includes a surface cleaning unit for removing organic contaminant on the surface of conductive layer on the circuit board, a rinsing unit for rinsing the surface of conductive layer, a surface activating unit for removing a metal oxide on the surface of conductive layer, and an electroplating unit for electroplating a conductive bump on the exposing surface of the conductive layer. Thus, the conductive bumps are formed on the circuit board by electroplating. As a result, the alignment is easier, the bonding strength is reinforced, and the requirement for high density fine-pitch bumps is met

摘要翻译： 一种用于在有机电路板上电镀导电凸块的处理设备包括：用于去除电路板上导电层表面上的有机污染物的表面清洁单元，用于冲洗导电层表面的漂洗单元，用于去除 导电层表面上的金属氧化物，以及用于在导电层的暴露表面上电镀导电凸块的电镀单元。 因此，通过电镀在电路板上形成导电凸块。 结果，对准更容易，结合强度得到加强，满足了高密度细间距凸块的要求

公开(公告)号：US20060252249A1

公开(公告)日：2006-11-09

申请号：US11429766

申请日：2006-05-08

申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih

发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Ying-Tung Wang ,  Wen-Hung Hu ,  Chao-Wen Shih

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/062 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09745 ,  H05K2201/10734 ,  H05K2203/054 ,  H05K2203/0723 ,  Y02P70/611 ,  H01L2924/00014

摘要： A solder ball pad surface finish structure of a circuit board and a method for fabricating the same are proposed. An insulative protecting layer with a plurality of openings is formed on a circuit board to expose solder ball pads on the circuit board. A conductive layer is formed on the insulative protecting layer and in the openings, and a resist layer is also formed thereon. A plurality of openings are formed and defined in the resist layer corresponding to the solder ball pads. The area of openings of resist layer can be larger or smaller than the area of the openings of insulative protecting layer, and the resist layer is hung above the solder ball pads. A metal layer is formed on the conductive layer and in the openings of resist layer by electroplating and an adhesive layer is formed successively. Then, the resist layer and the conductive layer underneath the resist layer are removed. Afterwards, the adhesive layer is further processed by re-flow process.

摘要翻译： 提出了一种电路板的焊球焊盘表面光洁度结构及其制造方法。 在电路板上形成具有多个开口的绝缘保护层，以露出电路板上的焊球垫。 在绝缘保护层和开口中形成导电层，并且还在其上形成抗蚀剂层。 在对应于焊球垫的抗蚀剂层中形成并限定多个开口。 抗蚀剂层的开口面积可以大于或小于绝缘保护层的开口面积，并且抗蚀剂层悬挂在焊球垫上方。 通过电镀在导电层和抗蚀剂层的开口中形成金属层，并依次形成粘合剂层。 然后，去除抗蚀剂层和抗蚀剂层下面的导电层。 然后，通过再流程进一步处理粘合剂层。

公开(公告)号：US20060079081A1

公开(公告)日：2006-04-13

申请号：US11250110

申请日：2005-10-12

申请人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

发明人： Shih-Ping Hsu ,  Sao-Hsia Tang ,  Chao-Wen Shih ,  Ying-Tung Wang ,  Wen-Hung Hu

IPC分类号： H01L21/4763

CPC分类号： H05K3/243 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0574 ,  H05K2203/0723

摘要： A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.

摘要翻译： 提出了一种用于制造电路板的电连接结构的方法。 在具有多个导电焊盘的电路板上形成图案化的抗蚀剂层，并且在抗蚀剂层中形成多个开口以露出导电焊盘。 第一导电材料和第二导电材料依次沉积在抗蚀剂层的开口和每个导电焊盘上。 然后，除去抗蚀剂层。 随后，将保护层施加在电路板上并覆盖形成在每个导电焊盘上的第一和第二导电材料。 最后，保护层被稀薄以将与其相对应的第二导电材料暴露于每个导电焊盘。 因此，电路板可以经由第二导电材料电连接到外部装置。

公开(公告)号：US07659193B2

公开(公告)日：2010-02-09

申请号：US11588913

申请日：2006-10-27

申请人： Wen-Hung Hu ,  Ying-Tung Wang ,  Shih-Ping Hsu ,  Chao-Wen Shih

发明人： Wen-Hung Hu ,  Ying-Tung Wang ,  Shih-Ping Hsu ,  Chao-Wen Shih

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0574 ,  Y10T29/49165

摘要： Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.

摘要翻译： 提出了电路板导电焊盘的导电结构及其制造方法。 制造方法包括：为电路板提供多个第一，第二和第三导电焊盘; 在电路板上形成第一和第二导电层; 在第一和第二导电层上分别形成第一和第二抗蚀剂层，抗蚀剂层具有多个用于使焊盘上的导电层露出的开口; 在第一和第二抗蚀剂层的开口中形成金属层; 以及在所述金属层上形成第一连接层; 在第一和第二抗蚀剂层上分别形成第三和第四抗蚀剂层，第三抗蚀剂层具有多个开口，用于在第二抗电层上暴露金属层上的第一连接层。

公开(公告)号：US20070161223A1

公开(公告)日：2007-07-12

申请号：US11588913

申请日：2006-10-27

申请人： Wen-Hung Hu ,  Ying-Tung Wang ,  Shih-Ping Hsu ,  Chao-Wen Shih

发明人： Wen-Hung Hu ,  Ying-Tung Wang ,  Shih-Ping Hsu ,  Chao-Wen Shih

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/043 ,  H05K2203/054 ,  H05K2203/0574 ,  Y10T29/49165

摘要： Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically

摘要翻译： 提出了电路板导电焊盘的导电结构及其制造方法。 制造方法包括：为电路板提供多个第一，第二和第三导电焊盘; 在电路板上形成第一和第二导电层; 在第一和第二导电层上分别形成第一和第二抗蚀剂层，抗蚀剂层具有多个用于使焊盘上的导电层露出的开口; 在第一和第二抗蚀剂层的开口中形成金属层; 以及在所述金属层上形成第一连接层; 在第一和第二抗蚀剂层上分别形成第三和第四抗蚀剂层，第三抗蚀剂层具有多个开口，用于将第二电阻层上的第一连接层暴露在金属层上

公开(公告)号：US20120255771A1

公开(公告)日：2012-10-11

申请号：US13441199

申请日：2012-04-06

申请人： Wen-Hung Hu ,  Chao-Meng Cheng ,  Yu-Hsiang Huang ,  Ya-Ping Chiou

发明人： Wen-Hung Hu ,  Chao-Meng Cheng ,  Yu-Hsiang Huang ,  Ya-Ping Chiou

IPC分类号： H05K1/11 ,  H05K3/02

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K3/403 ,  H05K3/427 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09827 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A packaging substrate includes a core board having a first surface and an opposite second surface; at least a conic through hole formed in the core board and penetrating the first and second surfaces; a plurality of conductive paths formed on a wall of the conic through hole, free from being electrically connected to one another in the conic through hole; and a plurality of first circuits and second circuits disposed on the first and second surfaces of the core board, respectively, and being in contact with peripheries of two ends of the conic through hole, wherein each of the first circuits is electrically connected through each of the conductive paths to each of the second circuits. Compared to the prior art, the packaging substrate has a reduced number of through holes or vias and an increased overall layout density.

摘要翻译： 包装基板包括具有第一表面和相对的第二表面的芯板; 至少形成在所述芯板中并穿透所述第一表面和第二表面的锥形通孔; 形成在锥形通孔的壁上的多个导电路径，在锥形通孔中彼此不相互电连接; 以及多个第一电路和第二电路，分别设置在芯板的第一表面和第二表面上，并且与圆锥通孔的两端的周边接触，其中每个第一电路通过 到每个第二电路的导电路径。 与现有技术相比，封装基板具有减少的通孔或通孔数量和增加的总布局密度。

公开(公告)号：US08188377B2

公开(公告)日：2012-05-29

申请号：US12229422

申请日：2008-08-21

申请人： Wen-Hung Hu ,  Wen-Yuan Chi

发明人： Wen-Hung Hu ,  Wen-Yuan Chi

IPC分类号： H02B1/30

CPC分类号： H05K1/111 ,  H05K1/113 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09781 ,  Y02P70/611 ,  Y10T29/49147

摘要： A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically connecting pads are partially electrically connected to the circuits, and are partially electrically connected to the inner-layer circuits via conductive vias. An insulating protective layer is disposed on the circuit board body and is formed with openings therein for exposing the electrically connecting pads. Conductive posts are formed on the electrically connecting pads. Standalone metal pads are formed on the insulating protective layer but are not used for electrical connection. The conductive posts and electrically connecting pads are absent from the insulating protective layer beneath the standalone metal pads, such that circuits can be formed under the insulating protective layer.

摘要翻译： 提供具有电连接结构的电路板及其制造方法。 提供具有内层电路的电路板主体。 电路层形成在电路板主体的至少最外表面上，并且包括电连接焊盘和电路。 电连接焊盘部分地电连接到电路，并且经由导电通孔部分地电连接到内层电路。 绝缘保护层设置在电路板主体上，并在其中形成有用于暴露电连接焊盘的开口。 导电柱形成在电连接焊盘上。 独立的金属焊盘形成在绝缘保护层上，但不用于电连接。 在独立的金属焊盘之下的绝缘保护层中不存在导电柱和电连接焊盘，使得电路可以形成在绝缘保护层下面。