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    Process for preparing printed circuit board
    1.
    发明授权
    Process for preparing printed circuit board 失效
    印刷电路板的制作工艺

    公开(公告)号：US5476690A

    公开(公告)日：1995-12-19

    申请号：US253561

    申请日：1994-06-03

    申请人： Fumihiko Ohta ,  Takeshi Nojiri ,  Shinji Tsuchikawa ,  Akio Nakano ,  Toshiaki Ishimaru ,  Hiroshi Yamazaki ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi

    发明人： Fumihiko Ohta ,  Takeshi Nojiri ,  Shinji Tsuchikawa ,  Akio Nakano ,  Toshiaki Ishimaru ,  Hiroshi Yamazaki ,  Haruo Akahoshi ,  Mineo Kawamoto ,  Akio Takahashi

    IPC分类号： G03F7/027 ,  C23C18/16 ,  G03F7/028 ,  G03F7/033 ,  H05K3/00 ,  H05K3/18 ,  B05D5/12

    CPC分类号： G03F7/033 ,  C23C18/1605 ,  C23C18/405 ,  H05K3/184 ,  C23C18/2013 ,  C23C18/2033 ,  C23C18/24 ,  C23C18/30 ,  H05K2203/0793 ,  H05K3/0076

    摘要： Disclosed is a process for preparing a printed circuit board, which comprises the steps of:(1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b);(2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and(3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.

    摘要翻译： 公开了一种制备印刷电路板的方法，其包括以下步骤：（1）在绝缘基板的表面上，在要沉积无电镀铜的必需部分上形成光敏层 树脂组合物，其包含（a）40至80重量份的酸值为10至46mgKOH / g的乙烯基聚合的高分子量粘合剂，（b）20至60重量份具有至少两个可聚合的 不饱和双键，组分（a）和（b）的总量为100重量份，和（c）光聚合引发剂通过以0.1〜10重量份的量的活性光照射而产生自由基 基于100重量份的组分（a）和（b）的重量; （2）通过成像地照射活性光并用半显影液显影来在感光树脂组合物的表面上形成负型图案; 和（3）通过使用感光性树脂组合物的负图案作为电镀抗蚀剂的基板表面，通过化学镀铜形成电路图案。

    Process for electroless copper plating
    7.
    发明授权
    Process for electroless copper plating 失效
    化学镀铜工艺

    公开(公告)号：US4632852A

    公开(公告)日：1986-12-30

    申请号：US746099

    申请日：1985-06-18

    申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

    发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Motoyo Wajima ,  Rituji Toba ,  Shoji Kawakubo ,  Akio Tadokoro

    IPC分类号： C23C18/40 ,  H05K3/18 ,  C23C3/02

    CPC分类号： H05K3/187 ,  C23C18/40

    摘要： In a process for electroless copper plating in an electroless copper plating solution containing a copper salt, a complexing agent for the copper salt, a reducing agent for the copper salt, and a pH-adjusting agent, a plating film having distinguished mechanical properties can be obtained by adding at least one of soluble inorganic silicon compounds and soluble inorganic germanium compounds and conducting the electroless copper plating by injecting an oxygen-containing gas into the plating solution or by adding an oxidizing agent to the plating solution or by both injection or the oxygen-containing gas and addition of the oxidizing agent thereto. The stability of the electroless copper plating solution can be maintained better thereby and substantially thick plating is possible.

    摘要翻译： 在含有铜盐，铜盐络合剂，铜盐还原剂和pH调节剂的化学镀铜溶液中的无电镀铜方法中，具有显着的机械性能的镀膜可以是 通过添加可溶性无机硅化合物和可溶性无机锗化合物中的至少一种而进行无电镀铜，通过将含氧气体注入镀液中或者通过向镀液中添加氧化剂，或者通过注入或氧气 并且向其中加入氧化剂。 可以更好地保持化学镀铜溶液的稳定性，并且可以实现基本上厚的镀覆。

    Process for producing printed circuit board
    9.
    发明授权
    Process for producing printed circuit board 失效
    印刷电路板生产工艺

    公开(公告)号：US4876177A

    公开(公告)日：1989-10-24

    申请号：US95921

    申请日：1987-09-08

    申请人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Toyofusa Yoshimura

    发明人： Haruo Akahoshi ,  Kanji Murakami ,  Mineo Kawamoto ,  Akio Tadokoro ,  Toyofusa Yoshimura

    IPC分类号： C23C18/38 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38

    CPC分类号： H05K3/184 ,  H05K2203/1407 ,  H05K3/0023 ,  H05K3/387

    摘要： A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.

    摘要翻译： 一种制造印刷电路板的方法，包括以下步骤：在绝缘基材上形成包含感光性树脂组合物的层，其表面上附着有金属的粘合剂层，随后在其上镀覆; 将包含光敏树脂组合物的所述层以使其在所述层上形成导体电路图案的负型图案并将所述负型图案半形成足以使其免受电镀溶液侵蚀的程度使光敏树脂组合物暴露于光化辐射; 通过用溶剂除去未暴露于所述光化辐射的未固化区域，从而在所述负型图案的区域上形成电镀抗蚀剂; 对未被所述电镀抗蚀剂覆盖的所述导体电路图案化学电镀，从而形成导体电路; 并进行固化处理以完全固化所述抗蚀剂。 根据本发明，与传统工艺相比，可以提供具有更高可靠性的印刷电路板。