Providing a metal layer in a semiconductor package
    6.
    发明授权
    Providing a metal layer in a semiconductor package 有权
    在半导体封装中提供金属层

    公开(公告)号:US07332823B2

    公开(公告)日:2008-02-19

    申请号:US11300720

    申请日:2005-12-15

    IPC分类号: H01L23/28

    摘要: In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some embodiments, the mold layer is substantially coplanar with the metal layer to improve package performance. Other embodiments are described and claimed.

    摘要翻译: 在一个实施例中,本发明包括具有基板的半导体封装,具有与基板相对的第一表面的半导体管芯和第二表面,形成在半导体管芯的第二表面上的金属层, 基质。 在一些实施例中,模具层与金属层基本共面以提高包装性能。 描述和要求保护其他实施例。