摘要:
A carrier sheet for printed circuits and semiconductor chips having enhanced adhesion of conductive metal layers to a fluororesin surface resulting from rendering the fluororesin surface hydrophilic by a hydrophilic macromolecule before plating the metal onto the surface.
摘要:
A composite material comprising a porous polymeric material bonded to a silicone resin substrate with a silicone-based adhesive agent, wherein only part of the pores of said porous material in the thickness direction thereof contain said silicone-based adhesive agent.
摘要:
A liquid crystal-containing precursor for a liquid crystal display device consisting of a porous polytetrafluoroethylene film which has the structure defining the pores treated with a hydrophilic substance. The pores of the treated porous film are substantially filled with liquid crystals. The hydrophilizing treatment increases the transition speed of the liquid crystals from light-scattering orientation to light-transmitting orientation. The liquid crystal-filled film can be covered with transparent non-porous layers of material, having an electrically-conductive film on at least one surface, which can be hermetically sealed at the edges, to permit long-term storage of the liquid crystals in ready-to-use sheet form and easy inclusion into a liquid crystal display device.
摘要:
A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.
摘要:
A platinum or platinum-alloy plated porous fluoropolymer membrane where the plated metal adheres to the membrane through a coating of a cation-exchange material on the membrane.
摘要:
A metallized porous fluorinated polymer in which at least the inside surfaces are coated with a hydrophilic fluorinated polymer and the surface of the hydrophilic polymer coated with a metal film and a process for its manufacture.
摘要:
An IC tester correctly carries out a function test on an integrated circuit (IC). The IC tester selects one of two strobe position signals depending on whether an expected value is for testing a rise or a fall of an output signal of the tested IC, and compares the expected value with the output signal at a proper timing specified by the selected strobe position signal. The IC tester avoids an error of test due to a deviation between the positions of the rise and fall of the output signal of the tested IC.
摘要:
An integrated circuit tester uses the information compared between a test executed result and an expected value, for the operation of a driver, which applies test patterns to a device under test. Once a test executed result obtained from the device is compared with an expected value, the compared information is fedback to the driver so as to specify, for example, test cycles and test patterns. Therefore, in an evaluation of maximum operating frequencies, the failure which occurs in the (n+1)th lower frequency can be effectively observed without being masked by other failures which occur in the nth lower frequency or less.
摘要:
A small, high performance, multifunctional high frequency circuit that is multiband and multimode compatible reduces loss from a switch formed on the output side of a final stage amplification unit. The final stage amplification unit power amplifies an input signal and outputs an amplified signal. A first matching circuit impedance converts the amplified signal input thereto at a first input impedance, and outputs a first impedance-converted signal at a first output impedance. A control unit that generates a control signal denoting signal path selection information. A switch unit selects one of at least two signal paths based on the control signal, passes the first impedance-converted signal at an on impedance through the selected path, and outputs the pass signal. A second matching circuit impedance converts a pass signal input thereto at a second input impedance, and outputs a second impedance-converted signal at a second output.
摘要:
An IC chip bonding sheet having adhesive resin layers formed on both faces of a porous polytetrafluoroethylene layer comprising a porous polytetrafluoroethylene sheet, the porous polytetrafluoroethylene layer retaining porous voids, and the adhesive resin layers comprising a bromine-free flame retardant resin composition.