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    Catalyst and composition for producing polyurethane foam
    4.
    发明授权
    Catalyst and composition for producing polyurethane foam 失效
    用于生产聚氨酯泡沫的催化剂和组合物

    公开(公告)号：US4473662A

    公开(公告)日：1984-09-25

    申请号：US445580

    申请日：1982-11-30

    申请人： Yasuo Hira ,  Susumu Tsuzuku ,  Masao Gotoh ,  Hitoshi Yokono

    发明人： Yasuo Hira ,  Susumu Tsuzuku ,  Masao Gotoh ,  Hitoshi Yokono

    IPC分类号： C08G18/00 ,  C08G18/18 ,  C08G18/22 ,  B01J31/02 ,  B01J31/12

    CPC分类号： C08G18/1883

    摘要： In a composition for producing polyurethane foam which comprises an organic polyisocynate compound, a compound having at least one active hydrogen atom in the molecule, a foaming agent and a catalyst as essential components, an aminoalkylsilane represented by the following general formula is contained: ##STR1## wherein n is 1 or 2, and R.sub.1 to R.sub.5 are alkyl groups. By use of such a catalyst polyurethane foam having a even color distribution and excellent mechanical properties is produced.

    摘要翻译： 在含有有机多异氰酸酯化合物，分子中具有至少一个活性氢原子的化合物，发泡剂和作为必须成分的催化剂的聚氨酯泡沫塑料用组合物中，含有以下通式表示的氨基烷基硅烷：其中n为1或2，R 1至R 5为烷基。 通过使用具有均匀颜色分布和优异的机械性能的这种催化剂聚氨酯泡沫。

    Reaction injection molded article with threads and method of molding same
    7.
    发明授权
    Reaction injection molded article with threads and method of molding same 失效
    具有螺纹的反应注塑制品及其成型方法

    公开(公告)号：US4446185A

    公开(公告)日：1984-05-01

    申请号：US355456

    申请日：1982-03-08

    申请人： Kenichi Waragai ,  Masao Gotoh ,  Hitoshi Yokono ,  Kazumi Iijima

    发明人： Kenichi Waragai ,  Masao Gotoh ,  Hitoshi Yokono ,  Kazumi Iijima

    IPC分类号： B29C33/14 ,  B29C44/12 ,  B29C67/24 ,  B29C70/68 ,  C08J9/34 ,  B32B3/24

    CPC分类号： C08J9/34 ,  B29C44/1271 ,  B29C70/68 ,  B29C33/14 ,  B29C67/246 ,  B29K2105/04 ,  B29L2023/00 ,  C08J2375/04 ,  Y10S264/83 ,  Y10S411/907 ,  Y10S411/908 ,  Y10T428/22 ,  Y10T428/24496 ,  Y10T428/24529 ,  Y10T428/24992 ,  Y10T428/249989

    摘要： A reaction injection molded article formed with threads and a method of molding same, wherein threaded members, such as threaded inserts, helicoils, etc., are positioned in the cavity of a reaction injection mold, and molding material is injected into the cavity to form the threaded members into a unitary structure with a body of the reaction injection molded article. The threaded members are securedly held in place by a surface layer of relatively high density. The molding material is a mixture of an A liquid and a B liquid, the A liquid containing 100 weight parts of polyether polyol obtained by adding alkylene oxide to various kinds of alcohol or amine, 1-5 weight parts of a reaction promoting agent (catalyst) comprising tertiary amines, tin compounds, etc., 3-50 weight parts of water and a foaming agent, such as low boiling point alkylhalide, 1-5 weight parts of a foaming regulating agent, such as alkylene oxide denatured polydimethyl siloxane and 1-20 weight parts, if necessary, of pigment, dyestuff and filler, such as carbon black, diazo compound, silica, glass fiber, etc., and the B liquid containing 100-200 weight parts of MDI, TDI, crude MDI or crude TDI.

    摘要翻译： 形成有螺纹的反应注射成型制品及其成型方法，其中将螺纹构件（例如螺纹插入件，螺旋体等）定位在反应注射模具的空腔中，并将成型材料注入空腔中以形成 螺纹构件与反应注射成型制品的主体成整体结构。 螺纹构件通过相对高密度的表面层牢固地保持就位。 成型材料是A液和B液的混合物，A液含有100重量份通过将环氧烷加成到各种醇或胺中得到的聚醚多元醇，1-5重量份的反应促进剂（催化剂 ）包含叔胺，锡化合物等，3-50重量份的水和发泡剂，例如低沸点烷基卤，1-5重量份发泡调节剂，例如烯化氧改性的聚二甲基硅氧烷和1 -20重量份，如有必要，颜料，染料和填料如炭黑，重氮化合物，二氧化硅，玻璃纤维等，B液含100-200份MDI，TDI，粗MDI或粗品 TDI。

    Cooling arrangement for semiconductor devices and method of making the same
    9.
    发明授权
    Cooling arrangement for semiconductor devices and method of making the same 失效
    用于半导体器件的冷却装置及其制造方法

    公开(公告)号：US5133403A

    公开(公告)日：1992-07-28

    申请号：US423386

    申请日：1989-10-19

    申请人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

    发明人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

    IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/4338 ,  H01L23/3733 ,  F28F2255/18 ,  H01L2224/16225

    摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.

    摘要翻译： 一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。 该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高 各向同性的导热性。 即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。 复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。 混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。