公开(公告)号：US20150243622A1

公开(公告)日：2015-08-27

申请号：US14711864

申请日：2015-05-14

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Yuh Chern SHIEH ,  Han-Ping PU ,  Yu-Feng CHEN ,  Tin-Hao KUO

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/14 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1405 ,  H01L2224/14131 ,  H01L2224/145 ,  H01L2224/16104 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/17104 ,  H01L2224/81191 ,  H01L2224/81424 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2224/05552

摘要： A package includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis, wherein the first work piece is rigid, and an entirety of the metal trace is on the first work piece. The package further includes a second work piece with a plurality of elongated bumps, wherein at least one of the plurality of elongated metal bumps has a second axis and at least another of the plurality of elongated metal bumps has a third axis, wherein the second and the third axes are not the same and the second axis is at a non-zero angle from the first axis, wherein the plurality of elongated bumps are electrically connected to the metal trace.

摘要翻译： 包装包括在第一工件的表面上具有金属迹线的第一工件，其中金属迹线具有第一轴线，其中第一工件是刚性的，并且整个金属迹线在第一工件上 。 所述封装还包括具有多个细长凸块的第二工件，其中所述多个细长金属凸块中的至少一个具有第二轴线，并且所述多个细长金属凸块中的至少另一个具有第三轴线，其中所述第二和 所述第三轴线不相同，所述第二轴线与所述第一轴线成非零角度，其中所述多个细长凸块电连接到所述金属轨迹。

公开(公告)号：US20150318253A1

公开(公告)日：2015-11-05

申请号：US14800934

申请日：2015-07-16

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Chih-Horng CHANG ,  Tin-Hao KUO ,  Chen-Shien CHEN ,  Yen-Liang LIN

IPC分类号： H01L23/00

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/10145 ,  H01L2224/11849 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14051 ,  H01L2224/1412 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81345 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/2064 ,  Y10T428/12493 ,  Y10T428/24479 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A bump structure includes a first end; and a second end opposite the first end. The bump structure further includes a side connected between the first end and the second end, wherein the side comprises a recess for a reflowed solder material to fill, and the recess defines a first surface adjacent to the first end and a second surface adjacent to the second end.

摘要翻译： 凸块结构包括第一端; 以及与第一端相对的第二端。 凸起结构还包括连接在第一端和第二端之间的侧面，其中侧面包括用于回流焊料材料填充的凹槽，凹部限定与第一端相邻的第一表面和邻近第一端的第二表面 第二端

公开(公告)号：US20150084186A1

公开(公告)日：2015-03-26

申请号：US14507189

申请日：2014-10-06

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Chih-Horng CHANG ,  Tin-Hao KUO ,  Chen-Shien CHEN ,  Yen-Liang LIN

IPC分类号： H01L23/00

CPC分类号： H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/10145 ,  H01L2224/11849 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14051 ,  H01L2224/1412 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81345 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/2064 ,  Y10T428/12493 ,  Y10T428/24479 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A bump structure includes a first end, and a second end opposite the first end. The bump structure further includes a first side connected between the first end and the second end. The bump structure further includes a second side opposite the first side. The second side is connected between the first end and the second end, and the second side comprises a recess for a reflowed solder material to fill.

摘要翻译： 凸块结构包括第一端和与第一端相对的第二端。 凸起结构还包括连接在第一端和第二端之间的第一侧。 凸起结构还包括与第一侧相对的第二侧。 第二侧连接在第一端和第二端之间，第二侧包括用于填充回流焊料的凹部。

公开(公告)号：US20160043051A1

公开(公告)日：2016-02-11

申请号：US14455615

申请日：2014-08-08

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Yen-Liang LIN ,  Mirng-Ji LII ,  Tin-Hao KUO ,  Chen-Shien CHEN ,  Yu-Feng CHEN ,  Sheng-Yu WU

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/522

CPC分类号： H01L24/17 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/1705 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/014

摘要： The present disclosure provides a semiconductor package, including a semiconductor die and a substrate having a first surface electrically coupled to the semiconductor die and a second surface opposing to the first surface. The first surface includes a core region having a plurality of landing pads and a periphery region surrounding the core region and having a plurality of landing traces. A pitch of the landing pads is from about 55 μm to about 280 μm. The semiconductor die includes a third surface facing the first surface of the substrate and a fourth surface opposing to the third surface. The third surface includes a plurality of elongated bump positioned correspondingly to the landing pads and the landing traces of the substrate, and the elongated bump includes a long axis and a short axis perpendicular to the long axis on a cross section thereof.

摘要翻译： 本公开提供了半导体封装，其包括半导体管芯和具有电耦合到半导体管芯的第一表面的衬底和与第一表面相对的第二表面。 第一表面包括具有多个着陆焊盘的芯区域和围绕芯区域并具有多个着陆迹线的外围区域。 着陆垫的间距为约55μm至约280μm。 半导体管芯包括面向衬底的第一表面的第三表面和与第三表面相对的第四表面。 第三表面包括对应于基板的着陆焊盘和着陆迹线定位的多个细长凸块，并且细长凸块包括在其横截面上与长轴垂直的长轴和短轴。