公开(公告)号：US5747400A

公开(公告)日：1998-05-05

申请号：US683783

申请日：1996-07-16

申请人： Tadao Sasaki ,  Hideaki Ohashi ,  Akio Ueda ,  Norio Honda ,  Hiroyuki Suzuki

发明人： Tadao Sasaki ,  Hideaki Ohashi ,  Akio Ueda ,  Norio Honda ,  Hiroyuki Suzuki

IPC分类号： C04B35/64 ,  C04B35/66 ,  F27D1/16 ,  F27D21/00 ,  C04B35/00

CPC分类号： C04B35/6303 ,  C04B35/64 ,  C04B35/66 ,  C04B2111/80 ,  C04B2111/82

摘要： A colored refractory material for lining an instrument/apparatus used at a high temperature is formed by mixing a powder of a raw material containing ceramics with a coloring agent and kneading with a liquid using a binder. The refractory material is put in lining for a portion being in contact with a high temperature molten substance or being exposed to a high temperature atmosphere, and is dried by heating while adjusting a temperature and a heating time on the basis of color change on the surface of the refractory material.

摘要翻译： 通过将包含陶瓷的原料的粉末与着色剂混合并使用粘合剂与液体混合来形成用于衬里在高温下使用的仪器/装置的着色耐火材料。 将耐火材料放置在与高温熔融物质接触的部分或暴露于高温气氛中的衬里中，并通过加热干燥，同时基于表面上的颜色变化调节温度和加热时间 的耐火材料。

公开(公告)号：US4879796A

公开(公告)日：1989-11-14

申请号：US146948

申请日：1988-01-22

申请人： Katsumi Nakamura ,  Shigeyuki Koide ,  Norio Honda ,  Kazufumi Tamura ,  Akifumi Kobayashi

发明人： Katsumi Nakamura ,  Shigeyuki Koide ,  Norio Honda ,  Kazufumi Tamura ,  Akifumi Kobayashi

IPC分类号： B23P19/04

CPC分类号： B23P19/042 ,  Y10T29/53557 ,  Y10T29/53974

摘要： A valve inserting apparatus for an internal combustion engine has a cylinder head of the engine supported by a jig such that its surface on a combustion chamber side is positioned facing upward and the longitudinal axis of a valve guide assembled to the cylinder head is kept vertical while a valve is inserted into the valve guide from above. The valve inserting apparatus includes a valve inserting unit for moving upwards and downwards. A valve holding device detachably, swingably, holds the valve with its head portion facing upward. A valve push-in device is provided and a suction device moves into contact with a lower end of the valve guide. The push-in device comprises an upwardly and downwardly movable push rod having a weight attached to the upper end portion. The push rod abuts the head portion of the valve from above. The valve inserting unit includes a first detector for detecting whether or not the push rod is at a position higher than a first predetermined reference position, such that the position of the push rod when the push rod in abutment with the valve and the valve inserting unit has been lowered to a predetermined position where the lower end of the valve has been inserted into an upper end of the valve guide to a predetermined depth. The valve inserting device further includes a second detector for detecting whether or not the push rod is at a position lower than a second predetermined reference position, that is, the position of the push rod when the lower end of the valve reaches the stem seal.

摘要翻译： 用于内燃机的阀插入装置具有由夹具支撑的发动机的气缸盖，使得其在燃烧室侧的表面面向上定位，并且组装到气缸盖的导阀的纵向轴线保持垂直，同时 阀从上方插入阀导向器中。 阀插入装置包括用于向上和向下移动的阀插入单元。 一个可自由旋转的阀保持装置可旋转地保持其头部朝上的阀。 提供阀推入装置，并且抽吸装置与阀导向件的下端相接触。 推入装置包括向上和向下移动的推杆，其具有附接到上端部分的重物。 推杆从上方抵接阀的头部。 阀插入单元包括第一检测器，用于检测推杆是否位于高于第一预定基准位置的位置，使得当推杆与阀和阀插入单元抵接时的推杆的位置 已经被降低到其中阀的下端已经被插入到阀引导件的上端到预定深度的预定位置。 阀插入装置还包括第二检测器，用于检测推杆是否位于低于第二预定基准位置的位置，即当阀的下端到达阀杆密封件时推杆的位置。

公开(公告)号：US4493145A

公开(公告)日：1985-01-15

申请号：US542570

申请日：1983-10-19

申请人： Norio Honda

发明人： Norio Honda

IPC分类号： H01L23/32 ,  H05K1/14 ,  H05K1/18 ,  H05K3/26 ,  H05K3/34

CPC分类号： H05K3/26 ,  H05K1/181 ,  H05K3/3442 ,  H05K1/141 ,  H05K2201/09072 ,  H05K2201/1034 ,  H05K2201/10727 ,  H05K2203/0783 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144

摘要： An integrated circuit device for realizing high integration density wherein a small size package called chip carrier (1) comprising a semiconductor integrated circuit element and providing connecting area at the perimeter of the rear side of said package is mounted onto a wiring board called mother board (2) providing connecting area corresponding to the connecting area of said small size package at the upper surface, characterized in that, contamination or dust existing in the gap between the upper surface of the mother board (2) and rear side of the chip carrier (1) can easily flow out and can be removed, thus improving reliability, by providing a through hole (7) at the chip carrier mounting area on said mother board (2).

摘要翻译： 一种用于实现高集成度密度的集成电路器件，其中称为芯片载体（1）的小尺寸封装包括半导体集成电路元件并在所述封装的后侧的周边提供连接区域安装在被称为母板的布线板 2）在上表面提供与所述小尺寸包装的连接区域对应的连接区域，其特征在于，存在于母板（2）的上表面和芯片承载件的后侧之间的间隙中的污染物或灰尘 通过在所述母板（2）上的芯片载体安装区域设置通孔（7），可以容易地流出并且可以移除，从而提高可靠性。

公开(公告)号：US4340902A

公开(公告)日：1982-07-20

申请号：US128354

申请日：1979-07-12

申请人： Norio Honda ,  Takehisa Sugahara

发明人： Norio Honda ,  Takehisa Sugahara

IPC分类号： H01L23/02 ,  H01L23/04 ,  H01L23/047 ,  H01L23/057 ,  H01L23/367 ,  H01L23/40 ,  H01L23/495 ,  H01L23/498 ,  H01L23/12 ,  H01L39/02

CPC分类号： H01L23/40 ,  H01L23/047 ,  H01L23/057 ,  H01L23/367 ,  H01L23/49541 ,  H01L23/498 ,  H01L23/49827 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A semiconductor device having a semiconductor chip (102), a ceramic base (101), a ceramic frame (105) and a cover (106). The ceramic base (101) is formed with a through hole. One side of said hole is covered by a high-heat conductivity metal plate (100). Said semiconductor chip (102) is mounted through a molybdenum plate (110) on the bottom of a recess formed by one side by said high-heat conductivity metal plate (100) and said through hole. A cooling means (107,108) is secured on said high-heat conductivity metal plate (100) opposite to the side for receiving the semiconductor chip (102).

摘要翻译： PCT No.PCT / JP78 / 00004 Sec。 371日期1979年7月18日 102（e）日期1979年7月12日PCT提交1978年10月2日PCT公布。 出版物WO79 / 00302 日期：1979年5月31日。具有半导体芯片（102），陶瓷基座（101），陶瓷框架（105）和盖（106）的半导体器件。 陶瓷基座（101）形成有通孔。 所述孔的一侧由高导热性金属板（100）覆盖。 所述半导体芯片（102）通过所述高导热性金属板（100）和所述通孔由一侧形成的凹部的底部上的钼板（110）安装。 冷却装置（107,108）固定在与用于接收半导体芯片（102）的一侧相对的所述高导热性金属板（100）上。

公开(公告)号：US06281266B1

公开(公告)日：2001-08-28

申请号：US09581803

申请日：2000-06-16

申请人： Kenzo Takeda ,  Kunihiko Shiraishi ,  Fumiyuki Inoue ,  Norio Honda

发明人： Kenzo Takeda ,  Kunihiko Shiraishi ,  Fumiyuki Inoue ,  Norio Honda

IPC分类号： B22D710

CPC分类号： C04B35/63472 ,  B22D41/46 ,  C04B35/62204 ,  C04B35/6325 ,  C04B35/63496 ,  C04B35/66 ,  C04B35/80 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3244 ,  C04B2235/3463 ,  C04B2235/349 ,  C04B2235/3826 ,  C04B2235/3873 ,  C04B2235/405 ,  C04B2235/422 ,  C04B2235/424 ,  C04B2235/428 ,  C04B2235/5212 ,  C04B2235/526 ,  C04B2235/5264 ,  C04B2235/5427 ,  C04B2235/5436 ,  C04B2235/5463 ,  C04B2235/6021 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2235/9615 ,  C04B2235/9669 ,  F27D3/1536

摘要： Disclosed is a taphole plugging composition for metal melting apparatus, the composition comprising (a) a refractory aggregate having a maximum particle size of 5 mm or less, (b) graphite and silicon nitride each having a maximum particle size of 0.2 mm or less, (c) a refractory clay, (d) a compatibilized binder mixture comprising a phenolic resin, a ketone compound and a pitch, and (e) an organic fine fiber.

摘要翻译： 公开了用于金属熔化装置的出钢孔堵塞组合物，该组合物包含（a）最大粒径为5mm以下的耐火骨料，（b）最大粒径为0.2mm以下的石墨和氮化硅， （c）耐火粘土，（d）包含酚醛树脂，酮化合物和沥青的相容化粘合剂混合物，和（e）有机细纤维。

公开(公告)号：US4879795A

公开(公告)日：1989-11-14

申请号：US146949

申请日：1988-01-22

申请人： Katsumi Nakamura ,  Norio Honda ,  Kazufumi Tamura ,  Akifumi Kobayashi

发明人： Katsumi Nakamura ,  Norio Honda ,  Kazufumi Tamura ,  Akifumi Kobayashi

IPC分类号： B23P19/04

CPC分类号： B23P19/042 ,  Y10T29/53557 ,  Y10T29/53974

摘要： A valve inserting apparatus is provided for an internal combustion engine having an intake valve and an exhaust valve inserted into respective valve guides on the intake and the exhaust of engine. The valve inserting apparatus comprises a pair of valve supply devices for supplying intake valves and the exhaust valves. A jig has a jig plate, a jig base and a horizontal shaft. The jig plate is supported on the jig base and is swingable about the shaft. A valve inserting device inserts both the intake and exhaust valves. A base for the two valve supply devices and the jig is disposed circumferentially around the base. A supporting column is mounted on the base. The supporting column is movable to advance towards and retract from the jig. The valve inserting device is supported on a swingable frame swingably mounted an the supporting column. By advancing and retracting the supporting column and swinging the swingable frame, the valve inserting device is moved between a position above each of the valve supply devices and a position above the jig. The valve inserting device inserts an intake valve into the valve guide on the intake side when the jig plate is swung to the first swung position, and the valve inserting device inserts an exhaust valve supplied from the exhaust valve supply device into the valve guide on the exhaust side when the jig plate is swung to the second swung position.

摘要翻译： 本发明提供了一种内插式发动机的阀插入装置，该内燃机具有插入到引擎的进气口和排气口上的各个导阀中的进气门和排气阀。 阀插入装置包括一对供给进气阀和排气阀的阀供应装置。 夹具具有夹具板，夹具基座和水平轴。 夹具板支撑在夹具基座上并可围绕轴摆动。 阀插入装置插入进气阀和排气阀。 用于两个阀供应装置和夹具的基座围绕基座周向设置。 支撑柱安装在基座上。 支撑柱可移动以向夹具前进和退出。 阀插入装置支撑在可摆动地支撑柱上摆动的框架上。 通过推进和缩回支撑柱并摆动摆动框架，阀插入装置在每个阀供应装置上方的位置和夹具上方的位置之间移动。 当夹具板摆动到第一摆动位置时，阀插入装置将进气阀插入到进气侧的阀导向件中，并且阀插入装置将从排气阀供应装置供给的排气阀插入阀导向器 当夹具板摆动到第二摆动位置时，排气侧。

公开(公告)号：US4580157A

公开(公告)日：1986-04-01

申请号：US469833

申请日：1983-03-02

申请人： Norio Honda

发明人： Norio Honda

IPC分类号： H01L21/52 ,  H01L21/26 ,  H01L21/58 ,  H01L23/02 ,  H01L23/057 ,  H01L23/16 ,  H01L23/498 ,  H01L23/556 ,  H01L23/14 ,  G11C11/40 ,  H01L27/04

CPC分类号： H01L24/83 ,  H01L21/26 ,  H01L23/057 ,  H01L23/16 ,  H01L23/498 ,  H01L23/556 ,  H01L24/29 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025

摘要： In a semiconductor device, particularly a memory device, radioactive rays emitted from the ceramic material of the package enclosing the LSI chip of the device detrimentally influence the electrical properties of the device. In the memory device, the information is destroyed by the radioactive ray emission, which is referred to as a soft error. In the present invention, a shield plate having a shielding effect against radioactive rays is arranged in the space defined by a cover and a carrier. Thus, the radioactive rays emitted from the cover and carrier are blocked by the shielding plate, preferably made of high purity silicon, as well as by the silicon substrate of the LSI chip.

摘要翻译： 在半导体器件，特别是存储器件中，从封装LSI器件的封装的封装的陶瓷材料发射的放射线不利地影响器件的电性能。 在存储器件中，信息被放射线发射破坏，这被称为软错误。 在本发明中，在由盖和载体限定的空间中布置具有防放射线的屏蔽效果的屏蔽板。 因此，从覆盖物和载体发射的放射线被屏蔽板，优选由高纯度硅以及LSI芯片的硅衬底所阻挡。

公开(公告)号：US4535384A

公开(公告)日：1985-08-13

申请号：US620522

申请日：1984-06-12

申请人： Tetsushi Wakabayashi ,  Norio Honda ,  Osamu Sakuma

发明人： Tetsushi Wakabayashi ,  Norio Honda ,  Osamu Sakuma

IPC分类号： H01L23/36 ,  H01L23/367 ,  H05K7/20

CPC分类号： H01L23/367 ,  H01L2924/0002

摘要： A semiconductor device comprising at least one heat sink joined to a plurality of IC packages mounted on a mother board. Plural individual heat sinks are joined to respectively corresponding IC packages each comprising a central shaft joined to and extending in substantially perpendicular relationship from a respective said package and plural, parallel spaced fins extending outwardly from and in perpendicular relationship to the shaft. A common heat sink for plural IC packages comprises a base board portion, a heat conducting shaft portion arranged perpendicular to the base board portion and a plurality of heat dissipating fins arranged perpendicular to said heat conducting shaft portion and in parallel, spaced relationship to each other, the common heat sink having one or more slits which are formed parallel to and extending through the heat conducting shaft from the base board portion to midway of the height of the heat conducting shaft and defining a plurality of sections of the base board portion, respectively, joined to the plurality of IC packages.

摘要翻译： 一种半导体器件，包括连接到安装在母板上的多个IC封装的至少一个散热器。 多个独立的散热器连接到分别对应的IC封装，每个封装包括一个中心轴，该中心轴与相应的所述封装相接合并基本垂直地延伸，并且与从轴垂直的方向向外延伸多个平行隔开的翅片。 用于多个IC封装的公共散热器包括基板部分，垂直于基板部分布置的导热轴部分和垂直于所述导热轴部分布置并且彼此间隔开的多个散热片 所述共用散热器具有一个或多个狭缝，所述狭缝与所述导热轴平行并且从所述基板部分延伸到所述导热轴的高度的中间并且分别限定所述基板部分的多个部分， 连接到多个IC封装。