NANOSTRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    NANOSTRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权
    纳米结构及其制造方法

    公开(公告)号:US20090317597A1

    公开(公告)日:2009-12-24

    申请号:US12520959

    申请日:2008-01-16

    IPC分类号: B32B3/00 B05D3/02

    摘要: The present invention provides a nanostructure on an upper surface of which a small-diameter carbon nanotube (CNT) is formed and which improves an adhesive strength between a substrate and the CNT while controlling an orientation of the CNT, and a method for manufacturing the nanostructure. The nanostructure includes a substrate 101, a porous layer 102 formed on the substrate 101 to have a fine pore, a fine pore diameter control layer 103 formed on the porous layer 102, and a carbon nanotube 701 formed to extend from the fine pore defined by the fine pore diameter control layer 103, and one end of the carbon nanotube is fixed by the fine pore diameter control layer 103. It is preferable that the substrate 101 and the fine pore diameter control layer 103 be electrically conductive. It is preferable that the porous layer 102 be an anode oxide film. It is preferable that a melting point of the fine pore diameter control layer 103 be 600° C. or higher.

    摘要翻译: 本发明提供了在上表面上形成小直径碳纳米管(CNT)的纳米结构,并且在控制CNT的取向的同时改善了基板和CNT之间的粘合强度,以及纳米结构的制造方法 。 纳米结构包括基板101,形成在基板101上的具有细孔的多孔层102,形成在多孔层102上的细孔径控制层103和形成为从由多孔层102限定的细孔延伸的细孔 微细孔径控制层103和碳纳米管的一端由细孔直径控制层103固定。优选的是,基板101和细孔直径控制层103是导电的。 多孔层102优选为阳极氧化膜。 优选细孔径控制层103的熔点为600℃以上。

    Nitride semiconductor element and manufacturing method therefor
    6.
    发明授权
    Nitride semiconductor element and manufacturing method therefor 有权
    氮化物半导体元件及其制造方法

    公开(公告)号:US08729587B2

    公开(公告)日:2014-05-20

    申请号:US13596849

    申请日:2012-08-28

    IPC分类号: H01L33/30 H01L33/50

    摘要: An exemplary nitride-based semiconductor device includes: a nitride-based semiconductor multilayer structure 20 which has a p-type GaN-based semiconductor region whose surface 12 is inclined from the m-plane by an angle of not less than 1° and not more than 5° or the principal surface has a plurality of m-plane steps; and an electrode 30 that is arranged on the p-type GaN-based semiconductor region. The electrode 30 includes a Mg alloy layer 32 which is formed from Mg and metal selected from a group consisting of Pt, Mo, and Pd. The Mg alloy layer 32 is in contact with the surface 12 of the p-type GaN-based semiconductor region of the semiconductor multilayer structure 20.

    摘要翻译: 示例性的基于氮化物的半导体器件包括:氮化物基半导体多层结构20,其具有p型GaN基半导体区域,其表面12从m面倾斜不小于1°的角度,而不是更多 超过5°或主表面具有多个m平面步骤; 以及布置在p型GaN基半导体区域上的电极30。 电极30包括由Mg和选自Pt,Mo和Pd的金属形成的Mg合金层32。 Mg合金层32与半导体多层结构体20的p型GaN类半导体区域的表面12接触。

    Method for fabricating nitride-based semiconductor device having electrode on m-plane
    7.
    发明授权
    Method for fabricating nitride-based semiconductor device having electrode on m-plane 有权
    一种在m面上具有电极的氮化物基半导体器件的制造方法

    公开(公告)号:US08334199B2

    公开(公告)日:2012-12-18

    申请号:US12937758

    申请日:2010-03-17

    IPC分类号: H01L21/3205

    摘要: A nitride-based semiconductor light-emitting device 100 includes: a GaN substrate 10 with an m-plane surface 12; a semiconductor multilayer structure 20 provided on the m-plane surface 12 of the GaN substrate 10; and an electrode 30 provided on the semiconductor multilayer structure 20. The electrode 30 includes a Zn layer 32 and an Ag layer 34 provided on the Zn layer 32. The Zn layer 32 is in contact with a surface of a p-type semiconductor region of the semiconductor multilayer structure 20.

    摘要翻译: 氮化物系半导体发光装置100具备:具有m面面12的GaN衬底10; 设置在GaN衬底10的m面表面12上的半导体多层结构20; 以及设置在半导体多层结构体20上的电极30.电极30包括Zn层32和设置在Zn层32上的Ag层34.Zn层32与p型半导体区域的表面接触 半导体多层结构20。

    Nitride compound semiconductor element and method for manufacturing same
    8.
    发明授权
    Nitride compound semiconductor element and method for manufacturing same 有权
    氮化物半导体元件及其制造方法

    公开(公告)号:US08306085B2

    公开(公告)日:2012-11-06

    申请号:US13234326

    申请日:2011-09-16

    IPC分类号: H01S5/10

    摘要: The present invention is directed to a production method for a nitride compound semiconductor element including a substrate and a multilayer structure 40 supported by an upper face of the substrate. First, a wafer 1 to be split into individual substrates is provided. A plurality of semiconductor layers composing the multilayer structure 40 are grown on the wafer 1. By cleaving the wafer 1 and the semiconductor layers, a cleavage plane in the multilayer structure 40 is formed. In the present invention, a plurality of voids are arranged at positions in the multilayer structure at which a cleavage plane is to be formed. Thus, cleavage can be performed with a good yield.

    摘要翻译: 本发明涉及一种氮化物化合物半导体元件的制造方法,所述氮化物化合物半导体元件包括由所述基板的上表面支撑的基板和多层结构体40。 首先,设置分割成各个基板的晶片1。 构成多层结构40的多个半导体层在晶片1上生长。通过切割晶片1和半导体层,形成多层结构40中的解理面。 在本发明中,在形成有解理面的多层结构体的位置配置多个空隙。 因此,可以以良好的产率进行裂解。