公开(公告)号：US06313533B1

公开(公告)日：2001-11-06

申请号：US09346949

申请日：1999-07-01

申请人： Takuo Funaya ,  Kouji Matsui ,  Naoji Senba

发明人： Takuo Funaya ,  Kouji Matsui ,  Naoji Senba

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05571 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a function element including a resin layer formed on a surface thereof, the resin layer having adhesive property and sealing property, the resin layer having such a pattern that a resin layer does not exist in at least one of following areas: (a) a first area around an area where device performances are influenced by resin of which the resin layer was composed, (b) a second area around pads or bumps, (c) a third area around an area on which a wiring of a substrate will exist when the function element is coupled to the substrate, and (d) a fourth area around an area on which a passive element mounted on a substrate will exist when the function element is coupled to the substrate. The function element prevents extra resin from adhering to an area of the function element where device performances will be influenced by the resin, when the function element is coupled to a substrate with a resin layer being sandwiched therebetween.

摘要翻译： 提供了一种功能元件，其包括在其表面上形成的树脂层，具有粘合性和密封性的树脂层，树脂层具有在以下至少一个区域中不存在树脂层的图案：（a ）围绕着构成树脂层的树脂影响的区域周围的第一区域，（b）围绕焊盘或凸块的第二区域，（c）在基板的布线的区域周围的第三区域 当功能元件耦合到衬底时存在，以及（d）当功能元件耦合到衬底时，围绕安装在衬底上的无源元件将存在的区域周围的第四区域。 当功能元件与夹在其间的树脂层的基板耦合时，功能元件防止额外的树脂粘附到功能元件的其中器件性能将受树脂影响的区域。

公开(公告)号：US06798070B2

公开(公告)日：2004-09-28

申请号：US09730849

申请日：2000-12-07

申请人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

发明人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

IPC分类号： H01L2348

CPC分类号： H05K3/284 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

摘要翻译： 公开了一种用于密集安装电子设备的电子设备组件和连接电子设备的方法。 由金属凸块实现的导电部分和由粘合密封树脂实现的密封部分在两个电子器件之间同时通过热压连接。 这可以在三个或更多个电子设备之间重复。

公开(公告)号：US06576499B2

公开(公告)日：2003-06-10

申请号：US09995722

申请日：2001-11-29

申请人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

发明人： Takuo Funaya ,  Tadanori Shimoto ,  Naoji Senba ,  Koji Matsui

IPC分类号： H01L2144

CPC分类号： H05K3/284 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

摘要翻译： 公开了一种用于密集安装电子设备的电子设备组件和连接电子设备的方法。 由金属凸块实现的导电部分和由粘合密封树脂实现的密封部分在两个电子器件之间同时通过热压连接。 这可以在三个或更多个电子设备之间重复。

公开(公告)号：US08198140B2

公开(公告)日：2012-06-12

申请号：US12882277

申请日：2010-09-15

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US07816782B2

公开(公告)日：2010-10-19

申请号：US11174526

申请日：2005-07-06

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L23/14 ,  H01L23/12

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US20060012048A1

公开(公告)日：2006-01-19

申请号：US11174526

申请日：2005-07-06

申请人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

发明人： Hideya Murai ,  Tadanori Shimoto ,  Takuo Funaya ,  Katsumi Kikuchi ,  Shintaro Yamamichi ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata ,  Kouji Matsui ,  Shinichi Miyazaki

IPC分类号： H01L23/48

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5383 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/061 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.

摘要翻译： 用于安装半导体的布线基板设置有绝缘膜，形成在绝缘膜中的布线以及通过通孔电连接到导线的多个电极垫。 电极焊盘被设置为使其表面暴露于绝缘膜的前表面和后表面，并且电极焊盘的侧表面的至少一部分被埋在绝缘膜中。 绝缘膜通过在相应的两个金属板上形成电极焊盘而形成，然后在相应的金属板上层叠绝缘层和电线以覆盖电极焊盘，并将绝缘层彼此粘合在一起，然后除去 金属板。

公开(公告)号：US08975150B2

公开(公告)日：2015-03-10

申请号：US13190052

申请日：2011-07-25

申请人： Kentaro Mori ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Masaya Kawano ,  Takehiko Maeda ,  Kouji Soejima

发明人： Kentaro Mori ,  Shintaro Yamamichi ,  Hideya Murai ,  Takuo Funaya ,  Masaya Kawano ,  Takehiko Maeda ,  Kouji Soejima

IPC分类号： H01L21/76 ,  H01L21/683 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00

CPC分类号： H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L2221/68345 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  Y10S438/977 ,  H01L2924/00

摘要： A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.

摘要翻译： 透明板位于设置有定位标记的支撑板上，并且设置有释放材料。 然后将半导体元件定位成使得电极元件面向上，然后移除支撑板。 然后在剥离材料上形成绝缘树脂以覆盖半导体元件; 然后形成通孔，布线层，绝缘层，外部端子和阻焊剂。 然后透明板通过使用释放材料从半导体器件剥离。 因此，可以高精度地安装芯片，在制造过程中不需要在将芯片安装在基板上时提供定位标记，并且可以容易地去除基板。 结果，可以以低成本制造具有高密度和薄型的半导体器件。

公开(公告)号：US20130237055A1

公开(公告)日：2013-09-12

申请号：US13703430

申请日：2011-06-10

申请人： Takuo Funaya ,  Francois Iker ,  Eric Beyne

发明人： Takuo Funaya ,  Francois Iker ,  Eric Beyne

IPC分类号： H01L21/48

CPC分类号： H01L21/486 ,  H01L21/76802 ,  H01L21/76819 ,  H01L23/522 ,  H01L23/525 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02317 ,  H01L2224/02321 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/24246 ,  H01L2224/245 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32147 ,  H01L2224/32227 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/821 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： According to a method of redistributing a functional element of the present invention, an insulating resin layer is supplied onto a functional element wafer such as an LSI. A portion to be a via hole on an electrode pad of the functional element is filled with a sacrificial layer. The top of the sacrificial layer filled in the via hole is exposed from the insulating layer by grinding or polishing. Therefore, it is possible to prevent breakage of a brittle material such as a low-k material in the functional element, which would be caused by transmission of shearing stress when a conventional pillar or a conventional gold projecting electrode is used. The reliability, the yield, and the level of flatness can be improved by forming an interconnection conductive layer after the flattening process of grinding or polishing. Accordingly, a fine conductive interconnection can be formed.

摘要翻译： 根据本发明的功能元件的再分配方法，将绝缘树脂层供给到诸如LSI的功能元件晶片上。 在功能元件的电极焊盘上作为通孔的部分填充有牺牲层。 填充在通孔中的牺牲层的顶部通过研磨或抛光从绝缘层暴露出来。 因此，可以防止当使用传统的支柱或传统的金投射电极时由功能元件中的低k材料形成的脆性材料的断裂，这是由剪切应力的传递引起的。 通过在研磨或抛光的平坦化处理之后形成互连导电层可以提高可靠性，产量和平坦度。 因此，可以形成精细的导电互连。

公开(公告)号：US20120156453A1

公开(公告)日：2012-06-21

申请号：US13329109

申请日：2011-12-16

申请人： Mario GONZALEZ ,  François Iker ,  Takuo Funaya

发明人： Mario GONZALEZ ,  François Iker ,  Takuo Funaya

IPC分类号： B32B7/02 ,  H01R43/00

CPC分类号： H01L23/5329 ,  H01L21/76829 ,  H01L21/76885 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/53295 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02321 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/03462 ,  H01L2224/03616 ,  H01L2224/05024 ,  H01L2224/05073 ,  H01L2224/05548 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/30105 ,  Y10T29/49117 ,  Y10T428/24942 ,  H01L2924/01022 ,  H01L2924/00

摘要： A method of providing a metal interconnect to second structures embedded in organic dielectric material is disclosed. In one aspect, the method includes obtaining a first structure with second structures, e.g., metal pillars, embedded in organic dielectric material. The method further includes, at least at some locations of the first structure, providing a stiffening layer on top of the organic dielectric material, the stiffening layer having a stiffness higher than the stiffness of the organic dielectric material. The method provides an interconnect structure free from cracks at the interface between the second structures and the organic dielectric material.

摘要翻译： 公开了一种向埋在有机电介质材料中的第二结构提供金属互连的方法。 在一个方面，该方法包括获得嵌入有机电介质材料中的第二结构，例如金属柱。 该方法还包括至少在第一结构的某些位置处，在有机电介质材料的顶部上提供加强层，该加强层的刚度高于有机介电材料的刚度。 该方法提供了在第二结构和有机介电材料之间的界面处没有裂纹的互连结构。

公开(公告)号：US20100237492A1

公开(公告)日：2010-09-23

申请号：US12682369

申请日：2008-10-14

申请人： Hideki Sasaki ,  Daisuke Ohshima ,  Takuo Funaya

发明人： Hideki Sasaki ,  Daisuke Ohshima ,  Takuo Funaya

IPC分类号： H01L23/538 ,  G06F17/50

CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/49838 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0263 ,  H05K3/3436 ,  H01L2224/0401

摘要： The semiconductor device comprises a semiconductor chip and a printed wiring board having a recess in which the semiconductor chip is housed face-down, wherein the printed wiring board comprises multiple wiring layers below a circuit surface of the semiconductor chip on which connection terminals are formed, and the multiple wiring layers include a first wiring layer for forming signal wires, a second wiring layer for forming a ground plane, and a third wiring layer for forming power wires and power BGA and ground BGA pads in sequence from the circuit surface.

摘要翻译： 半导体器件包括半导体芯片和印刷电路板，其具有半导体芯片正面朝下地容纳的凹部，其中印刷布线板包括在其上形成有连接端子的半导体芯片的电路表面下方的多个布线层， 并且多个布线层包括用于形成信号线的第一布线层，用于形成接地面的第二布线层和用于形成电源线的第三布线层，并且从电路表面依次施加电力BGA和接地BGA焊盘。