公开(公告)号：US20100113647A1

公开(公告)日：2010-05-06

申请号：US12309738

申请日：2007-07-25

申请人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

发明人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

IPC分类号： C08K9/04

CPC分类号： C09D11/36 ,  B22F1/0022 ,  B22F2998/10 ,  B82Y30/00 ,  C01P2004/64 ,  C09C1/62 ,  C09C3/045 ,  C09C3/10 ,  C09D11/52 ,  H05K1/097 ,  B22F9/24 ,  B22F1/0062

摘要： Disclosed is a fine particle dispersion which is superior in dispersibility and storage stability. Specifically disclosed is a fine particle dispersion in which a fine particle (P) comprised of one type or not less than two types of a metal, an alloy, and/or a metallic compound, having a mean particle diameter of between 1 nm and 150 nm for primary particles thereof, with being coated at least a part of a surface thereof with a polymer dispersing agent (D), is dispersed in a mixed organic solvent. This fine particle dispersion is characterized in that a weight ratio of (D/P) between the polymer dispersing agent (D) coating the surface of the fine particle (P) and the fine particles (P) in the dispersion is between 0.001 and 10, and the mixed organic solvent is one of: (i) a mixed organic solvent which contains an organic solvent (A) as between 50% and 95% by volume having an amide group, and a low boiling point organic solvent (B) as between 5% and 50% by volume having a boiling point of between 20° C. and 100° C. at a normal pressure; (ii) a mixed organic solvent which contains the organic solvent (A) as between 50% and 95% by volume having the amide group, and an organic solvent (C) as between 5% and 50% by volume having a boiling point of higher than 100° C. at a normal pressure and comprised of an alcohol and/or a polyhydric alcohol having one or not less than two hydroxyl groups in a molecule thereof; or (iii) a mixed organic solvent which contains the organic solvent (A) as between 50% and 94% by volume having the amide group, the low boiling point organic solvent (B) as between 5% and 49% by volume having the boiling point of between 20° C. and 100° C. at the normal pressure, and the organic solvent (C) as between 1% and 45% by volume having the boiling point of higher than 100° C. at the normal pressure and comprised of the alcohol and/or the polyhydric alcohol having the one or not less than the two hydroxyl groups in the molecule thereof.

公开(公告)号：US20090321689A1

公开(公告)日：2009-12-31

申请号：US12309739

申请日：2007-07-25

申请人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

发明人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

IPC分类号： H01B1/22 ,  C25B1/00 ,  C09D11/02 ,  C09D11/10 ,  C08L39/06 ,  C08F8/30 ,  C09D5/02 ,  C09D103/00 ,  C09D101/00 ,  C09D189/00

CPC分类号： B22F1/0022 ,  B01F17/0007 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  C01P2004/64 ,  C09C1/62 ,  C09C3/045 ,  C09C3/10 ,  C09D11/36 ,  C09D11/52 ,  H05K1/097 ,  Y10T428/252 ,  B22F2202/11

摘要： Disclosed is a method for producing a fine particle dispersion such as a dispersion of metal fine particles which is superior in dispersibility and storage stability. Specifically disclosed is a method for producing a fine particle dispersion wherein fine particles of a metal or the like, having a mean particle diameter of between 1 nm and 150 nm for primary particles, are dispersed in an organic solvent. This method for producing a fine particle dispersion is characterized by comprising the steps of: reducing a metal ion by liquid phase reduction in an aqueous solution wherein the metal ion and a polymer dispersing agent are dissolved, thereby forming a fine particle dispersion aqueous solution wherein fine particles having a mean particle diameter of between 1 nm and 150 nm for the primary particles and dispersed with being coated by the polymer dispersing agent (Process 1); adding an aggregation accelerator into the fine particle dispersion aqueous solution, the resulting solution is agitated for agglomerating or precipitating the fine particles, and then the agglomerated or precipitated fine particles are separated from the aqueous solution, thereby obtaining fine particles comprised of one type or not less than two types of a metal, an alloy and a metallic compound (Process 2); and re-dispersing the thus-obtained fine particles into an organic solvent or the like which contains an organic solvent (A) as between 25% and 70% by volume having an amide group, a low boiling point organic solvent (B) as between 5% and 25% by volume having a boiling point of between 20° C. and 100° C. at a normal pressure, and an organic solvent (C) as between 5% and 70% by volume having a boiling point of higher than 100° C. at a normal pressure and comprised of an alcohol and/or a polyhydric alcohol having one or not less than two hydroxyl groups in a molecule thereof (Process 3).

公开(公告)号：US08277693B2

公开(公告)日：2012-10-02

申请号：US12309739

申请日：2007-07-25

申请人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

发明人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

IPC分类号： H01B1/02 ,  H01B1/12

CPC分类号： B22F1/0022 ,  B01F17/0007 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  C01P2004/64 ,  C09C1/62 ,  C09C3/045 ,  C09C3/10 ,  C09D11/36 ,  C09D11/52 ,  H05K1/097 ,  Y10T428/252 ,  B22F2202/11

摘要： A method for producing a fine particle dispersion includes the steps of reducing a metal ion to form a fine particle dispersion aqueous solution; adding an aggregation accelerator into the fine particle dispersion aqueous solution so that agglomerated or precipitated fine particles are separated to obtain fine particles; and re-dispersing the fine particles into an organic solvent containing an organic solvent having an amide group, a low boiling point organic solvent having a boiling point between 20° C. and 100° C. at a normal pressure, and an organic solvent having a boiling point higher than 100° C. at a normal pressure and containing an alcohol and/or a polyhydric alcohol.

摘要翻译： 微粒分散体的制造方法包括：还原金属离子以形成微粒分散水溶液的步骤; 在细颗粒分散水溶液中加入聚集促进剂，使分散或沉淀的微粒分离，得到细颗粒; 并将细颗粒再分散到含有具有酰胺基的有机溶剂的有机溶剂中，在常压下具有沸点在20℃和100℃之间的低沸点有机溶剂，以及具有 在常压下高于100℃的沸点并含有醇和/或多元醇。

公开(公告)号：US08337726B2

公开(公告)日：2012-12-25

申请号：US12309738

申请日：2007-07-25

申请人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

发明人： Takuya Harada ,  Hidemichi Fujiwara ,  Kazuhiro Takashiba ,  Nobumitsu Yamanaka ,  Yusuke Yamada ,  Hideo Nishikubo ,  Takashi Unno

IPC分类号： H01B1/24 ,  H01B1/02

CPC分类号： C09D11/36 ,  B22F1/0022 ,  B22F2998/10 ,  B82Y30/00 ,  C01P2004/64 ,  C09C1/62 ,  C09C3/045 ,  C09C3/10 ,  C09D11/52 ,  H05K1/097 ,  B22F9/24 ,  B22F1/0062

摘要： In a fine particle dispersion, a fine particle (P) is dispersed in a mixed organic solvent. The fine particle (P) is formed of one type or not less than two types of a metal, an alloy, and/or a metallic compound, and has a mean particle diameter between 1 nm and 150 nm for primary particles thereof. Further, the fine particle (P) has a surface at least a part thereof coated with a polymer dispersing agent (D).

摘要翻译： 在细颗粒分散体中，将微粒（P）分散在混合有机溶剂中。 细颗粒（P）由一种或不少于两种类型的金属，合金和/或金属化合物形成，并且其一次颗粒的平均粒径为1nm至150nm。 此外，微粒（P）的至少一部分表面涂布有高分子分散剂（D）。

公开(公告)号：US10177079B2

公开(公告)日：2019-01-08

申请号：US13634079

申请日：2011-03-18

申请人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

发明人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

IPC分类号： H01L21/60 ,  H05K13/04 ,  H01L23/492 ,  H01L21/48 ,  H01L23/00

摘要： A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

公开(公告)号：US20130001775A1

公开(公告)日：2013-01-03

申请号：US13634079

申请日：2011-03-18

申请人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

发明人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

IPC分类号： H01L21/60 ,  H05K1/02 ,  H05K13/04 ,  H01L23/498

CPC分类号： H01L23/4924 ,  H01L21/4853 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13294 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13316 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13323 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1601 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2732 ,  H01L2224/2747 ,  H01L2224/29294 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/3201 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/81075 ,  H01L2224/81125 ,  H01L2224/81127 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/8184 ,  H01L2224/83075 ,  H01L2224/83125 ,  H01L2224/83127 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K2203/0338 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

摘要翻译： 一种形成在半导体的电极端子或电路板的电极端子的接合面上的导电连接构件，所述导电性连接构件包括多孔体，所述多孔体形成为含有具有平均值的金属微粒（P）的导电性糊料 一次粒径为10〜500nm的有机溶剂（S），或包含有机溶剂（S）和有机粘合剂（R）的金属微粒（P）和有机分散介质（D）的导电糊） 对于待接合的金属微粒（P）进行加热处理，多孔体由平均一次粒径为10〜500nm的接合金属微粒（P）形成，孔隙率为5〜35 体积％，平均孔径为1〜200nm。

公开(公告)号：US20090151998A1

公开(公告)日：2009-06-18

申请号：US12265004

申请日：2008-11-05

申请人： Hidemichi Fujiwara ,  Shunji Masumori ,  Yusuke Yamada ,  Hideo Nishikubo

发明人： Hidemichi Fujiwara ,  Shunji Masumori ,  Yusuke Yamada ,  Hideo Nishikubo

IPC分类号： H05K9/00 ,  H05K3/12

CPC分类号： H05K9/0096 ,  H01J2211/444 ,  H01J2211/446 ,  H05K1/0224 ,  H05K1/097 ,  H05K3/12 ,  H05K2201/09681 ,  H05K2203/0783 ,  H05K2203/1131

摘要： The electromagnetic wave shielding wiring circuit forming method of the present invention comprises the steps of: preparing a fine copper particle dispersion, by dispersing fine copper particles into a disperse medium (S) including an organic solvent (A) having an amide-based compound, an organic solvent (B) having a boiling point of 20° C. or higher at an ordinary pressure and having a donor number of 17 or more, an organic solvent (C) having a boiling point exceeding 100° C. at an ordinary pressure and comprising alcohol and/or polyhydric alcohol, and an organic solvent (E) having an amine-based compound, at specific ratios; coating or printing the fine copper particle dispersion onto a substrate, to form a wiring pattern comprising a liquid film of the fine copper particle dispersion; and firing the liquid film of the fine copper particle dispersion, to form a sintered wiring layer.

摘要翻译： 本发明的电磁波屏蔽布线电路形成方法包括以下步骤：通过将细铜颗粒分散到包含具有酰胺基化合物的有机溶剂（A）的分散介质（S）中，制备细铜颗粒分散体， 沸点为20℃以上，供给体数为17以上的有机溶剂（B），常压下的沸点超过100℃的有机溶剂（C） 并且包含醇和/或多元醇和具有胺类化合物的有机溶剂（E），其特定比例; 将细铜粒子分散体涂布或印刷到基板上，形成包含细铜粒分散液的液膜的布线图案; 烧成细铜粒子分散液的液膜，形成烧结布线层。