公开(公告)号：US20130001775A1

公开(公告)日：2013-01-03

申请号：US13634079

申请日：2011-03-18

申请人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

发明人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

IPC分类号： H01L21/60 ,  H05K1/02 ,  H05K13/04 ,  H01L23/498

CPC分类号： H01L23/4924 ,  H01L21/4853 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13294 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13316 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13323 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1601 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/2732 ,  H01L2224/2747 ,  H01L2224/29294 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/3201 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/81075 ,  H01L2224/81125 ,  H01L2224/81127 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/8184 ,  H01L2224/83075 ,  H01L2224/83125 ,  H01L2224/83127 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K2203/0338 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.

摘要翻译： 一种形成在半导体的电极端子或电路板的电极端子的接合面上的导电连接构件，所述导电性连接构件包括多孔体，所述多孔体形成为含有具有平均值的金属微粒（P）的导电性糊料 一次粒径为10〜500nm的有机溶剂（S），或包含有机溶剂（S）和有机粘合剂（R）的金属微粒（P）和有机分散介质（D）的导电糊） 对于待接合的金属微粒（P）进行加热处理，多孔体由平均一次粒径为10〜500nm的接合金属微粒（P）形成，孔隙率为5〜35 体积％，平均孔径为1〜200nm。

公开(公告)号：US20130001774A1

公开(公告)日：2013-01-03

申请号：US13634057

申请日：2011-03-18

申请人： Shunji Masumori ,  Toshiaki Asada ,  Hidemichi Fujiwara

发明人： Shunji Masumori ,  Toshiaki Asada ,  Hidemichi Fujiwara

IPC分类号： H01B1/02 ,  H01L23/485 ,  B82Y30/00

CPC分类号： B23K35/0244 ,  H01B1/22 ,  H01L21/4853 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05644 ,  H01L2224/1132 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32505 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/35121 ,  H05K3/3484 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150 nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 μm, mixing ratio of (P1/P2) being from 80 to 95 mass % for P1 and from 20 to 5 mass % for P2 (a total of mass % being 100 mass %); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass % for P and from 50 to 15 mass % for D (a total of mass % being 100 mass %).

摘要翻译： 为形成导电连接构件的材料提供导电膏，而不会发生不成比例的孔（间隙），粗糙的空隙和裂纹，这改善了热循环，并且具有优异的抗裂性和接合强度。 包含金属微粒（P）的金属微粒（P）的导电性糊料包含平均一次粒径为1〜150nm的选自金属及其合金中的一种或两种以上的金属微粒（P1）和金属微粒（P2） 与P1的平均一次粒径为1〜10μm的金属微粒（P1）相同的金属，P1的（P1 / P2）的混合比例为80〜95质量％，P2的混合比例为20〜5质量％ 质量百分比为100质量％）; 和含有有机溶剂（S）或有机溶剂（S）和有机粘合剂（B）的有机分散介质（D），金属微粒（P）和有机分散介质（D）的混合比（P / D） 对于P为50〜85质量％，D为50〜15质量％（质量％的总和为100质量％）。

公开(公告)号：US20090151998A1

公开(公告)日：2009-06-18

申请号：US12265004

申请日：2008-11-05

申请人： Hidemichi Fujiwara ,  Shunji Masumori ,  Yusuke Yamada ,  Hideo Nishikubo

发明人： Hidemichi Fujiwara ,  Shunji Masumori ,  Yusuke Yamada ,  Hideo Nishikubo

IPC分类号： H05K9/00 ,  H05K3/12

CPC分类号： H05K9/0096 ,  H01J2211/444 ,  H01J2211/446 ,  H05K1/0224 ,  H05K1/097 ,  H05K3/12 ,  H05K2201/09681 ,  H05K2203/0783 ,  H05K2203/1131

摘要： The electromagnetic wave shielding wiring circuit forming method of the present invention comprises the steps of: preparing a fine copper particle dispersion, by dispersing fine copper particles into a disperse medium (S) including an organic solvent (A) having an amide-based compound, an organic solvent (B) having a boiling point of 20° C. or higher at an ordinary pressure and having a donor number of 17 or more, an organic solvent (C) having a boiling point exceeding 100° C. at an ordinary pressure and comprising alcohol and/or polyhydric alcohol, and an organic solvent (E) having an amine-based compound, at specific ratios; coating or printing the fine copper particle dispersion onto a substrate, to form a wiring pattern comprising a liquid film of the fine copper particle dispersion; and firing the liquid film of the fine copper particle dispersion, to form a sintered wiring layer.

摘要翻译： 本发明的电磁波屏蔽布线电路形成方法包括以下步骤：通过将细铜颗粒分散到包含具有酰胺基化合物的有机溶剂（A）的分散介质（S）中，制备细铜颗粒分散体， 沸点为20℃以上，供给体数为17以上的有机溶剂（B），常压下的沸点超过100℃的有机溶剂（C） 并且包含醇和/或多元醇和具有胺类化合物的有机溶剂（E），其特定比例; 将细铜粒子分散体涂布或印刷到基板上，形成包含细铜粒分散液的液膜的布线图案; 烧成细铜粒子分散液的液膜，形成烧结布线层。

公开(公告)号：US10046418B2

公开(公告)日：2018-08-14

申请号：US13634057

申请日：2011-03-18

申请人： Shunji Masumori ,  Toshiaki Asada ,  Hidemichi Fujiwara

发明人： Shunji Masumori ,  Toshiaki Asada ,  Hidemichi Fujiwara

IPC分类号： H01B1/02 ,  H01L23/485 ,  B23K35/02 ,  H01L21/48 ,  H05K3/34 ,  H01B1/22 ,  H01L23/00

摘要： Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150 nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 μm, mixing ratio of (P1/P2) being from 80 to 95 mass % for P1 and from 20 to 5 mass % for P2 (a total of mass % being 100 mass %); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass % for P and from 50 to 15 mass % for D (a total of mass % being 100 mass %).

公开(公告)号：US10177079B2

公开(公告)日：2019-01-08

申请号：US13634079

申请日：2011-03-18

申请人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

发明人： Hideo Nishikubo ,  Shunji Masumori ,  Takuya Harada ,  Tomohiro Ishii ,  Hidemichi Fujiwara

IPC分类号： H01L21/60 ,  H05K13/04 ,  H01L23/492 ,  H01L21/48 ,  H01L23/00

摘要： A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume %, and mean pore diameter being from 1 to 200 nm.