公开(公告)号：US5157478A

公开(公告)日：1992-10-20

申请号：US810354

申请日：1991-12-18

申请人： Tetsuya Ueda ,  Haruo Shimamoto ,  Yasuhiro Teraoka ,  Hideya Yagoura ,  Hiroshi Seki

发明人： Tetsuya Ueda ,  Haruo Shimamoto ,  Yasuhiro Teraoka ,  Hideya Yagoura ,  Hiroshi Seki

IPC分类号： H01L21/56 ,  H01L23/16 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/16 ,  H01L23/4334 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/16152 ,  H01L2924/3511

摘要： A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.

摘要翻译： 封装半导体器件包括具有开口的绝缘膜，设置在绝缘膜的开口中并具有多个电极的半导体芯片，多个引线，每个引线的一端连接到相应的电极，多个引线为 支撑在绝缘膜上，与半导体芯片相对且间隔开的散热器，以及封装半导体芯片和散热器的一部分的树脂封装体，使散热器的外表面露出，并且多个第二端 的引线从封装向外延伸。

公开(公告)号：US5064706A

公开(公告)日：1991-11-12

申请号：US281401

申请日：1988-12-08

申请人： Tetsuya Ueda ,  Haruo Shimamoto ,  Hideya Yagoura ,  Hiroshi Seki ,  Yasuhiro Teraoka

发明人： Tetsuya Ueda ,  Haruo Shimamoto ,  Hideya Yagoura ,  Hiroshi Seki ,  Yasuhiro Teraoka

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/49524 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10S428/901 ,  Y10S428/906 ,  Y10T29/49121 ,  Y10T428/24273 ,  Y10T428/24298 ,  Y10T428/24322

摘要： A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.

摘要翻译： 载带包括具有用于接收半导体芯片的开口的膜，该半导体芯片由一对半模形成，并且形成在开口周围的外部引线孔;多个用于将半导体芯片安装在膜上的引线， 以及当所述半模被所述半模保持在所述半模之间的所述半模封闭时，与所述半模中的一个的分离面上形成的门形成一个树脂运行路径，从而形成从所述膜的一部分延伸的树脂行进路径， 在外部引线孔外面到开口，用于将熔融树脂引导到半模中，同时防止树脂进入外部引线孔。

公开(公告)号：US4839713A

公开(公告)日：1989-06-13

申请号：US156571

申请日：1988-02-17

申请人： Yasuhiro Teraoka ,  Tetsuya Ueda ,  Hideya Yagoura ,  Haruo Shimamoto ,  Shigeyuki Nango ,  Toshinobu Banjo ,  Hiroshi Seki

发明人： Yasuhiro Teraoka ,  Tetsuya Ueda ,  Hideya Yagoura ,  Haruo Shimamoto ,  Shigeyuki Nango ,  Toshinobu Banjo ,  Hiroshi Seki

IPC分类号： H01L23/057 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L23/057 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor. The electrical connection means may be an electrically conductive bonding material filled within a cavity defined by an opening in the flange of the metal cap, a through hole in the insulating material and a connecting pad of the lead conductor.

摘要翻译： 一种包装结构，包括具有底壁的金属盖，半导体芯片的底表面电气和机械连接到该底壁，从所述底壁延伸并围绕半导体芯片的侧壁，以及从所述侧壁向外延伸的凸缘， 平行于所述底壁，所述凸缘通过电绝缘材料在其上支撑引线导体。 电连接装置设置在金属帽凸缘和引线导体之间，用于在它们之间建立电连接。 电连接装置可以包括形成在金属帽的凸缘上的导电突起，延伸穿过绝缘材料中的凹口并电连接到引线导体。 电连接装置可以是填充在由金属盖的凸缘中的开口，绝缘材料中的通孔和引线导体的连接焊盘限定的空腔内的导电接合材料。

公开(公告)号：US5166099A

公开(公告)日：1992-11-24

申请号：US759912

申请日：1991-09-13

申请人： Tetsuya Ueda ,  Osami Nakagawa ,  Haruo Shimamoto ,  Yasuhiro Teraoka ,  Seiji Takemura

发明人： Tetsuya Ueda ,  Osami Nakagawa ,  Haruo Shimamoto ,  Yasuhiro Teraoka ,  Seiji Takemura

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/86 ,  H01L21/56 ,  H01L21/565 ,  H01L23/49572 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121

摘要： A manufacturing method for a semiconductor device in which an electrode of a semiconductor chip is electrically connected to an inner lead of a carrier tape. The electrodes of the semiconductor chip are brought into contact with the inner lead of the carrier tape. Bonding is performed with inner lead droop controlled to no more than 80 .mu.m.

摘要翻译： 一种半导体器件的制造方法，其中半导体芯片的电极电连接到载带的内引线。 使半导体芯片的电极与载带的内引线接触。 内部引线下垂控制在不超过80m的情况下进行接合。

公开(公告)号：US5309021A

公开(公告)日：1994-05-03

申请号：US961352

申请日：1992-10-15

申请人： Haruo Shimamoto ,  Jun Shibata ,  Toru Tachikawa ,  Tetsuya Ueda ,  Hiroshi Seki

发明人： Haruo Shimamoto ,  Jun Shibata ,  Toru Tachikawa ,  Tetsuya Ueda ,  Hiroshi Seki

IPC分类号： H01L21/60 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H01L39/02 ,  H01L23/58 ,  H01L23/12 ,  H01L23/48

CPC分类号： H01L23/49527 ,  H01L23/49517 ,  H05K3/341 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0263 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.

摘要翻译： 根据本发明的半导体器件具有减小电源线，接地线和信号线上的电感。 在本发明中，为了减小电源连接的长度和接地连接的长度，分别在半导体芯片的电源引线和半导体芯片的接地引线垂直地设置电源金属柱和接地金属柱 到线索 金属柱从封装芯片的树脂突出，并连接到印刷电路板上的焊盘或导电电路图案。 此外，提供通常连接电源或接地电位的平面导体。

公开(公告)号：US5359203A

公开(公告)日：1994-10-25

申请号：US70242

申请日：1993-06-02

申请人： Mitsuya Hashii ,  Haruo Shimamoto ,  Hideya Yagoura

发明人： Mitsuya Hashii ,  Haruo Shimamoto ,  Hideya Yagoura

IPC分类号： H05K3/34 ,  B23K26/03 ,  B23K26/04 ,  G01N21/88 ,  H05K13/08 ,  G01N21/86

CPC分类号： B23K26/032 ,  B23K26/04 ,  G01N21/88 ,  H05K13/08 ,  H05K3/3421 ,  H05K3/3494

摘要： A laser OLB apparatus includes an XY table; a bonding laser source for irradiating bonding parts between bonding lands of a substrate and leads of a semiconductor device located on the substrate thereby bonding the bonding parts; a recognition device for recognizing whether the leads of the semiconductor device are free of flexure and deviation; and a control unit for controlling the XY table and the laser source so that bonding is conducted only when the recognition device has recognized that the leads are free of flexure and deviation.

摘要翻译： 激光OLB装置包括XY台; 用于照射基板的接合台面和位于基板上的半导体器件的引线之间的接合部分的接合激光源，从而结合接合部分; 用于识别半导体器件的引线是否没有挠曲和偏差的识别装置; 以及用于控制XY工作台和激光源的控制单元，使得仅当识别装置已经认识到引线没有挠曲和偏移时才进行接合。

公开(公告)号：US4826068A

公开(公告)日：1989-05-02

申请号：US210083

申请日：1988-06-22

申请人： Hideya Yagoura ,  Haruo Shimamoto

发明人： Hideya Yagoura ,  Haruo Shimamoto

IPC分类号： H05K3/32 ,  H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04 ,  B23K1/20

CPC分类号： H01L24/50 ,  H01L24/32 ,  H01L24/86 ,  H05K13/0465 ,  H05K3/303 ,  H01L2224/4899 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10681 ,  H05K2201/2036 ,  H05K2203/0195 ,  H05K3/3421 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49135

摘要： A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bonding stage at horizontal locations thereof which are situated below the lead supporting portion of the tape carrier. Alternatively, the lead supporting means may take the form of a pair of horizontally extending rectangular columns which are retractably inserted into the above specified horizontal locations of the upper surface of the bonding stage. Thus, leads can be formed simultaneously with the outer lead bonding. The bonding stage may be divided into upper and lower stages, and the projections may be formed on the upper surface of the lower stage to extend through holes formed in the upper stage. This structure makes the projections retractable.

摘要翻译： 公开了一种用于实现外引线接合的接合装置，其包括接合台，一对接合工具和引线支撑装置。 引线支撑装置可以采取形成在接合台的上表面上的水平位置处的一对突起的形式，其位于带状物的引线支撑部分的下方。 或者，引线支撑装置可以采取一对水平延伸的矩形柱的形式，其可伸缩地插入到结合台的上表面的上述指定的水平位置中。 因此，可以与外引线接合同时形成引线。 接合台可以分为上段和下段，并且突起可以形成在下级的上表面上，以延伸通过形成在上段中的孔。 这种结构使得突起可伸缩。

公开(公告)号：US5412157A

公开(公告)日：1995-05-02

申请号：US91929

申请日：1993-07-16

申请人： Hideya Yagoura ,  Noriaki Higuchi ,  Haruo Shimamoto

发明人： Hideya Yagoura ,  Noriaki Higuchi ,  Haruo Shimamoto

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L23/495 ,  H05K1/18 ,  H05K3/34 ,  H01L23/02

CPC分类号： H01L21/4842 ,  H01L23/49558 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K3/3489 ,  Y02P70/613 ,  Y10T29/4922

摘要： A semiconductor device includes a molded resin encapsulating a semiconductor chip, outer leads extending from the molded resin and having free ends, and a resin layer connecting and supporting the outer leads along the entire length of the outer leads. The resin layer may have an activating ability for soldering. A method for manufacturing a semiconductor device includes preparing a semiconductor device having a molded resin and a plurality of outer lead portions extending from the molded resin and connected to a lead frame, forming a resin film on and between the outer lead portions; cutting the lead portions to provide cantilevered outer leads having free ends; lead-forming the outer leads with lead-forming dies while heating the resin film to form a resin layer connecting and supporting the outer leads along the entire lengths of the outer leads, and taking the semiconductor device out of the lead-forming dies after the resin layer has been cured.

摘要翻译： 半导体器件包括封装半导体芯片的模制树脂，从模制树脂延伸并具有自由端的外部引线以及沿外部引线的整个长度连接和支撑外部引线的树脂层。 树脂层可以具有用于焊接的活化能力。 一种制造半导体器件的方法包括制备具有模制树脂的半导体器件和从模制树脂延伸并连接到引线框架的多个外引线部分，在外引线部分之间和之间形成树脂膜; 切割引线部分以提供具有自由端的悬臂式外引线; 在加热树脂膜的同时对引线形成外引线，以形成沿着外引线的整个长度连接和支撑外引线的树脂层，并且将半导体器件从引线成形模具中取出 树脂层已经固化。

公开(公告)号：US4865193A

公开(公告)日：1989-09-12

申请号：US210086

申请日：1988-06-22

申请人： Haruo Shimamoto ,  Tetsuya Ueda

发明人： Haruo Shimamoto ,  Tetsuya Ueda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181

摘要： A tape carrier utilized in the tape automated bonding of semiconductor chips is disclosed which comprises a polyimide tape-shaped film having apertures therein, and patterns of leads and reinforcing members formed on a surface of the film. The reinforcing members may be made of the same material as the leads, such as copper, and formed by a single photoetching process on the film. The reinforcing members are disposed on those areas of the film which lie outside of the leads and which are subjected to stress during the sealing of the semiconductor chips into a resinous mold subsequent to the inner lead bonding thereof. For example, the reinforcing members may be disposed in the lead supporting zones of the film, or around the corners of the outer-lead apertures. The reinforcing members reduces the stresses exerted on the leads during the molding of the chips, so that the deformations thereof during the same process are minimized.

摘要翻译： 公开了一种用于半导体芯片的带自动接合的带载体，其包括其中具有孔的聚酰亚胺带状膜，以及形成在膜的表面上的引线和加强件的图案。 加强构件可以由诸如铜的引线相同的材料制成，并且通过在膜上的单次光刻工艺形成。 加强构件设置在位于引线外部的膜的那些区域上，并且在将半导体芯片密封到其内部引线接合之后的树脂模具中时受到应力。 例如，加强构件可以设置在膜的引线支撑区域中或者围绕外引线孔的角部。 加强构件减小了在芯片成型期间施加在引线上的应力，使得在相同工艺期间其变形最小化。

公开(公告)号：US6046071A

公开(公告)日：2000-04-04

申请号：US976603

申请日：1997-11-24

申请人： Akiyoshi Sawai ,  Haruo Shimamoto ,  Toru Tachikawa ,  Jun Shibata

发明人： Akiyoshi Sawai ,  Haruo Shimamoto ,  Toru Tachikawa ,  Jun Shibata

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/68 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/367 ,  H01L23/485 ,  H01L23/498 ,  H05K3/30 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17051 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/81207 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/1579 ,  H01L2924/181 ,  Y10T29/49169

摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

摘要翻译： 在半导体芯片的主表面上形成焊盘电极。 在半导体芯片的主表面上形成覆盖焊盘电极的表面部分的钝化膜。 在焊盘电极的表面部分上形成内部连接导体。 半导体芯片被仅暴露内部连接导体顶表面的模制树脂覆盖。 外部连接导体形成在内部连接导体的顶表面上。 外部连接导体具有基本平坦的顶表面。 因此，塑料成型半导体封装可以容易地安装在印刷电路板上，并且可以在印刷电路板上接合之后具有改进的可靠性。